Recently, Intel CEO Brian Krzanich revealed in his speech that Intel has delivered the first 49 quantum bit quantum computing test chip to research partner QuTech.

Earlier in October 2017, Intel announced the development of a new 17-quantum-dot superconducting chip that will be handed over to QuTech, a partner of the Dutch Quantum Computing and Quantum Internet Research Center. This is an important step in quantum computing from the laboratory to actual production. fz1200r12kf5

The so-called quantum computing, refers to make full use of some basic physics, superposition and entanglement of computing technology. Unlike transistor-based digital computers that require data to be encoded as binary digits (bits), quantum computers use quantum bits for their calculations. These qubits can exist in multiple states at the same time, making it possible to do a lot of calculations in parallel, which speeds up parsing time. Essentially, quantum computing uses extreme parallelism to solve computational problems and is the ultimate goal of parallel computing. cm75ye13-12f

Brian Krzanich said quantum computing is expected to solve the problems that are almost impossible to overcome today. For example, quantum computers can mimic nature in order to advance chemistry, materials science, and molecular modeling research such as creating a new catalyst to isolate carbon dioxide, developing room temperature superconductors, or discovering new drugs. Quantum computing has the potential to enhance the capabilities of future high-performance computers. bsm150gt120dn2

China and the United States are the two major countries in the world that have made major breakthroughs in quantum computing. In August 2016, a research team at China University of Technology developed a superlattice system and a supercooled atomic microscope with a resolution of only 1 micron. Through them, about 600 pairs of supercooled atoms Bit, has taken an important step in quantum computing. May 3, 2017, Chinese Academy of Sciences Institute of Quantum Information and Quantum Technology Innovation officially announced that the world’s first quantum computer beyond the early classical computer was born in China. There are three types of quantum computers that are the fastest growing in the world: light quantum computers, ultra-cold atomic quantum computers and superconducting quantum computers. Chinese scientists released May 3 quantum computer results include two, respectively, belong to the light quantum computer and superconducting quantum computer category.

Taiwan website yesterday quoted industry sources, MediaTek will return to the high-end mobile processor market in the second half of this year, which once again challenged Qualcomm.

Reported that, in order to meet the arrival of the 5G era, MediaTek earliest will return to the high-end mobile processor market in the second half of 2018, once again launched Helio X flagship smartphone chipset. The first half of this year, MediaTek will continue to Helio P series of mid-range products. igcm15f60ga

These industry sources said MediaTek has at least developed three new generation of smart phone chips, will be used TSMC’s 7-nanometer process.

MediaTek’s customers include OPPO, vivo, Sony, LG and other emerging markets smart phone brands, these companies are currently developing new smart phone products to meet the arrival of the era of 5G communications.

To this end, MediaTek also has been actively developing based on artificial intelligence (AI) technology chip solutions. These industry sources said that MediaTek is expected to return to the high-end smartphone chip market in 2018 or 2019.

Last year, MediaTek introduced the Helio X10, X20 and X30 smartphone chip solutions for the high-end smartphone market. Although MediaTek’s technology is mature and they are more cost-effective than competitor Qualcomm products, the three Helio X series have not won the customer’s support. ixxn110n65c4h1

Some industry observers believe that there are two main reasons why MediaTek’s Helio X series failed to win the customer’s support: one is facing the challenge of Qualcomm; the other is that first-tier smart phone manufacturers such as Apple, Samsung, Huawei and Xiaomi are all autonomous Research and development of smart phone chipsets.

This situation forced MediaTek to halt the production of Helio X-series chipsets and halt the investment in the second half of last year to prevent any further decline in the gross margin of the mobile chip business.

There have been reports before, MediaTek to return to the high-end smart phone chip market, at least 2 years. It now appears that MediaTek back to the high-end market schedule earlier than expected.

