Recently, the programmable chip Barefoot Networks has just completed its third round of financing, a total of 20 million US dollars financing. It is worth mentioning that, from China’s Internet companies Alibaba and Tencent participated in this round of financing.

Barefoot Networks has developed the world’s first programmable chip, called Tofino, which is twice as fast as any other chip on the market today, handling network packets at 6.5 Mbps. This programmable chip is a revolutionary new innovation, it will change the Google, Facebook and other Internet companies within the operation will also affect the telecom operators, Cisco, Intel and other hardware giants will feel the pressure. In Barefoot Networks on a round of financing, Google has become an important participant.

Barefoot Networks said that many top manufacturers are actively looking forward to get the chip, is expected in the next few weeks to provide customers with this chip.

So, what is the magic of this programmable chip?

The chip will be built into the network switches, hardware devices, the latter two in the Internet command traffic play a fundamental role. Switching data between thousands of computers, operated by application manufacturers such as Google and Facebook, and by wireless providers such as AT & T, Barefoot Networks chips will change these devices in a significant way. The biggest difference is that anyone can program on this chip. In other words, they can write software that changes the functionality of this chip, just as anyone can write an application that changes the functionality of the iPhone.

China’s Internet company is growing rapidly, the demand for data centers is also very strong. Tencent and Alibaba in Barefoot Networks investment, reflects the Chinese Internet company’s strategic vision.

Tektronix has announced a new DisplayPort Type-C emitter test solution that significantly reduces compatibility testing time compared to previous Tektronix DisplayPort solutions and other competitor solutions.

The highly optimized solution, combined with Tektronix high-performance oscilloscopes, allows engineers to complete a full range of DisplayPort Type C compatibility tests in less than six hours, based on field assessments of actual environments, while competing products require up to 16 hours to complete, the new solution has a remarkable outstanding execution speed. wire strippers

One of the biggest challenges for DisplayPort compatibility testing is the extremely long testing time, which the engineer has to spend a lot of time before monitoring the test setup in progress. In addition, the need to integrate DisplayPort Type-C test, the test is supported as the USB 3.1 specification under the alternative mode.

In addition to fully automated programs and reduced test times, the new version of the Tektronix DisplayPort test solution incorporates support for Type-C specifications, including automatic test setups and timer windows to assist users in performing manual tests . cr2025

Tektronix general manager of high-performance oscilloscope BrianReich said, according to plans and budgets to the new design to market engineers, saving testing and measurement of time, may be an important factor in their ultimate success. With this solution, we allow our customers to handle the issues in the DisplayPort design that day. They can now easily start execution by simply selecting the test they want, and can handle other tasks while the test is executing.

Microchip Technology Inc., a leading provider of integrated microcontroller, mixed-signal, analog and flash memory solutions, today expanded its family of 32-bit PIC32MZ EF Microcontrollers (MCUs) by adding support extensions Temperature range of products and support industrial-grade temperature range of high-speed (250 MHz) products. The new device is Microchip’s first automotive-grade PIC32 MCU family.

The PIC32MZ EF family of new devices features a high-performance core up to 250MHz, an integrated floating-point unit (FPU), a rich set of peripherals, and a variety of connectivity options including Controller Area Network (CAN). The new product portfolio that supports the extended temperature range is particularly well suited for several key applications in the automotive and industrial sectors, as these applications require reliable performance and stability at higher temperatures. erj3ekf2743v

In addition, Microchip has expanded the range of products we support in the industrial temperature range (-40 to 85 ° C) to provide higher processing speeds (250 MHz / 795 CoreMark). This series of high-speed devices for applications such as high-definition audio, these applications often require slightly higher performance of the kernel to achieve faster audio processing and transmission.

