TSMC has been in Taiwan since 1987, 30 years of history.
It is the world’s largest foundry business, market share in 2015 up to 54%, as of December 30, 2016 its stock market value of about 145 billion US dollars. TSMC expects 2016 annual sales of up to 29.3 billion US dollars, its 28 nm monthly production capacity of 15.5 million 12-inch wafer, the market share of 80%.
The process takes a stable route from 28 nanometers to 20 nanometers to the mature process of Q2 2015 (capable of mass production and stable in terms of both efficiency and yield) of 16 nanometers. The latest 10-nanometer is expected in the first quarter of 2017 production.
In addition, TSMC is disclosed at the end of September last year, in addition to actively developing 5-nanometer process, the more advanced 3-nanometer manufacturing process has also been organized 300 to 400 people in the research and development team. xc6slx75-3fgg484c
However, the success of TSMC is not achieved overnight, and other successful companies, has its internal and external factors together.
External factors are driven by Moore’s Law, IC research and development costs remain high, and plant investment costs, so after the process into the 28 nm (around 2010), many IDM factory fabless strategy ( Fab-lite), began to embrace OEM.
On the other hand, it is the support of the industrial environment in Taiwan, in particular, can provide a full range of foundry services and gathering talent, which is why the foundry industry in Taiwan alone can be a dominant one of the main reasons.
At the helm of TSMC, TSMC has become the internal factor in TSMC’s success. TSMC has chosen the right direction for TSMC at a crucial point in time. TSMC’s sales also increased from US $ 2.3 billion in 2000 to US $ 8.98 billion in 2009 and 2016 Year of 29.3 billion US dollars, 16 years of time turned nearly 13 times. frb-wt145
Summed up the key points of TSMC may have the following three aspects:
1, at the end of the century IBM 0.13 micron, copper process and Low-k technology transfer, and self-developed
As the process progresses to the 0.25-micron stage, the resistance and capacitance increase in the wiring system due to the sharp increase in the number of metal wires and the decrease in the metal wire width, resulting in a time delay (RC Time Delay) Seriously affecting the overall circuit operating speed.
To solve this problem there are two ways, first, the use of copper wire when the lower resistivity material; to replace the aluminum before, because copper resistivity than aluminum is also three times lower. The second is the use of Low-K Dielectric (low dielectric insulation) as the dielectric layer material.
At that time, IBM first released copper process and Low-K materials 0.13 micron new technology, and to find TSMC and UMC to sell. TSMC after consideration, decided to reject IBM and its own R & D copper process technology; and UMC chose to IBM to buy technology, and to develop.
However, due to IBM’s technology is limited to the laboratory, the manufacturing yield is too low, not up to volume production. By 2003, TSMC’s 0.13-micron process technology stunning debut, customer orders turnover of nearly 5.5 billion Taiwan dollars, UMC is about 1.5 billion Taiwan dollars.
Nvidia CEO and President Jen-Hsun Huang said: “0.13 micron TSMC transformation.”
2, 2009, the second comeback Zhang Zhongmou
In the financial crisis, TSMC made a major decision, so when the CEO of Cai Li line class and the second comeback of Chang. And Chang’s return again, it seems that TSMC long wings, let its followers catch up, consolidate the status of the world’s leading foundry.
According to statistics in the 2010-2016 period, TSMC’s annual investment accumulated up to $ 58.5 billion. In the market economy can have the courage to invest heavily to show its strength.
3, adhere to the foundry model does not waver
Global foundry from the beginning is not optimistic about the industry, especially the United States and Japan market is not recognized OEM prospects, so the global foundry has been Taiwan stand out.
Analysis of the two main reasons, first of all, then the foundry process technology behind the mainstream IDM plant at least 1-2 generations, so OEM can only be used as the second source of IDM capacity; the other is in that Period that the design of the OEM orders for processing to have the technical leakage of doubt.
Today, including Samsung, Intel, etc., they are seen as IDM foundry, that is both for their own products, but also to help others foundry, so Apple has been to “Samsung” ideas, worried about their own Technology leaks. TSMC always adhere to the foundry model, never compete with customers for orders, so there is no leakage of customer technology problems.
TSMC’s contribution to the global semiconductor industry
Under normal circumstances, IC products, sales of foundry sales of 2.5 times, which can be calculated in 2016 TSMC IC products driven sales of 73.25 billion US dollars (29.3 billion x2.5).
If the global IC sales in 2016 according to 275 billion dollars (excluding discrete and optoelectronic devices, etc.), the TSMC’s contribution to the global IC reached 26.6%, indicating that more than 25% of global shipments of integrated circuits is TSMC’s foundry processing.
According to June 6, 2016, Zhang Zhongmou shareholders at the shareholders meeting, “pointed out that the TSMC has reached four major milestones in 2015, including the 12-inch wafer shipments of 8.763 million, an annual increase of 6.1% ; 28-nanometer advanced process revenue accounted for 48%, better than the previous year’s 42%; TSMC can provide 228 kinds of process technology, 470 customers for the production of 8941 different products; for six consecutive years in the wafer industry market share Rise, reaching more than 50%.