Today, Intel announced the Intel Stratix 10 MX FPGA, the industry’s first field-programmable gate array (FPGA) with integrated high-bandwidth memory DRAM (HBM2). By integrating HBM2, Intel Stratix 10 MX FPGAs provide up to 10 times the memory bandwidth of a standalone DDR memory solution. With its powerful bandwidth capabilities, Intel Stratix 10 MX FPGAs can be used as basic multifunction accelerators for high performance computing (HPC), data center, network function virtualization (NFV) and broadcast applications that require hardware accelerators to promote large-scale data movement and Flow Data Pipeline Frame Speed. xc3s200-4tqg144c

In HPC environments, the ability to compress and decompress data before and after mass data movement is critical. HBM2-integrated FPGAs compress and accelerate larger data movements than stand-alone FPGAs. In high performance data analytics (HPDA) environments, streaming data pipeline frameworks such as Apache * Kafka and Apache * Spark Streaming require real-time hardware acceleration. The Intel Stratix 10 MX FPGA can read / write data and encrypt / decrypt data (in real time) at the same time without adding to the host CPU resources.

Reynette Au, vice president of marketing for Programmable Solutions at Intel, said: “To efficiently accelerate these workloads, we need to ensure that memory bandwidth is in sync with the data surge.We designed the Intel Stratix 10 MX Series to provide the HPC and HPDA markets with FPGA-based New multi-function data accelerator. ” xc2v1000-5fg456c

With integrated HBM2, the Intel Stratix 10 MX FPGA family offers up to 512 GB / second of memory bandwidth. HBM2 vertically stacks the DRAM layer using through-silicon (TSV) technology. These DRAM layers are stacked on a base layer and the high-density microbumps are used to connect the base layer to the FPGA. The Intel Stratix 10 MX FPGA family leverages Intel Embedded Multi-Chip Interconnect Bridging (EMIB) to provide high-speed communication between FPGA logic and DRAM. EMIB is used to integrate the HBM2 with a high-performance monolithic FPGA fabric to address memory bandwidth bottlenecks with excellent energy efficiency.

Intel is shipping several models of the Intel Stratix 10 FPGA family, including the Intel Stratix 10 GX FPGA with 28G Transceiver and the Intel Stratix 10 SX FPGA with an Embedded Quad Core ARM Processor. The Intel Stratix 10 FPGA family incorporates Intel’s 14-nanometer FinFET process and state-of-the-art packaging technology, including EMIB.

Silicon Labs (also known as “core technology”) has introduced a series of high-performance I2C programmable crystal oscillator (XO), with the best jitter performance and frequency flexibility. With typical jitter performance down to 95fs, the Si544 / Si549 Ultra Series ™ Programmable XOs provide maximum jitter margin for high-speed 28Gbps and 56Gbps transceivers in 100/200 / 400G communications and data center applications. These XOs can generate any frequency from 200kHz to 1.5GHz and have a 4ppt tuning resolution, making the single device suitable for a wide range of applications. xc2c512-10pqg208c

James Wilson, Sr. Director of Marketing for Clock Products at Silicon Labs, said: “The proliferation of optical networks, very large data centers and mobile forward / backhaul networks is accelerating, adding the need for ultra-low jitter clocking solutions. By choosing Silicon Labs The I2C configurable Si54x Ultra Series Oscillator allows system designers to easily use the industry’s most programmable, programmable XOs with maximum frequency flexibility and maximizes SNR margin to reduce development risk and ensure a successful design. ”

The Si544 / Si549 XO supports up to four preset, pin-selectable start-up frequencies. After power-up, the device operating frequency can also be easily changed via the I2C interface. The flexibility of this configuration allows a single oscillator to replace multiple single-frequency, dual-band or quad-band XO and mux devices. The devices can be powered from a single 1.8, 2.5 or 3.3V supply, eliminating the need to use different XO models for different supply voltages. The I2C interface of the Si54x XO supports up to 1MHz (Fast-mode Plus) update rates and is fully compatible with a wide range of ASSPs, ASICs, SoCs, and FPGAs. zhcs506ta

The Si544 / Si549 XOs support 3.2mm x 5mm and 5mm x 7mm packages, offering superior frequency flexibility over the standard fixed frequency XO in the same package. This compatibility enables hardware designers to prototype with I2C programmable XO and easily migrate to single-frequency XO as the design transitions to production.