“The PIC32MZ EF family has had a strong customer base since its introduction,” said Rod Drake, vice president of Microchip’s MCU32 product line. “This is the first product in the PIC32 family to support an extended temperature range Achieving AEC-Q100 Level 1 certification marks a major milestone in Microchip’s product roadmap, which is a result of the new family of high-speed devices that dramatically improve performance and address the need for processing-intensive applications. Great progress. ”

Development support

The top of the form

Microchip provides extensive support for the PIC32MZ EF family of devices, including the Microchip MPLAB® Harmony Integrated Software Framework, the MPLAB X Integrated Development Environment (IDE), the MPLAB XC32 Compiler for PIC32, the MPLAB ICD 3 In-Circuit Debugger, and the MPLAB Real ICE ™, Online simulation system. 422lp9r

At the same time, Microchip also offers the following support tools:

• PIC32MZ Embedded EF Quick Start with floating point unit (part number: DM320007), complete turnkey toolkit

· PIC32MZ EF Starter Kit with Encryption Engine (part number: DM320007-C), complete turnkey kit

· PIC32MZ2048EF PIM (part number: MA320018), the Explorer 16 plug-in module

· PIC32MZ2048EF 144 PIM (part number: MA320019), dedicated to the Bluetooth audio development kit PIM

· Curiosity PIC32MZ EF Development Board (part number: DM320104)

Tektronix, the world’s leading provider of measurement solutions, today introduced the industry’s first test solution for the open NAND Flash Interface (ONFI) standard. The ONFI 4.0 test solution is suitable for Tektronix high performance oscilloscopes, including software for analyzing DDR2 / 3 modes on the ONFI bus, as well as an efficient probing solution based on Interposers.

The ONFI standard, published by the ONFI Working Group, is intended to simplify the integration of NAND flash memory into consumer electronics and computing platforms. The ONFI 4.0 specification introduces the evolving NV-DDR3 interface with VccQ = 1.2V, which not only improves performance but also improves power consumption and expands NV-DDR2 and NV-DDR3 I / O speeds to 667 MT / S and 800 MT / s, an increase of ZQ calibration. 7101j52zqe22

Due to the speed and voltage drop, designers dealing with ONFI buses face many challenges, such as ensuring consistency, debugging timing problems, and getting signals. With the TEK-PGY-ONFI software, design and test engineers can test whether the ONFI interface meets ONFI bus timing parameters and automatically measure Command, Address, Data in, and Data out services. The detailed view function in the TEK-PGY-ONFI software helps annotate timing problems by associating each electrical measurement of an ONFI waveform with an analog waveform by annotating it.

Intensive encapsulation and high data rates challenge high-fidelity signal access in NAND flash devices. Tektronix supports a variety of mechanical configurations, including probe designs with sockets, direct probe design, and patented edge probe designs to meet exceptionally tight mechanical requirements. Interposers and probe S-parameter models are provided to model or generate an inverse-fit filter that is applied to the oscilloscope.

The TEK-PGY-ONFI software runs on Tektronix MSO / DPO70000 Series oscilloscopes with bandwidths of 4GHz to 33GHz. P7500 or P7300 series probes are recommended for testing. Tektronix recommends using Nexus-developed ONFI 152 spherical NAND Flash Edge high-fidelity interpolators (Interposers) for signal access while maintaining signal integrity while some customers may have difficulty or no access to signals during ONFI testing . 74435572200

“This ONFI test solution provides customers with the insight they need to bring memory-based products to market faster and with greater confidence,” said Brian Reich, general manager, Tektronix Performance Oscilloscopes, Compared to manual testing, this solution significantly reduces compliance time, simplifies commissioning and ultimately increases productivity. ”

The new TEK-PGY-ONFI software complements Tektronix ‘comprehensive solution for other memory technologies, including eMMC, UFS and DDRA.

ADI Corporation today announced the acquisition of solid-state laser beam steering technology from Vescent Photonics, Inc., Golden, Colorado, USA. Vescent’s new non-mechanical laser beam steering technology can further enhance the performance of the Integrated Laser Radar 1 system and overcome the significant shortcomings of today’s large mechanical products in terms of reliability, size and cost. ADI has 20 years of automotive safety technology research and development experience, the acquisition of beam steering technology in one fell swoop to consolidate its automotive safety systems technology in the important position, more conducive to the development of next-generation ADAS and automatic driving applications. hmt351r7cfr8c-pb

“ADI’s solutions have saved many lives over the past two decades, from inertial MEMS sensors in airbags and electronic stability control applications2 to automotive radars at 24GHz and 77GHz,” said Chris Jacobs, general manager, ADI Automotive Safety. Now, with this innovative technology, it will be important to build a more compact and robust LIDAR system and equip it with all the new models in the world with this economical and practical safety feature. ” adum1200

At present, ADAS system must rely on camera, millimeter wave radar and laser radar and a series of sensor technology, can effectively provide forward collision warning, blind spot monitoring, pedestrian detection and automatic driving and other functions. The camera is widely used for target recognition, millimeter-wave radar system using radio frequency electromagnetic ranging. LIDAR uses laser beam ranging, and also identifies objects. Scanning laser radar systems can detect targets on or near roads, and can cover millimeter-wave radar systems and blind spots in the camera area.

