Global Artificial Intelligence (AI) boom rise, face the huge potential application chip business, the chip maker has already gearing up to get into, driven by increasing competition, means that NVIDIA had, by its GP-GPU computing initiative in the data center market has made great progress is currently using GPU chip processing depth learning (DL) neural network applications has become a mainstream kind of AI,

According to Venture Beat reported that the site, which Intel (Intel) Data Center Jason Waxman, general manager-cum-vice president of corporate team issued a counter-attack, saying Xeon chip is the absolute leading products worldwide AI server market.

Waxman noted, Xeon server chip in the global AI market dominant position and share of the global chip market to support AI application server more than 97 percent market share, but only less than 3% of the AI ​​server device is the use of GPU, even if there has been a lot of outside We are talking about GPU machine learning (ML) values. NVIDIA is equal to the argument to make a comeback.

Waxman said the industry needs to break open and scalable computing power, in order to promote broad developer community innovation. Intel Developer Forum (IDF), the program also shows how the introduction of AI industry leading platform.

Intel had previously disclosed that its code-named “Knights Mill” next-generation Xeon Phi processors will be published in 2017, and locked in the AI ​​field. Intel Xeon Phi processor pointed computing power will be superior to the current GPU chip on the market, called Xeon Phi training faster than 2.3 times faster GPU, which NVIDIA has written rebuttal Intel, both sides of Taking exchange of fire intensified.

Prior to Intel to more than $ 350 million acquisition of Nervana Systems, thereby strengthening its own AI technology. With the visible chip market increasingly competitive industry are ways to strengthen its own technology is also increasing.

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Association of Semiconductor Equipment and Materials International (SEMI) released in July North American semiconductor equipment book to bill ratio (Book-to-Bill Ratio, B / B value) rose from June 1 to 1.05 and keep steady for eight months in a row 1 above.

SEMI pointed out that North American semiconductor equipment manufacturers three months July average order amount of $ 1.79 billion, compared with $ 1.71 billion in June increased by 4.7%, compared with $ 1.59 billion the same period last year, an increase of 13.1%.

Shipping parts, three average monthly amount of shipments in July was $ 1.71 billion, compared with $ 1.72 billion in June, a slight decrease of 0.6%, compared with $ 1.56 billion the same period last year increased by 9.6%.

Overall, the book to bill ratio is still greater than 1, the symbol of the semiconductor boom expansion, reflecting the global wafer foundry and memory speed up plant equipment investment.

SEMI also noted that the semiconductor equipment factory orders per month for three consecutive months the amount of over 1.7 billion US dollars, China and 3D NAND memory maker robust procurement, expected short-term momentum is expected to continue.

TSMC capital expenditure point of view ten billion US dollars this year, a new high, a semiconductor maker Intel, Samsung second half also accelerate the development of advanced process, expected the second half of the overall semiconductor capital spending is higher than the first half.

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According to the Nihon Keizai Shimbun (Nikkei) reported that Japan’s Renesas Electronics semiconductor plant (Renesas Electronics) is working with the U.S. analog power management IC industry Intersil (Intersil) final acquisition agreement.

It is reported that Renesas acquisition amounting to about 3,000 billion yen (about 30 billion US dollars), with the latest on the 19th NASDAQ stock show, Intersil worth over $ 2.1 billion calculation, the extra premium of 38% of the acquisition will be acquired, fastest It is expected to reach an agreement before the end of August.

Renesas merger Intersil menace

Nikkei pointed out that the annual market size of over 30 trillion yen in the global semiconductor market, because the smart phone demand slowdown, the relevant industry to seek a breakthrough, the research focus shifted to autopilot about 3 trillion yen per year scale, electronic engines and other automotive semiconductors market.

Renesas semiconductor technology itself can have a province in the field of automotive, automotive microcontrollers market share is highest in the world. But with electric vehicles, automatic drive research and development trend is a growing trend, with a car equipped with a gradual decline in demand for microcontrollers, coupled autopilot proud art sensors are not required for communication Renesas, so from a year ago from Renesas that is looking to acquire overseas companies and strengthen the relevant art production line.