The Si54x XO is designed for 56Gbps transceivers. These transceiver designs rely on Pulse Amplitude Modulation (PAM4) signals for serial data transmission. PAM4 uses fourth-order signals to increase the bit rate for each channel while keeping the bandwidth constant. This trade-off makes the design inherently more susceptible to noise and maximizes the signal-to-noise margin (SNR) margin by using ultralow jitter reference clocks such as Si544 / Si549 devices to help prevent bit errors and preserve Signal integrity.

The Si544 / Si549 oscillator utilizes Silicon Labs’ advanced 4th generation DSPLL® technology to provide an ultra-low jitter clock source at any output frequency. The devices are programmable to any frequency from 200kHz to 1.5GHz with a resolution of 4ppt. On-chip power regulation Provides power supply noise rejection for consistent, reliable low-jitter operation in noisy environments common to high-speed networks and data centers. The Si544 / Si549 XOs also provide a flexible, reliable alternative to oscillators based on low-jitter surface acoustic wave (SAW) while providing excellent frequency tolerance and temperature stability. The Si544 / Si549 oscillator supports all popular output formats including LVDS, LVPECL, HCSL, CML, CMOS and Dual CMOS.

In addition to the Si544 / Si549 family of products, Silicon Labs is also expanding its XO / VCXO product family to include a wider range of package options. These amplified products include the Si54x Ultra Series XO, Si59x Universal XO / VCXO (3.2mm x 5mm), and Si51x Universal XO / VCXO (2.5mm x 3.2mm) in an industry standard 5mm x 7mm package. By expanding its product line-up, Silicon Labs can offer its customers a one-stop shop for high-performance oscillators.

–XMOS, Inc., a leading provider of advanced embedded voice and audio solutions for the consumer electronics market, today announced the XVF3500 voice processor supporting stereo AEC and the world’s first stereo AEC far-field linear microphone array solution – VocalFusion Stereo Evaluation Kit (XK-VF3500-L33).

The XVF3500 voice processor offers 2 channels of full duplex acoustic echo cancellation (AEC). Designed for developers working in a growing market such as voice-based smart TVs, sound bar, set-top boxes and digital media adapters – all of these markets require stereo AECs to support “entire room” Voice interface solution.

Uniquely, the solution also supports configurable AEC delays that allow the AEC reference signal to be accurately calibrated and delay adjusted to provide far-field voice after-sales accessories for existing consumer electronics.

Commenting on the release of this product, Mark Lippett, President and CEO of XMOS, said: “The device and evaluation kit will further advance the integration of embedded voice-control devices on the edge of our room, especially those for high-quality music and TV control And we look forward to demonstrating this solution at the Consumer Electronics Show (CES) in Las Vegas next month.We have the most comprehensive portfolio of far-field pick-up solutions yet to be released Consolidated this position. ”

Like all other XMOS voice solutions, the solution accurately captures commands from anywhere in the room, even in complex acoustical environments, for processing with cloud-based speech recognition systems. The XVF3500 voice processor provides sophisticated voice digital signal processing (DSP) – including a full-duplex acoustic echo canceller (AEC) with voice interrupt capability that enables users to interrupt or pause a device that is playing music – and Adaptive beamformer, which can track the speaker. In addition, it provides advanced dereverberation, automatic gain control and noise suppression – providing a clear voice interaction experience even in noisy environments.

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The memory industry is in a phase of strong growth. Yole predicts in its 2017 Memory Packaging Market and Technology report that the total memory market will grow at a CAGR of about 9% between 2016 and 2022, to reach US $ 135 billion by 2022 and to make up about 95% of DRAM and NAND market share %. In addition, the imbalance between supply and demand is driving up the price of memory semiconductor chips, resulting in a record profit for memory IDM vendors!

