In the first session of the General Assembly was held on the eve of the global 5G, it announced that its Bell Labs China to achieve a breakthrough in high-speed wireless transmission and use of millimeter-wave spectrum, by using them on a large scale in the millimeter wave band MIMO technology (Multiple Input Multiple Output technology) to achieve a significant improvement of capacity and related efficiencies. Nokia Telecommunications China Shanghai Bell, executive vice president and joint management team, responsible for Technology and Innovation Gui Luoning believes that the future 5G has six key technologies, and Bell Labs will conduct innovative research in these key technologies, so as to create great value.

Strengthen innovation in key technologies

According to reports by the peak transfer rate of more than 50Gbps prototype, Bell Labs China in the 28GHz millimeter wave band successfully up to 100bps / Hz spectral efficiency, the transmission rate allows users to complete more high-definition movies in 8 seconds download. This technique results-5G Internet network operators to achieve a tactile, low latency high-definition virtual reality (HD-VR) and other business innovation provides the foundation for future applications.

Gui Luoning According to reports, in the millimeter wave solutions, Nokia Bell Labs China with an innovative low-latency air-interface to ensure that the millimeter wave band to achieve efficient wireless transmission, improve end-user experience; through massive MIMO and beam tracking, including innovative physical layer technology to ensure the large system capacity and spectral efficiency. Ultra-high-speed transmission and high-performance millimeter-wave spectrum, allowing operators of high-speed mobile services with a better user experience, through application of wireless backhaul and other areas to achieve greater flexibility 5G network deployment.

In addition to millimeter wave technology, Gui Luoning said other key technologies in 5G Bell Labs also strengthen innovation. As the industry’s most concerned about the new air interface technology, in order to achieve future demand for all things Internet-compatible frame structure 5G empty, the waveform must exhibit great flexibility, and to automate the network on the basis of intelligence and programmable technology. Gui Luoning told reporters, Bell Labs is currently working on a new flexible frame structure, regardless of the scene is high-bandwidth, ultra-dense connections, low latency or low power, there can be adapted to flexible frame structure. In the new wave, Bell Labs has been achieved from 3.75KHz to 120KHz to business and the type of user-defined minimum air interface access unit with software-defined way.

In his view, the network delay, the new air interface can be supported from 0.125 ms to 4 ms; in broadband networks capable of rising from 20M to 1G. The new network architecture, the new air interface, large-scale antenna array technology, LTE + 5G WiFi technology as well as the formation of the low-frequency range of access, depending on the software to adjust the different types of access services.

Things are developing new unknown

Model Bell Labs Consulting shows that in 2020, WiFi is expected to meet 67% of global consumer demand, and 14% of the demand will appear with the current 3G, LTE, small base station of the popularity of new technologies and 5G be satisfied, the remaining 19% of the demand can not be met. Therefore, network operators need to accelerate the development of NFV, SDN and cloud and other 5G technologies and new business models to address the needs of scarcity.

Gui Luoning believes Things (IoT) is developing a network of new uncharted territory. By 2020, the number of devices connected to the Internet of Things is expected to be in 2014 to grow to 1.6 billion by 2020 from 20 billion to 46 billion between. Wherein the cellular networking equipment will reach 1.6 to 4.6 billion between 2020. Despite the use of large scale networking devices, sensors and video cameras but which did not have much equipment in proportion, so the cellular flow of things produced in 2020 in the proportion of total mobile data traffic is only 2%.

However, recent data obtained from the point of view, things traffic signaling traffic generated will be much higher than data traffic. For example, a typical networking device consumes 1MB traffic needs to be connected to data processing or 2500, and the same flow rate via a mobile video connection that is capable of being exhausted.

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China Semiconductor Industry Association and vice president, through rich micro-power, chairman of Shida Ming said that with the continuous expansion of domestic packaging and testing companies in overseas markets, strengthen cooperation in the industry chain, China’s IC packaging and testing industry has been in its international competitiveness.

15, the 14th China Semiconductor Assembly and Test Technology & Markets Conference held in Nantong, many experts believe that mainland IC packaging and testing industry has emerged, some of the world’s leading enterprises to enter the first tier, but also faces many new challenge.