Therefore, Renesas merger Intersil’s purposes, that is for automotive semiconductor market. Intersil power management semiconductor industry not only has a high market share, operating profit margin of about 20 to 29%, and Intersil in the automotive and industrial machinery, smart phones and other communications also hold the key semiconductor technology, ensure that the electronic circuit is maintained at a certain voltage, low power consumption and support functions.

Another advantage is that Intersil, whether small smart phone, large voltage industrial infrastructure industrial control requirements, Intersil Jieyou corresponding product. The future will be expanded to electric vehicles, fuel cell vehicles with power semiconductors.

In addition, Intersil customers throughout the United States, Europe, Asia and emerging markets, Renesas is expected amplified by the acquisition vehicle by the semiconductor production line as well as overseas markets.

Renesas depending acquisition Intersil as a new growth engine

Currently in the car with the semiconductor industry, with revenue calculations, the world’s largest 2015 acquisition of Freescale (Freescale) Dutch automotive chip maker NXP (NXP), followed by the British-2014 acquisition of International Rectifier Ling (Infineon), Renesas have in recent years due to the abolition of the cause of loss, turnover decreased by 40% in five years, which ranks third down. However, Renesas is expected after the completion of the acquisition sum, beyond Infineon consolidated revenue, ranking second in the world.

Renesas to complete the acquisition sum, shareholders will acquire all shares. The acquisition of funds for the existing Renesas 400 billion yen in cash, and the other to consider a bank loan. Renesas sum acquisitions is pushing for several years in layoffs, and after the entire utilities and other structural reforms, and it will be regarded as the cause of open by the merger will strengthen the existing areas of strength, an important engine for the development of the new page.

In particular, since the field of semiconductors for automotive technical standards and safety requirements are very strict, is not conducive to the development of the new Societe Generale, Renesas that the current in automotive semiconductor market still retain a high degree of competitive advantage.

Founded in 2010, Renesas, since 2011, the Great East Japan Earthquake find themselves in crisis, told Japanese officials and the public fund industry innovation institutions and Toyota Motor (Toyota Motors) and other funding until the 2014 fiscal year (2013/4 ~ 2014/4 ) is still the main structural reforms, finally waxing.

Since June the new president took office this time around Wu Jing in an interview with Japanese media said the response to the autopilot, electric cars have become popular in the field, Renesas Electronics will run in turn defense into offense, particularly as automotive semiconductors cutting-edge areas like research and development requires huge expenses, no longer to hold down operating costs for the center of gravity.

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As optimistic about MediaTek’s first 10 nanometer advanced process production X30 high-end mobile phone chips are expected to be next year in the first quarter production, the challenges of high-pass high-end mobile phone chip dominance, the recent foreign corporation secretly layout MediaTek shares, nearly a month cumulative buy 22000 stake jumped from 56-58%. Legal persons that third quarter revenue continued to record high in the fourth quarter off-season, next year with the launch of the new chip is expected to rebound in gross margin.

MediaTek as widely expected quarter operating revenues with innovative high in July consolidated revenues of 24.819 billion yuan to maintain a high standard of performance, a record second highest on record, the three products are seeing seasonal demand, in addition to high-end smart phone series helio sustained heavy volume emerging market demand rose, the third quarter of the previous quarter continued tight capacity is still not fully meet the market demand, expected third-quarter revenue showed double-digit growth in the second half than the first half, raising the annual growth rate of annual revenue to 25%.

Recent continue to buy foreign corporate MediaTek in addition to steady operation this season, mainly optimistic about the first quarter of next year to announce the latest Helio X30 processors, advanced mining TSMC 10 nm process, according to analysis of foreign websites, the ten core chip architecture, with two sets of the latest 2.8 GHz ARM Cortex A73 core, added four 2.2GHz Cortex A53 and four 2.0GHz Cortex A53, comprising 10 core division, three carrier aggregation technology to support LTE Cat.10 Cat.12, excellent overall performance, performance will surpass Apple A11 even beyond the Qualcomm S830.