When Microsoft CEO Satya Nadella was in Sydney, he was thinking more about his cloud than Microsoft’s Azure, Azure.

Prior to the Microsoft Developers Conference held in Australia, Nadella made his prediction of future technological development: the first is the mobile end and cloud computing. There are robots, we mentioned the robot?

“When I say ‘primarily mobile,’ my point is clear,” Nader said, “I’m not talking about any single mobile device, I’m referring to the computer processing of all the life experiences of people moving, that’s cloud computing Of the useless. uln2308

In April of this year’s F8 conference, Zuckerberg has said that is very optimistic about the future development of the robot, which is Nadella held in March at Microsoft’s annual developer conference on the remarks made in response.

Recently, Nadella publicly announced the Azure robot service, a public cloud-based robot service. With this service, people can use automated systems that understand language conversations.

Nadella acknowledged that Microsoft missed the great development of smart phones, so Microsoft must seize the next big development opportunities: the robot. Although the performance of artificial intelligence chat robots is not satisfactory, but Microsoft hopes to further the development of robot technology. bul6802

“Everyone has done websites and made mobile applications,” he said, adding that the focus has shifted to being a new platform robot as well as a variety of robot applications that you can use to handle all your business affairs, “To realize these ideas, you have to have the robot understand the language, and that’s where all the developers are trying to do it.”

In addition to building its own army of robots, Microsoft also plans to do something in the field of artificial intelligence, the program known as the “popular artificial intelligence.”

In addition, Nardan also announced a partnership with OpenAI. OpenAI is a nonprofit artificial intelligence research and development company, co-founded by Tesla’s Elon Musk and Y Combinator Chairman Sam Altman. According to the partnership, Azure will become OpenAI’s cloud support platform. “We will develop an amazing and powerful technology that will be used throughout the world after we have successfully developed it, and we do not want it to be unique to a particular country or company,” Altman said in a promotional video.

“We are developing the world’s first artificial intelligence supercomputer to make it possible for developers to break through Moore’s Law,” said Naderan. “If we look back five or 10 years ago, we might say, Is not impossible!

Siemens Healthineers is reportedly acquiring Conworx Technology at an undisclosed price to strengthen its point-of-care information capabilities. Once the acquisition is successful, Conworx will become a new unit of Siemens and will provide open connectivity to more than 100 real-time devices from leading manufacturers.

According to the statement, the acquisition will Siemens’s RAPIDComm data management system with the Berlin-based data management company’s solution together. The combined product will be supplied by the new Siemens subsidiary, Siemens Healthcareers Point of Care Informatics. Conworx products include UniPOC, a network-based, real-time data management system that connects and manages POC devices on a single platform. The company also sells POCcelerator, a POC inspection and management tool that can manage equipment, users, QC materials and controls in a single system. sn75441one

“As the size of the hospital grows, there is a huge need for seamless integration of distributed devices across multiple locations and the formation of emerging healthcare networks,” said Peter Koerte, President of Siemens’ Immediate Diagnosis Division, in a statement. Analyzer, in order to meet customer needs, we must provide a solution to ensure a good connection. ”

Siemens said in a statement that the new product portfolio will provide open connectivity for many devices, enhance data integration, and ultimately simplify operations and data access while improving risk management. It will focus on developing interfaces and applications and data management. 5kcp39eg

“We will work together to develop leading information products that will help our customers manage the ever-growing network of present and future networks,” said Roman Rosenkranz, CEO of Conworx. “In addition, Roman Rosenkranz will manage the new Siemens subsidiary (Siemens Healthineers Point of Care Informatics).

In May this year, Siemens renamed its health care business to Siemens Healthineers. Along the way, it sold the hearing aid sector to private investors, sold the hospital information system to Cerner, and sold the microbiological business to Danaher. When Siemens plans to split, its purpose is to focus on large data analysis, molecular diagnostics, and real-time diagnostics and mobile healthcare.