The continued support of relevant national policies, China IC packaging and testing companies through mergers and acquisitions to quickly acquire advanced technology and competitiveness. China Semiconductor Industry Association and vice president, through rich micro-power, chairman of Shida Ming said in his speech, with the continuous expansion of the domestic packaging and testing companies in overseas markets, strengthen the industrial chain collaboration, enterprise rapid rise in the global rankings, China’s IC packaging and testing industry has in its international competitiveness. It is reported that, Changjiang Electronics Technology, Huatian Technology, through rich micro-power has risen in the global IC packaging and testing companies were ranked to the third, sixth, tenth place.

General manager of the National Integrated Circuit Industry Investment Fund Ding Wenwu said that mergers and acquisitions are gathering talent, access to technology, effective way to capture the market, the big fund industry will continue to promote mergers and acquisitions.

According to Reporters incomplete statistics, since 2014, the number of mainland packaging companies launched a series of overseas mergers and acquisitions, where long power technology Dominant acquired ChipPAC; Huatian Technology acquired the US FCI; through rich micro-electrical acquisition Suzhou AMD and AMD each Penang, Malaysia 85% stake; Tongfang Guoxin Subscription force into southern Taiwan Mau additional shares of each company obtained a 25% stake.

The experts believe that packaging and testing, the manufacturing side, the rapid development of applications will bring a lot of opportunities and markets packaging and testing. Statistics show that at the end of IC design, Spreadtrum, Huawei Hass and many other design companies to enter the global forefront; in the manufacturing end, SMIC Wuhan Xinxin, TSMC Nanjing, Chongqing Bandai (AOS) semiconductor, Huali Microelectronics, Shenzhen Unisplendour 10 12-inch wafer production line coming on line; the application side of things, wearable, cloud computing, big data and rapid development of new energy vehicles, unmanned aerial vehicles, autopilot, industrial control and other new applications, including industrial control IC market, the automotive electronics market growth in fiscal 2015 were up 33.9%, 32.5% of new applications to the IC industry to bring more development opportunities.

The challenge and opportunity go hand in hand. Ministry Peng Hongbing, deputy director of electronic information in his speech said that the mainland IC packaging and testing industry will face four major challenges: First, faced with new packaging challenges 5G era; the second is the new packaging requirements Hou Moer era, the era of the package will play in Hou Moer a more important role, in cooperation with the upstream and downstream industry chain more closely; the third is emerging semiconductor market challenges, “Made in China 2025″, “Internet +” and bring new market intelligence products and packaging requirements; Fourth, international mergers and acquisitions integration challenges. Director of the Institute of Microelectronics sweet leaf spring also think that local companies and international packaging and testing industry chain depth of integration (including mergers and acquisitions, investment etc.) is a big challenge.

Chinese Academy of Engineering Xu Juyan in the speech, along with Moore’s Law fade, IC industry will face uncertainty divergent innovation confusion, the package is more prominent position.

Shida Ming believes that China’s chip industry compared to Europe and other regions there is a wide gap in the core technology and intellectual property are still controlled by others, some of the key missing link chain, each link cooperative interaction insufficient tightness, industrial layout is not rational.

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Microsoft announced on Monday, will be $ 26.2 billion cash acquisition of LinkedIn. This is the largest acquisition in Microsoft’s history.

Microsoft said in a blog, will be $ 196 per share in cash LinkedIn. After completion of the transaction, Microsoft will continue to retain LinkedIn brand, culture and independence, while Jeff Vernal (Jeff Weiner) will continue to serve as CEO, to Microsoft CEO Satya Nadella (Satya Nadell) reporting.

LinkedIn chairman Reid Hoffman (Reid Hoffman) said in a statement: “Today Linkedin is a time of rebirth.” Hoffman said that he fully supported the deal.

Microsoft CEO Satya Nadella (Satya Nadell) said: “I have been bullish on LinkedIn, on the acquisition, we had a long talk.”

Microsoft said it will complete the transaction by strengthening personal and business subscription services, as well as accurate advertising services to accelerate the commercialization of LinkedIn.

Although the offer of $ 196 per share, compared to Friday’s closing price premium LinkedIn nearly 50%, but much lower than LinkedIn 2015 Nian hit a record of more than 270 US dollars. LinkedIn 2011 listing, the issue price was only $ 45.

Tigress Financial Partners analyst Ivan Feiensaisi (Ivan Feinseth) said: “LinkedIn is a great company, despite the recent sluggish performance, but Microsoft gives high worth.”

Microsoft said it would finance the deal to come through the issuance of new debt. Both sides expect the deal expected to be completed before the end of this year. By then, LinkedIn will be integrated into Microsoft’s “productivity and business processes” department.

