The United States on China’s development of semiconductor nerve stretched more tight

Semiconductors are seen as one of the key puzzles in China’s industry, and the government received a huge subsidy of $ 150 billion. China’s annual imports of more than the amount of semiconductor oil, the scale of subsidies, reflecting China’s semi-conductor controlled by people extremely anxious. erj3ekf2743v

According to consulting firm Bain & Co, China’s annual consumption of more than 100 billion US dollars of the semiconductor, of which only 6-7% is made in China, the other thanks to imports. China’s goal is to reach 70% of the 2025 self-control rate.

But China is too eager to develop the semiconductor, has made the United States to be vigilant, worried that the market was distorted, fear of endangering the US semiconductor industry. The Financial Times reported that the Obama Science and Technology Commission earlier this month warned that China’s semiconductor policy has posed a threat to US technological innovation and national security, showing that the United States has increased its wary of China. obsolete electronic parts

Trout, the quasi-president of the economy, has threatened to impose a tariff of 45 percent on Chinese products, but if so, there are factories in China, Qualcomm, Intel, fear of retaliation incurred in China the same.

China has successfully developed the world’s brightest extreme ultraviolet light source

The “Dalian Light Source”, developed by the Chinese Academy of Sciences, has issued the world’s most extreme ultra-violet free electron laser pulse. A single picosecond laser pulse generates 140 trillion photons, making it the world’s brightest fully tunable EUV free Electronic laser light source.

In this kind of extreme ultraviolet light irradiation, the region almost all atoms and molecules are “nowhere to hide.” Therefore, the “Dalian light source” can be used to observe the physical and chemical processes associated with combustion, the atmosphere and clean energy. sn74lvcu04a

Wang Enge, vice president of the Chinese Academy of Sciences, said that this is the Chinese Academy of Sciences and China has a very high display of the major scientific and technological achievements, 90% of the equipment by the Chinese independent research and development, marking China occupies the world leader in this field Status, will greatly promote China in the energy, optics, physics, biology, materials, atmospheric haze, lithography and other important areas of research to enhance the level.

Free electron laser is a new generation of advanced light source, is also the world’s advanced countries competing development important direction in the scientific research, advanced technology, national defense science and technology development has important application prospects.

“Dalian Light Source” is China’s first large-scale free electron laser scientific research user device, is the world’s only operating in the extreme ultraviolet band of free electron laser device, is the world’s brightest extreme ultraviolet light source.

The laser can work in femtosecond or picosecond pulse mode, you can use SASE (self-amplifying spontaneous emission) or HGHG (self-amplified radiation), which can be used in the ultra-violet region is completely continuous adjustable, with complete coherence; High gain harmonic amplification) mode operation. xc4020xl-3pq160c

“Dalian light source” project by the National Natural Science Foundation of the major national instrument special funding, by the Chinese Academy of Sciences Dalian Institute of Chemical Physics and Shanghai Institute of Applied Physics jointly developed. Project in October 2014 officially started construction in Dalian Changxing Island, the end of September 2016 to complete the installation of light for the first time, creating a similar large-scale scientific device construction in China’s new record.

CES2017 Rockchip 3D-VR recording solution exposure lead VR + layout

Intel, NVIDIA, Qualcomm chip vendors and HTC, Oculus, SONY, Samsung, Huawei equipment manufacturers are released to see a great look at the global CES2017 VR industry does not diminish, the global hardware, platform and content manufacturers flocked to Point of the new technology and flagship models. Rockchip Rockchip this showcase VR equipment program cluster, the program expanded from the broadcast terminal to the video field, a new look into the VR.

1,360 degrees VR panoramic camera equipped with RV1108 core

The product is based on Rockchip RV1108 intelligent visual image processing chip, with three major advantages to solve the industry pain points: 1, three-dimensional 360-degree panoramic shooting 2, the machine that is shot without the client second stitching 3, high-performance graphics chip ” Wide dynamic “picture quality.

RV1108 chip is Rockchip layout for IoT Internet of Things killer products, the chip embedded CEVA XM4 visual processor DSP, with intelligent image processing and other key technologies, up to 600MHz. Relying on the advantages of professional image processing unit technology, VR panoramic camera in wide dynamic, sensitivity, clarity, backlight, night vision imaging advantages.

The RV1108-based VR panoramic camera integrates high-performance encoders and enables local real-time encoding and conversion to standard VR format video, instant imaging without any postprocessing, and output video for direct viewing on any VR device.

