China Semiconductor Industry Association and vice president, through rich micro-power, chairman of Shida Ming said that with the continuous expansion of domestic packaging and testing companies in overseas markets, strengthen cooperation in the industry chain, China’s IC packaging and testing industry has been in its international competitiveness.
15, the 14th China Semiconductor Assembly and Test Technology & Markets Conference held in Nantong, many experts believe that mainland IC packaging and testing industry has emerged, some of the world’s leading enterprises to enter the first tier, but also faces many new challenge.
The continued support of relevant national policies, China IC packaging and testing companies through mergers and acquisitions to quickly acquire advanced technology and competitiveness. China Semiconductor Industry Association and vice president, through rich micro-power, chairman of Shida Ming said in his speech, with the continuous expansion of the domestic packaging and testing companies in overseas markets, strengthen the industrial chain collaboration, enterprise rapid rise in the global rankings, China’s IC packaging and testing industry has in its international competitiveness. It is reported that, Changjiang Electronics Technology, Huatian Technology, through rich micro-power has risen in the global IC packaging and testing companies were ranked to the third, sixth, tenth place.
General manager of the National Integrated Circuit Industry Investment Fund Ding Wenwu said that mergers and acquisitions are gathering talent, access to technology, effective way to capture the market, the big fund industry will continue to promote mergers and acquisitions.
According to Reporters incomplete statistics, since 2014, the number of mainland packaging companies launched a series of overseas mergers and acquisitions, where long power technology Dominant acquired ChipPAC; Huatian Technology acquired the US FCI; through rich micro-electrical acquisition Suzhou AMD and AMD each Penang, Malaysia 85% stake; Tongfang Guoxin Subscription force into southern Taiwan Mau additional shares of each company obtained a 25% stake.
The experts believe that packaging and testing, the manufacturing side, the rapid development of applications will bring a lot of opportunities and markets packaging and testing. Statistics show that at the end of IC design, Spreadtrum, Huawei Hass and many other design companies to enter the global forefront; in the manufacturing end, SMIC Wuhan Xinxin, TSMC Nanjing, Chongqing Bandai (AOS) semiconductor, Huali Microelectronics, Shenzhen Unisplendour 10 12-inch wafer production line coming on line; the application side of things, wearable, cloud computing, big data and rapid development of new energy vehicles, unmanned aerial vehicles, autopilot, industrial control and other new applications, including industrial control IC market, the automotive electronics market growth in fiscal 2015 were up 33.9%, 32.5% of new applications to the IC industry to bring more development opportunities.
The challenge and opportunity go hand in hand. Ministry Peng Hongbing, deputy director of electronic information in his speech said that the mainland IC packaging and testing industry will face four major challenges: First, faced with new packaging challenges 5G era; the second is the new packaging requirements Hou Moer era, the era of the package will play in Hou Moer a more important role, in cooperation with the upstream and downstream industry chain more closely; the third is emerging semiconductor market challenges, “Made in China 2025″, “Internet +” and bring new market intelligence products and packaging requirements; Fourth, international mergers and acquisitions integration challenges. Director of the Institute of Microelectronics sweet leaf spring also think that local companies and international packaging and testing industry chain depth of integration (including mergers and acquisitions, investment etc.) is a big challenge.
Chinese Academy of Engineering Xu Juyan in the speech, along with Moore’s Law fade, IC industry will face uncertainty divergent innovation confusion, the package is more prominent position.
Shida Ming believes that China’s chip industry compared to Europe and other regions there is a wide gap in the core technology and intellectual property are still controlled by others, some of the key missing link chain, each link cooperative interaction insufficient tightness, industrial layout is not rational.
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