Affected by the news, shares rose before LinkedIn disc nearly 50% to $ 194.5, LinkedIn market capitalization of $ 17.51 ​​billion; while Microsoft shares fell 0.35% premarket slightly to $ 51.3.

Career networking site LinkedIn put into operation in 2003. In 2013, the company listed on the NYSE, financing amounted to $ 1.2 billion when the market. As of the last fiscal quarter (March 2016), LinkedIn in the global total of 106 million active users.

In this regard, Techcrunch published article commented that this is a win-win deal.

Article, whether it is for Microsoft or LinkedIn, the deal were significance. For Microsoft, the deal will a core, has not yet been incorporated into the company’s business strategy, so as to provide a wider range of business services.

Social networking services and professional content, LinkedIn will make Microsoft’s broader service coverage. In addition, LinkedIn social network also gives Microsoft a potential sales channels.

In addition, some acquisitions LinkedIn were also attractive to Microsoft. For example, LinkedIn provides online learning tools through acquisitions Lynda.com for the user. Microsoft can guide users through the deployment of such tools on how to use their own software products, so as to further promote product sales.

For LinkedIn, after being acquired by Microsoft, some of the problems currently facing the company will be relieved. For example, how to compete with rivals, users and revenue growth slow, and shares fell problems.

Of course, the deal is not entirely going downhill on a company to find a backer. Although the company’s share price is currently lower than the $ 258 12-month record high, but LinkedIn is still a good performance of listed technology companies.

In the field of social networking, Microsoft has never made too much of a victory, and LinkedIn help make Microsoft occupies an important place in this area.

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2016 new smart phone fast charging application demand will increase substantially, has already been prepared for properly related power management IC solve scheme of the chip maker Texas Instruments (TI), Infineon (Infineon) and NXP (NXP), is expected to in the fast charging chip opportunities outbreak of first time winner take all market pie, as both sides of the chip industry in the mobile phone fast charging footsteps in the field is relatively backward, due to not get client authentication, 2016 fast charging market pie probably will be ceded to the chip suppliers.

The chip industry pointed out that although wireless charging applications quite cool, but the rapid charging applications more practical and cost-effective, prompting 2016 Qualcomm (qcom), MediaTek, intelligent mobile phone chip platform continues to escalate, apple (AAPL) also decided will new mobile phone power supply power supply wattage by original 15 Wazeng to 20 Watt hope through higher current shorten the end product charging time, in order to achieve the effect of fast charging.

Recent Department of Taiwan power supply industry, confused and then notified of the customers, and started to change the power supply system design, in order to meet the customers such as apple fast charging, improve efficiency and will not produce too much heat energy requirements, need through the power management IC, voltage regulator IC, protection IC Design collocation, at present power supply industry more direct for Texas Instruments, Infineon and NXP etc. the chip maker help, expected in the second quarter after the completion of the client authentication, 2016 under half a large number of shipments.

Due to the good fast charging application city share a rapid growth, not only global analog IC suppliers divergent ready a series of chip solutions, gearing up to inroads into the market on a large scale off considerable opportunities, global mobile phone chip maker also actively planning, 2016 high pass first proposed quick charge specification version 3.0, MediaTek by pump express series of successive battle and will continue to introduced new solutions.

Currently on both sides of the analog IC design industry in high current, high voltage IC technology development continued in chasing, global mobile phone chip maker almost every year to the specifications of the upgrade, so that both sides of the IC design industry needs to spend more time through customer certification program, 2016 global fast charging chip market for fear of being international manufacturers of sweep the deck, on both sides of the chip factory in the face of rapid charging business opportunities in the market, short-term fear to see, but not eat.

Department of Taiwan chip industry thinks, fast charging applications continue to expand, including unmanned aerial vehicle (UAV), virtual reality (VR) device and application of emerging, are in need of quick charge function, chip market demand will be significant growth, chip average price is higher, let Taiwan chip plant is in the heart, including ang Bao, Jia Fen related to accelerate the chip to launch the footsteps, Li Qi, caused by the new etc. chip is also considered a follow-up not absent from the emerging power supply design application opportunities.