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According to domestic sources, said Samsung is testing its next-generation mobile processor Exynos8995, 10-nanometer FinFET process, the maximum speed can reach 4GHz, Xiaolong 830 the same power consumption and rumors among the high-pass, allegedly Qualcomm Xiaolong 830 Processing maximum operating frequency is only 3.6GHz. In other words, the next Samsung Exynos chip or to provide a great power efficiency.

Samsung is expected next year GalaxyS8 smart phone may be the first use Exynos8995 processors. However, for now, the move to 10nm manufacturing process, is still very difficult. Intel originally planned to make the switch this year, but the plan has been delayed, and launched a stopgap product, show 10nm process is more difficult than expected. The same thing may occur in the mobile chip industry. So 10nm processor is absolutely impossible to become next year’s flagship product.

Second, the industry has just shipped and use of 14nm chips, Qualcomm Snapdragon 820 and 821 processors are the first products of this process, in theory, there is room for improvement, it is unlikely that the rapid introduction of next-generation manufacturing process The product.

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US Bureau of Labor Statistics released August 5, July 2016 cum semiconductor electronic components manufacturing employment month by 2,800 to 35.92 million, the lowest on record since statistics began in 1985.

Statistical data well-known human resources agency Challenger, Gray & Christmas, Inc August 4 released in 2016 from January to July the US computer company declared layoffs Heda 49,464 people, 94 per cent increase compared with the same period in 2015, including 7 month 9,875 people.

US June retail sales of electronics and home appliances reduced by 4.7%, the biggest drop since December 2015, the ninth consecutive month below the level a year earlier, the highest since August 2008 to February 2010 the longest downturn level .

Global hard drive maker Seagate (Seagate Technology plc) July 11 announced organizational restructuring plan announced June 29 (note: it was announced the layoff of 1,600 people) after, before the end of the fiscal year 2017 the world will lay off about 6,500 people, equivalent to 14% of the total number of employees.

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August 3, 2016, the world’s leading high-performance sensor and analog solutions provider, announced the sale of its semiconductor Ams NFC and RFID readers IP, technology and product line to STMicroelectronics, turnover of US $ 79.3 million in cash (about 71.5 million euros) as well as on future profitability and results of operations of up to $ 37 million payment. Through this transaction, Ams semiconductor sensor solutions to become the global leading provider of the road further. Ams semiconductor sensors will retain its related NFC / RFID tag business and related design expertise to create a wireless sensor networking solutions and support the development of new sensors coming.

The transaction is Ams semiconductor sensor solutions to achieve its an important part of the program strategy, the company is actively trying to manage its existing technology and products in order to achieve this goal. Han Gaiaimaisi transactional content including NFC semiconductor front-end and antenna amplification solutions including NFC product line and integrated HF / UHF RFID reader product line. Related design and marketing resources are mainly located in Austria Premstaetten, Ljubljana, Slovenia, includes about 50 employees will join STMicroelectronics. Ams semiconductors will retain its NFC / RFID wireless tag business and related intellectual property rights, and plans to combine NFC and RFID with sensor connection interface for the wireless sensor networking applications to create solutions.

Because does not need the approval of regulatory authorities, the transaction is expected to be completed today. Ams Semiconductor will split with the transaction and related business product line since August 1, 2016.

Ams Semiconductor CEO Alexander Everke said: “peel RFID / NFC part of the product line will streamline our sensor solutions for the core product and technology portfolio, while maximizing the value of our high-performance wireless IP We are committed to active management. our technology, focusing on promoting opportunities for sensor solutions related program strategy development. the transaction has strategic significance, will become the world’s leading provider of semiconductor Ams all major end markets sensor solutions. ”

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