The demand for memory comes from all walks of life, especially in the mobile and computing (mostly server) markets. On average, each smartphone’s DRAM memory capacity will more than tripling and is expected to reach around 6GB by 2022, with each smartphone’s NAND memory capacity more than doubling and projected to reach 150GB by 2022 . For servers, it is expected that by 2022 DRAM memory capacity will reach more than 0.5TB, enterprise-level market NAND NAND memory capacity of SSD will be up to 5TB or more. The growth drivers for these markets come from deep learning, data centers, networks, AR / VR and autopilot.

DRAM and NAND capacity requirements for smartphones and servers

The automotive market, which typically uses low-megabyte memory, will see DRAM memory dominated by autonomous driving and car infotainment. In addition, the NOR flash memory market is recovering and is expected to grow at an astonishing 16% CAGR. It is estimated that it will reach 4.4 billion U.S. dollars in 2022, mainly due to new developments such as AMOLED displays, touch display driver ICs and industrial Internet of Things Application of the field.

On the supply side, there is a shortage of DRAM and NAND memory supplies due to vendor consolidation and technical challenges that make advanced nodes harder to implement and require significant investments in moving from 2D to 3D NAND. DRAM makers want to maintain high product prices and profitability in order to rationalize their huge capital expenditures in advanced node migration, and therefore tend not to increase production capacity.

Memory chips use a variety of packaging technologies, from leadframes to through-silicon vias (TSVs)

There are a variety of packaging options for memory chips, ranging from pin-count, small outline SOPs to pin-count TSVs, and the choice of these technologies depends on density, performance, and Cost and other product requirements. Yole analysis identified five core memory chip packaging platforms: leadframe, wire-bond BGA, flip-chip BGA, wafer level chip scale package (WLCSP), TSV. Each technique includes many different variations and different terminology. We expect CAGR of the entire memory chip packaging market to grow from 4.6% in 2016-2022 to more than 25 billion in 2022.

The type of memory chip package

In 2016, wire-bonded BGA accounted for more than 80% of the memory chip package market share. Also in 2016, the flip-chip BGA has started to enter the DRAM memory chip package market and is expected to grow at a CAGR of 20% in the next five years, accounting for about 10% of the market for the entire memory chip package market. With the promotion of high bandwidth demand, the application of DRAM PC / server field is increasing day by day, has promoted the flip-chip market growth. Samsung has converted more than 90% of its DRAM chip packages into flip-chips and SK hynix has also begun to transition, and other vendors will gradually adopt flip-chips in the future. In fact, we believe that all DDR5 memory used for PC / server will eventually use flip chip.

Through silicon (TSV) is being used in high-bandwidth memory chips due to the high latency of high bandwidth and memory chips for high performance computing in a variety of applications. The TSV market will account for less than 1% of the memory chip packaging market in 2016, but with a CAGR of over 30% over the next five years. It is expected that TSV market share will reach 2022 8%. Meanwhile, the wafer-level chip scale package (WLCSP) will be adopted by NOR flash memory and niche market memories (EEPROMs / EPROM / ROM) and is expected to grow at a CAGR of over 10%. However, by 2022, wafer- Packaging (WLCSP) market share of less than 1%.

For mobile applications, memory chip packaging will primarily be held on wire-bonded BGA platforms, however, and will soon begin to move toward multi-chip packaging (ePoP) for high-end smartphones. The main requirement of NAND flash memory chips is low cost and high storage density. NAND uses a wire bond stack to provide high density in a single package.

NAND flash chip packages will remain in wire-bonded BGA form and will not migrate to flip-chip. However, Toshiba will begin using silicon vias (TSVs) in NAND flash memory chips to increase the data transfer rates for high-end applications. After Toshiba, we believe Samsung Electronics and SK hynix will introduce silicon-on-a-chip (TSV) packaged NAND chips.

The value of memory chip package is high, mainly by IDM “control”

The market size of memory chip packaging in 2016 is about 20 billion U.S. dollars. While many outsourced semiconductor package test vendors (OSATs) are involved in the memory chip packaging business, more than 80% of the packages are still in-house by memory chip IDM vendors. The world’s leading IDM vendors have a wealth of knowledge in packaging, have accumulated years of project experience, and have a strong internal manufacturing capacity.