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OSRAM (Osram) division of its lighting business for the new company “LEDVANCE” has been started in April 1, 2016 from the organization and the independent operation of the spin off, and the formal entity will begin in July 2016 after the entry into force. And a number of manufacturers to bid for OSRAM lighting business follow-up, Xiaobian judgment should be at the end of 4 to 5 between the end, exactly clear, including each bid, the first debate manufacturers about action, OSRAM between the firm and the condition of interaction, and so on, in addition to determine who qualify outside, subsequent cooperation relations and conditions may is the lighting industry and LED industry focus on the observation of.

LEDVANCE not only OSRAM lighting brand value, also has the traditional light sources and LED lamp products application and market of classical lamps and ballast, CLB / LED lighting solution, LLS), and previously in the illumination pathway has years of experience of OSRAM executives as managers, the company also master the traditional pathway and led etc. Product Innovation potential, the extraordinary value, Xiaobian prediction if OSRAM segmentation LEDVANCE and successfully sold their stakes to other manufacturers, the overall transaction price estimates it will fall on the 5 billion euros.

LEDVANCE will by, 47 year old Jes Munk Hansen duties, he before is OSRAM American business executives, financial length by Oliver Neubrand as, sales and marketing in charge of Erol Kirilmaz, headed by Peter Mannhart operation, Bettina Kahr-Geleng as human resources horned color.

OSRAM is currently in the European market share of lighting channels is the first, while North America is the second, is the world’s second largest lighting manufacturers. Xiaobian 2016 in Frankfurt, Germany exhibition experience point of view, OSRAM successfully create a new lighting business LEDVANCE momentum, the stalls in the evening or a lot of crowds, including partners from all walks of life, than other lighting manufacturers more than many, display the company at the turn of the old and new lighting, there are still a lot of development potential.

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Believe that the recent attention of the hardware news friends, have learned that Intel ready to change the “Tick-Tock” mode of product information. Intel will be a period of two years for a cycle of hardware upgrades, change to the process – Architecture – (PAO) of the three step strategy. This message from the 10-K to the U.S. Securities and Exchange Commission Intel documents can be confirmed. This also marks the Intel processor products will be officially changed from two years to an upgrade cycle for three years an upgrade cycle, which also appeared over 50 years of Moore’s law caused a huge impact.

The reason, in fact, is the result of the interaction of many factors. First of all, nature is the pressure of the manufacturing process. It is well known that processor produced by the basic raw material is silicon, when we failed to find more effective alternatives, the progress of the process to face a challenge to limit once again, the attendant is exponential growth in the manufacturing costs. At the same time, higher accuracy means lower yield, so that once again increase the cost of production of the product. When the manufacturing cost of a product is much more than the sales price it should have, it is very difficult to put into the market in the form of consumer products.

Also from the SNB era, alone of the lifting process has been difficult to significantly enhance the processor performance, so processor manufacturers must find a more effective way to upgrade, in order to continue to promote industry processor performance leap, which like when the Pentium series processors in performance bottlenecks, Intel chose dual core and hyper threading the same. The processor market is still in the performance bottleneck, so Intel need more time to develop, adjust and improve the processor’s products.

Moore’s law of life

In the above we mentioned the “Moore’s law”, which was raised by Intel Moore, one of the founders of Gordon, in 1965. Its content is: when the price is constant, the number of components can be accommodated on the integrated circuit, about every 18-24 months will be doubled, the performance will be doubled. This law has been verified for half a century, not only in the field of micro processing chips, including semiconductor memory and system software, including the development and upgrading of Moore’s law and the content of the agreement.

Only part of the microprocessor, from 1979 the 8086 and 8088 to 1982 802861985 years of 803861989 years of 804861993 years of Pentium, pentiumpro in 1996 and 1997 PentiumII, function more and stronger, prices and lower, every update is direct result of Moore’s law. At the same time, the memory storage capacity of PC machine expanded from the earliest 480k to 8M, 16M, which is more consistent with Moore’s law.

In order to better follow this certain law, Intel in 2007 for its processor products launched the “Tick-Tock” upgrade mode. The tick represents process, tock on behalf of the architecture, and “tick tock” principle is measured in years, so summarize “tick tock” is every year launched a new generation of products, next year is on the basis of new process introduction of new architecture products.

Why do you want to abandon Moore’s law

Chip giant Intel of the strategic transformation, led directly to the results is the following products no longer follow Moore’s law for two years as a hardware upgrade cycle principle, from the current market situation analysis, the emergence of this situation is inevitable. First of all, to silicon as the raw material manufacturing process, has reached a bottleneck stage, when we can not find a valid substitute in a short time, the pace of development of natural to slow down.