The leading manufacturer of semiconductor test equipment has begun accepting orders for the latest T2000 AiR test system, a compact, air-cooled thermal test system designed to meet the low-cost testing requirements of the R & D stage and a small number of diverse production processes. Health. It is expected to begin shipping to customers in the first quarter of 2017.

Demand for smartphones and other mobile devices continues to rise in the global marketplace, and consumer and business demand for network services is increasing, pushing up the production of complex semiconductor wafers and modules. These chips and modules integrate microcontrollers (MCUs) and application processors to perform a variety of functions including electronic communications, power management, and message sensing. pcm-5820-g0b2

The new T2000 AiR is designed to provide a wide range of test solutions for these various module and system-on-package (SiP) wafers. The modularity of the test stand provides excellent flexibility, and can be configured with up to six independent air-cooled heat measurement modules for a wide range of high integration The multifunction chip provides a single system test. This system is specifically designed to perform digital functions as well as sweep tests (up to 512 parallel channels), including high voltage wafers up to 2,000 volts, precision DC converters, automotive DC wafers, max. Up to 100MHz mixed-signal integrated circuits (ICs), radio frequency communication chips, and complementary metal-oxide-semiconductor (CMOS) image sensors.

This new test machine can be integrated with the M48xx series of classifiers to create high-performance, space-saving test solutions. The Advantest test is called the integrated Zero Zero Test Station. Since the T2000 AiR does not require a water-cooled heatsink, it can be installed anywhere. Moreover, the system’s software environment is fully compatible with the highly scalable T2000 series, so you can carry out large-scale parallel test, speed up the production process, help users to shorten new products to market. xc3s200-4tqg144c

“With the introduction of the new T2000 AiR, Advantest continues to expand the capabilities of both the T2000 platform to further meet the requirements of integrated component manufacturers (IDMs), wafer generations,” said Masayuki Suzuki, Senior Vice President of the SoC Test Business Group. Factories and applications of the IC design industry, the testing needs of the industry.

Six banks will provide chip maker Broadcom with $ 6.5 billion in over-lending to support its acquisition of Brocade, Nov. 9, according to foreign media reports. Broadcom announced on Wednesday that it will acquire network equipment maker Brocade Communications Systems Inc. for $ 5.5 billion in cash to expand its Fiber Channel and data storage business. u83133169

Sources said Bank of America Merrill Lynch, Deutsche Bank, Barclays, Bank of Montreal, Citigroup and Credit Suisse have signed a 364-day unsecured over-lending agreement with Broadcom.

Six banks will provide over-lending support until the April 2017 acquisition is completed, over-lending was replaced by a permanent financing agreement. The final capital structure will depend on the company’s corporate rating at that time. Moody’s Investor Services rated Bertone positively on Ba1, while Standard & Poor’s rated BB + on investment ratings. 20t201da2

After the acquisition, Fitch gave BBB a rating for Broadcom. According to Freeman Consulting Services, these banks can benefit from over-loan of 25 million to 35 million US dollars.

Microsemi has been hiring Microsemi to help deal with the deal, and Microsemi wants to remain low-key because the deal is still in its early stages, according to Bloomberg News Corp. (Nasdaq: Bloomberg), the world’s largest chipmaker.

Microsemi shares rose 20% Thursday, Thursday at 10:04 New York time trading price of $ 46.71, making this in Irvine, Calif., The company’s market capitalization reached about 5.3 billion US dollars. bsm50gd170dl

At present, Skyworks, Microsemi and Bank of Montreal three did not respond to this.

Microsemi Corp (MSCC.O) is a diversified supplier of semiconductors for defense, communications and aerospace applications, even in extreme environments such as space. Among them, the aerospace and defense accounted for 30% of the company’s total revenue, communications accounted for 36%, 19% of data centers, industrial 15%. The company acquired PMC-Sierra in October last year for $ 2.4 billion to acquire storage, OTN transport networks, expanders and controllers. Microsemi is currently increasing investment in data centers. fs50r12ke3

Skyworks if the successful acquisition of Microsemi, will help them get rid of dependence on the mobile phone market, to further expand the business areas, to achieve product diversification.