2016 ~ 2022 memory chip packaging market

OSAT vendors are affected by IDM vendors and have limited opportunity to package their business in memory chips. However, many Chinese companies are investing more than 50 billion U.S. dollars into the field of memory. Unlike the world’s leading IDM vendors, emerging Chinese vendors lack experience in memory chip packaging and will outsource their packaging operations to OSAT vendors.

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Melexis, a global leader in microelectronics, today announced the launch of a new line of miniature far-infrared (FIR) sensors for a variety of applications requiring accurate temperature measurements. The MLX90632 series is based on Melexis’ proven FIR technology – using the principle that each object emits thermal radiation. The very small, integrated thermopile CMOS IC is a complete solution in a 3x3x1mmQFN package that includes sensor components, signal processing, digital interfaces and optics for quick and easy integration into a variety of modern applications. The high-precision device provides high levels of thermal stability when subjected to thermal gradients and rapid temperature changes, resolving the well-known weakness of existing infrared sensors. In addition, it offers surface-mount (SMD) packages that are compatible with standard PCB assembly techniques. The first civilian grade product in the MLX90632 family is now available. Subsequent MLX90632 products will target very demanding applications such as medical care.

Smart device manufacturers can differentiate their products with precise temperature measurements. Melexis integrates optical lenses into this product to reduce field of view (FOV), thereby enabling higher working distances and more accurate measurement accuracy. The MLX90632 can be used in any application where the temperature must be accurately measured, especially in thermally dynamic environments and in applications where space is limited. Potential applications therefore include indoor and outdoor temperature monitoring of white and black appliances, smart thermostats, server rooms, or integrated into portable electronic devices such as tablets and smartphones. Joris Roels, Melexis Temperature Sensor Marketing Manager commented: “Melexis now ships millions of infrared temperature sensors based on our world-class expertise that represents the An important milestone, the MLX90632 will be a disruptive sensor technology in many applications, enabling leading manufacturers to differentiate their applications and meet the needs of current and future end customers. ”

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Beijing on the 17th Yonhap reported that South Korea’s semiconductor venture capital firm eWBM said on the 16th, the company will work with Northeastern University Technology Industry Group Co., Ltd., North Smart Equipment Co., Ltd., set up offices in Shenyang City, Liaoning Province, the preparation of the establishment of South Korea cooperative semiconductor Joint venture.

The three parties have agreed that China Unicom will introduce eWBM’s FIDO (Fast Online Identity) Universal Authentication Framework dongle for demonstrating the safety certification of local enterprises in Shenyang. The office is provided by North Smart, and eWBM is responsible for dispatching technicians to Shenyang to build a new certification system.

EWBM said that by setting up an office in Shenyang to lay the foundations for developing and marketing smart chips in South Korea with high-tech semiconductor technology in Korea, it will actively develop the Internet of Things security market nationwide in China.

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In response to the fast-growing Internet of Things application market, Intel announced the introduction of the Intel Cyclone 10 Programmable Logic Gate Arrays (FPGAs) family of products, using TSMC’s advanced manufacturing process. The FPGA is designed to provide fast, power-saving processing power, and can be applied to include automotive, industrial automation, professional audio and video systems and other applications.

As the various “objects” are getting more and more connected, and can share a lot of real-time data with each other, the data becomes less and less difficult to deal with. Data transmission from buildings, factories, homes, and vehicles for various sensors and cameras continues to increase, so microprocessors and microcontrollers (MCUs) are no longer able to handle them. pps272

High-performance devices such as Intel FPGAs can collect and send data and make immediate decisions based on the input content of the Internet of Things devices. And FPGA can also be with the needs of different things networking applications, to provide specific computing power and a variety of functions. Different Cyclone 10 FPGAs (including Cyclone 10 GX and Cyclone 10 LP) have their unique functionality to meet the needs of different design teams.