Secondly, the processor’s heating problem has been one of the problems to be solved. From a macro point of view, the more sophisticated equipment, the heat will be smaller, but when the processor’s manufacturing process to a certain extent, the silicon circuit in the electronic moving faster and faster, the chip began to become overheated. Although including Intel, many manufacturers are constantly strive to solve the heat problem, such as multi core design, 3D transistor technology, but in the processor core to eight or more, many programs are not fully utilized to all of the core, which resulted in the performance of non equivalence.

Vendor strategy deviates from the Moore’s law and an important reason is currently mobile devices popular, traditional desktop has been unable to meet the people’s increasing needs, mobile equipment for the heating and power consumption of the processor has a more stringent requirements. And different mobile devices for the processor’s parameter needs are different, which led to the processor manufacturers can not be as large as before the same model of mass production of products, once again raised the cost of production of the product.

Future challenges and opportunities

Of course, from the shackles of Moore’s law, it is not entirely a bad thing. Due to the presence of Moore’s law, the hardware manufacturers more or less will according to Moore’s law to develop their own product development planning, part of the products really get rapid progress, but there are also a part of this product should be developed more rapidly, but in order to follow Moore’s law, and maintain and other manufacturers synchronization, deliberately slowed down the pace of progress.

When some more manufacturers are no longer based on Moore’s law, is bound to produce more creative and leap of the product. Software industry is the same reason, in order to pursue the ultimate efficiency, programmers can rely on the hardware platform that should be able to appear in the next few years, the preparation of more advanced applications.

On the other hand, stage accumulating electric, Samsung and other chip makers in order to seek better development, is bound to take more radical product strategies and the process of ascension to the limit, may find better chip manufacturing materials. At the same time, the quantum computer may also accelerate the development, can be faster from the theoretical stage into the actual product.

Overall, Intel replacement of the product development strategy, does not mean that the failure or end of Moore’s law, it does not mean that the semiconductor industry is going to die. Perhaps when manufacturers find a better way to develop, Moore’s law will return to another form of return to our vision.

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Storage type flash memory (NAND flash) suppliers competing to speed up the development of 3D NAND flash, market research agency dramexchange forecast, this 3D NAND flash output proportion is expected to 6% last year, sharply rising to 20% level.

Samsung global 3D NAND flash development the fastest manufacturers, in all the major personal computer generation plant has been obtained good market share; the 3rd generation of 3D NAND flash will complete product testing phase, is expected to be in this year in the second half of the year with the new notebook computer replenishment and start mass production.

Toshiba in the first quarter of this year began production of small quantities of 3D NAND flash, dramexchange pointed out that for five years after 3D NAND flash demand, Toshiba plans in the fourth quarter started the expansion of existing plant surrounding, is expected to first half of 2018 to join the 3D NAND flash production ranks.

SanDisk also began to 3D NAND flash early small trial, M14 plant in the second stage will be from the second half of this year to join the ranks of the production to meet 3D NAND flash market demand.

Meguiar’s has 3D NAND flash send sample module factory test, dramexchange expresses, Meguiar’s future will be to carry on disc and consumption of solid state disk products mainly, Meguiar’s own brand of 3D NAND flash SSD is expected this year in the third quarter early will be sent to the personal computer factory certification.

With the NAND flash supplies have accelerated the development of 3D NAND flash, set the expected state science and technology, this 3D NAND flash output proportion is expected to climb to 20% level, there will be the solid-state drive help to accelerate the popularization of.

China, Wuhan new core is expected to earth next week to build the new memory fab, dramexchange expresses, the fastest this new plant will be in early 2018 began to produce 3D NAND flash, will represent the memory industry development in China entered a new milestone.

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The first half of 2015 with a series of acquisitions Wicentric SMD (SunriseMicroDevices) Following, Arm International (ARM) recently re-shot acquisition of Israeli chip security system solutions provider –SansaSecurity, to continue to strengthen its processor silicon intellectual property (IP) and the wafer child information security protection system to further strengthen its Things (IoT) technology lineup.

An seek international technical director MikeMuller said any future networking equipment may become targets of malicious hacker attacks, so the company must pay attention to every detail of the security chip design and implement effective protection layers of protection to hacker attacks. To this end, ARM has also been actively enhanced hardware assist and trusted software protection efficacy of its products.