2,3D-VR camera equipped with RK3399 core

Rockchip released 3D VR camera solution, using the flagship chip RK3399 + dual-camera input + dual ISP real-time processing, RK3399 dual Cortex-A72 core + four Cortex-A53 small core, big.LITTLE size nuclear architecture. GPU using Mali-T860 image processor. CPU aspects of integer, floating point, a huge memory optimization, with high performance, low power consumption of the product features. adum1200

The 3D VR camera solution supports a variety of algorithms that enable VR 3D video to achieve better image detail, picture quality and professional-grade 3D effects with higher-performance CPUs and image processors and software algorithms for cinema-quality and Depth of immersion.
CES2017 Rockchip 3D-VR recording solution exposure lead VR + layout

3, can support the VR-one voice recognition machine, split machine

As China’s first VR solution layout, CES2017 Rockchip showcased a mature and productive VR terminal, including a VR machine and a VR splitter that can support voice recognition, and can support VR card SD card Direct playback.

It is worth emphasizing that, for the VR split machine market demand, Rockchip supports the world’s longest Type-C extension cable. Based on Rockchip CPU and GPU powerful performance, can ensure that the image effect under the premise of ultra-long distance data transmission, can be the perfect support for operators, platform business data conversion. This is relative to the current other similar solutions, has great technical superiority. w25q80bvssig

CES2017 Rockchip 3D-VR recording solution exposure lead VR + layout

Support VR three major industry standards: 20ms millisecond delay, 75Hz refresh rate above the screen and 1K above the gyroscope refresh rate. Support 4K 360 panoramic video decoding capabilities, support 2K / dual FHD high-resolution screen, support for optical software anti-distortion, anti-dispersion, IPD adjustment algorithm and support software and hardware two sub-screen mode, and so technical characteristics.

Based on the advantages of Rockchip micro-audio and video technology for many years, this open VR split machine and voice recognition one machine is quite innovative to meet the multi-application scenarios under the market demand, product experience more advantages.

summary:

VR domain involves many levels, from the hardware to the content, from the background technology to the front display, for such a long industry chain, the ecosystem construction is essential. CES2017 Rockchip show not only a variety of forms of VR solutions, more importantly, its product line has been extended to cover the contents of the two major areas of software and hardware recording, will be beneficial to partners in the VR product line terminal manufacturers to build Highly Competitive Product Matrix.

Qualcomm brings active noise reduction to ultra-compact earplugs and headphones

Qualcomm Incorporated today announced that Qualcomm Technologies, International, Ltd., a subsidiary of Qualcomm Technologies, has introduced active noise reduction (ANC) technology on its CSR8675 product platform, making it the world’s first Bluetooth audio system-level chip incorporating this advanced audio solution SoC). The new feature eliminates the need for a separate ANC chip, reducing the complexity and cost of active noise reduction technology in headphones, enabling manufacturers to quickly achieve the ultimate audio experience in a compact form factor.

By integrating ANC technology into the CSR8675 for ultra-small form-factor designs, Qualcomm will bring a small form factor to its all-new design and deliver a higher-quality listening experience for consumers who prefer to use earbuds. The CSR8675 is a fully integrated Flash platform with an embedded 120Mhz 24-bit DSP. It also supports Qualcomm aptX and Qualcomm aptX HD audio technology for consistently high-quality audio over Bluetooth. 7101j52zqe22

“The demand for wireless stereo in-ear headphones and headphones is growing fast,” said Anthony Murray, senior vice president and general manager of the Internet of Things at Qualcomm Technologies International, Inc. “Users want a great audio experience in any environment, Eliminating the need to listen to music, watching video and playing games at the expense of audio quality.As the first launch of integrated active noise reduction technology, Bluetooth audio system-on-chip companies, and now we can work with manufacturers in their integration of various products Active noise reduction technology at the same time, more and more high – end headphones have experienced the noise reduction technology consumers also hope that this feature can appear in the lighter, cheaper audio headphones. erj3ekf2743v

“We have integrated the ANC CSR8675 into our active noise reduction Bluetooth headsets to provide a high-quality audio experience,” said Tom Li, executive vice president of business development for Fujikon Industrial Co., Ltd. “Since the CSR8675 incorporates ANC Technology, we can create real value for our customers in terms of both cost and performance for the end user.The playback time of the headset can be extended to around 12 hours, while the noise reduction performance can be as high as -23dB.

TSMC: 2016 contribution to the global IC reached 26.6%

TSMC has been in Taiwan since 1987, 30 years of history.

It is the world’s largest foundry business, market share in 2015 up to 54%, as of December 30, 2016 its stock market value of about 145 billion US dollars. TSMC expects 2016 annual sales of up to 29.3 billion US dollars, its 28 nm monthly production capacity of 15.5 million 12-inch wafer, the market share of 80%.