Unlike other low-cost FPGAs, Cyclone 10 GX supports 10G transceivers and hardware floating-point DSPs (digital signal processing), Intel said. In addition to performance than the previous generation Cyclone 2 times higher than the adoption of IEEE 754 single precision, hardware floating-point DSP module of this innovative architecture, making its processing speed of up to 134 GFLOP (1 billion floating-point operations per second). It is very important for engineers who need to use FPGAs to achieve higher performance to respond to applications such as mobile or motor control systems. lm2936mp-5.0/nopb

Cyclone 10 GX target market is a number of applications that have critical requirements for high I / O performance and core speed and can be used in industrial machine vision and intelligent city applications for parking, road and bridge monitoring. In addition, Cyclone 10 GX is also very suitable for supporting video streaming applications such as professional audio and video technology.

In addition, the use of Cyclone 10 GX such FPGA, can help operators to significantly reduce the overall product cost of the entire product line. For example, operators can use Cyclone GX to integrate industrial networking and functional security into a single chip to reduce the cost of bill of materials.

According to foreign reports, sources said the US mobile chip maker Qualcomm on Tuesday night to the Seoul Central District Court proceedings, requiring the court to terminate the South Korean antitrust authorities Fair Trade Commission (FTC) made an unfair ruling late last year.

Wednesday is also the South Korean Fair Trade Commission had set a statutory deadline. In the Commission to send Qualcomm to improve the official documents at the same time, has provided Qualcomm 30 days to decide whether to appeal. pps272

At the end of December last year, the Fair Trade Commission imposed a 1.03 trillion won ($ 854 million) antitrust fine on Qualcomm, setting the highest penalty for Korean antitrust history. The committee said at the time that Qualcomm’s dominance in the mobile chip market forced South Korea’s mobile phone manufacturers to pay some unnecessary royalties. And also rejects or restricts the use of its standard patented technology to competitors in the field of chip manufacturing (such as Samsung Electronics), hampering fair competition. It was alleged that the Commission had received complaints from industry companies in 2014 and launched an antitrust investigation of Qualcomm.

The Fair Trade Commission requires QUALCOMM to correct its business practices and to consult with the chip maker’s counterparts on patent licensing issues in real terms, without making unfair requests, such as limiting which authorized customers can sell chips to potential customers. In addition, Qualcomm was also canceled in the mobile phone manufacturers signed with the modem chip sales agreement on some should not charge the patent too much of the request. If the mobile phone manufacturers to re-negotiate on the terms of the contract, Qualcomm must agree. lm2936mp-5.0/nopb

Qualcomm denied the allegations and said it would apply for a moratorium on the rectification order of the Fair Trade Commission and appeal to the Seoul High Court in respect of the decision. Qualcomm also expressed serious disagreement with the decision announced by the Fair Trade Commission that the decision violated the facts and laws and violated the rights set forth by the Korea-US Free Trade Agreement (KORUS).

Samsung Group, the actual controller of the last week because of allegedly to the South Korean President Pu Gui Hui girlfriend bribes were arrested, he was charged with the government in exchange for its inheritance. The prosecution is also investigating the impact of Samsung Group on the Korea Fair Trade Commission, and in January last year, just retired as vice chairman of the agency Kim Hak-hyun to inquire. Don Rosenberg, General Counselor of Qualcomm, said on Monday that “this erroneous decision stems from an unfair process, which we believe has been a significant impact on business interests.” The recent survey of the Samsung Group and the Fair Trade Commission The report of the former president ‘s relationship raises our high concern that the vice – chairman is in charge of our case.

Samsung Electronics and LG Electronics each year to be paid to Qualcomm 1.5 trillion won royalties. South Korea’s Fair Trade Commission ruling results, is conducive to Korean companies to reduce the royalties paid to Qualcomm.

Up to now, Qualcomm Korea has not commented on this report. “Qualcomm’s dispute with the Korea Fair Trade Commission will focus on whether Qualcomm will pay patent fees unfairly to Korean manufacturers and whether the fair trade committee’s fines are accurate,” the source said.