The process takes a stable route from 28 nanometers to 20 nanometers to the mature process of Q2 2015 (capable of mass production and stable in terms of both efficiency and yield) of 16 nanometers. The latest 10-nanometer is expected in the first quarter of 2017 production.

In addition, TSMC is disclosed at the end of September last year, in addition to actively developing 5-nanometer process, the more advanced 3-nanometer manufacturing process has also been organized 300 to 400 people in the research and development team. xc6slx75-3fgg484c

However, the success of TSMC is not achieved overnight, and other successful companies, has its internal and external factors together.

External factors are driven by Moore’s Law, IC research and development costs remain high, and plant investment costs, so after the process into the 28 nm (around 2010), many IDM factory fabless strategy ( Fab-lite), began to embrace OEM.

On the other hand, it is the support of the industrial environment in Taiwan, in particular, can provide a full range of foundry services and gathering talent, which is why the foundry industry in Taiwan alone can be a dominant one of the main reasons.

At the helm of TSMC, TSMC has become the internal factor in TSMC’s success. TSMC has chosen the right direction for TSMC at a crucial point in time. TSMC’s sales also increased from US $ 2.3 billion in 2000 to US $ 8.98 billion in 2009 and 2016 Year of 29.3 billion US dollars, 16 years of time turned nearly 13 times. frb-wt145

Summed up the key points of TSMC may have the following three aspects:

1, at the end of the century IBM 0.13 micron, copper process and Low-k technology transfer, and self-developed

As the process progresses to the 0.25-micron stage, the resistance and capacitance increase in the wiring system due to the sharp increase in the number of metal wires and the decrease in the metal wire width, resulting in a time delay (RC Time Delay) Seriously affecting the overall circuit operating speed.

To solve this problem there are two ways, first, the use of copper wire when the lower resistivity material; to replace the aluminum before, because copper resistivity than aluminum is also three times lower. The second is the use of Low-K Dielectric (low dielectric insulation) as the dielectric layer material.

At that time, IBM first released copper process and Low-K materials 0.13 micron new technology, and to find TSMC and UMC to sell. TSMC after consideration, decided to reject IBM and its own R & D copper process technology; and UMC chose to IBM to buy technology, and to develop.

However, due to IBM’s technology is limited to the laboratory, the manufacturing yield is too low, not up to volume production. By 2003, TSMC’s 0.13-micron process technology stunning debut, customer orders turnover of nearly 5.5 billion Taiwan dollars, UMC is about 1.5 billion Taiwan dollars.

Nvidia CEO and President Jen-Hsun Huang said: “0.13 micron TSMC transformation.”

2, 2009, the second comeback Zhang Zhongmou

In the financial crisis, TSMC made a major decision, so when the CEO of Cai Li line class and the second comeback of Chang. And Chang’s return again, it seems that TSMC long wings, let its followers catch up, consolidate the status of the world’s leading foundry.

According to statistics in the 2010-2016 period, TSMC’s annual investment accumulated up to $ 58.5 billion. In the market economy can have the courage to invest heavily to show its strength.

3, adhere to the foundry model does not waver

Global foundry from the beginning is not optimistic about the industry, especially the United States and Japan market is not recognized OEM prospects, so the global foundry has been Taiwan stand out.

Analysis of the two main reasons, first of all, then the foundry process technology behind the mainstream IDM plant at least 1-2 generations, so OEM can only be used as the second source of IDM capacity; the other is in that Period that the design of the OEM orders for processing to have the technical leakage of doubt.

Today, including Samsung, Intel, etc., they are seen as IDM foundry, that is both for their own products, but also to help others foundry, so Apple has been to “Samsung” ideas, worried about their own Technology leaks. TSMC always adhere to the foundry model, never compete with customers for orders, so there is no leakage of customer technology problems.

TSMC’s contribution to the global semiconductor industry

Under normal circumstances, IC products, sales of foundry sales of 2.5 times, which can be calculated in 2016 TSMC IC products driven sales of 73.25 billion US dollars (29.3 billion x2.5).

If the global IC sales in 2016 according to 275 billion dollars (excluding discrete and optoelectronic devices, etc.), the TSMC’s contribution to the global IC reached 26.6%, indicating that more than 25% of global shipments of integrated circuits is TSMC’s foundry processing.

According to June 6, 2016, Zhang Zhongmou shareholders at the shareholders meeting, “pointed out that the TSMC has reached four major milestones in 2015, including the 12-inch wafer shipments of 8.763 million, an annual increase of 6.1% ; 28-nanometer advanced process revenue accounted for 48%, better than the previous year’s 42%; TSMC can provide 228 kinds of process technology, 470 customers for the production of 8941 different products; for six consecutive years in the wafer industry market share Rise, reaching more than 50%.