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In fact, ARM chip security lock technology, since the April 2015 merger wave has launched several offensives, including Wicentric with SMD, before once again closing the shopping network and mobile device security software and hardware system chip solution provider –SansaSecurity; After the company to ensure the safety of one hundred fifty million kinds of products in a year, but also the wisdom of deploying a series of security management solution devices and enterprise systems, incorporating ARM arm, it will help boost its TrustZone ARM and SecurCore processor IP’s information security protection.

It is reported that, SansaSecurity wafer protection technology to provide a complete hardware-assisted systems, additional security isolation precautions in the main application processor, make it easier for the wafer to create a data security products. In addition, the Company also through the operation of the high-end software packages in a trusted execution environment, to ensure the security of sensitive information will not drain. ARM noted that this acquisition is to allow ARM’s TrustZone technology can have extra capacity against malicious software, with system-level security requirements designed to reach all kinds of wafer and trusted security software’s.

SansaSecurity chief executive CobySella representation, Sansa’s technology has been widely used in networking and action to protect the information in an electronic device, the two companies as a partner, will be able to accelerate ARM overcome the most pressing security challenges of the wafer.

Application Status intelligent fixtures

As an important part of the smart home, smart lighting from the 1990s to enter the Chinese market. Since the initial positioning in the high-end smart products, resulting highbrow situation.

However, the rapid development of the domestic economy, increasingly sophisticated lighting technology as well as some international brands such as Dynalite (Bunge), lutron (Lutron), Wielang (Wieland) and the like to enter the Chinese market to promote the rapid development of this industry. In the 21st century, the intelligent lighting manufacturers and merchants have mushroomed rapidly growing, intelligent lighting entered the era of application.

At present, intelligent lighting products on the market has formed a series, the full range. A high degree of perfection comes Philips technology. Philips hue Series Application Zigbee wireless communication technology, provide the basis for LED lighting above, let the light in creating more convenience to people’s lives.

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You can use the mobile terminal or networked PC, remote control of the state Hue lamp. For example, the user can adjust the switching time under customary lighting, color, brightness, climate change, flicker frequency.

Hue also has the ability to self-learn environment and perception, it can make colorful lights dance music with you, it can give you when you enter the house a bunch of warm light to welcome you home, it can use the changing colors and breathing remind you of the bed.

Philips in China first launched the initial package, including three smart LED bulbs, a bridge and mounted on a mobile phone or tablet’s free APP. A bridge can support 50 bulbs. APP can run on iOS and Android two platforms.

Domestic manufacturers are more representative of the United States on the Hailang. Hai Lang on the United States and Jingdong technical team collaborated, developed by Nomad Division Series Smart Ceiling by “JD + intelligent cloud” APP (Jingdong Microunion) with local WIFI and 2.4G wireless communication technology with intelligent lighting management.

Stage of development of intelligent lighting

Intelligent lighting development mainly through three stages:

(1) energy stage, this stage is mainly to complete the transition to LED incandescent lamp.

(2) Automatic control stage, according to pre-set parameters (such as time, brightness and color) automatically “given at the right time to meet the requirements of the appropriate brightness and color.”

(3) intelligent control phase, to join in the automatic control based on artificial intelligence, cloud computing, big data, and the concept of networking, remote intelligent control lighting.

Based on the analysis of mainstream smart lighting technology

The current smart lighting market mainly involves the following three techniques.

1, dimming technology

The main method of adjusting the luminous intensity of the LED chip is changing its average operating current. Changes in average operating current general use PWM (pulse width modulation) method, that percentage proportion of time to achieve intensity modulation by adjusting power high pulse.

The color control usually RGB (red, green and blue) light mixing method, that is, by changing the red (R), green (G) and blue (B) color LED chip luminous intensity mixing different colors. Currently the mainstream lighting can bring up to 1,600 million colors.

2, the control and network communication technology

Intelligent Controller is the core of intelligent fixtures. Intelligent controller is usually a microprocessor core, and with different network communication interfaces (such as WIFI, Zigbee, RS485, etc.). Intelligent controller receives a user command interface via network communications, and make a series of actions in order to achieve lighting control according to instructions.

For example, changing the PWM value of the red, green and blue LED chips operating current control signal, resulting in a new lighting colors. The network used in the usual sense of intelligent lighting refers to things.

3, cloud computing and Big Data technologies

In order to achieve a more complex and more secure control, intelligent lighting and user is usually not one to one connection, but through the cloud server implementation. Mobile phone users app, micro-channel platform in the form of the control command to the cloud server, cloud servers according to the instructions be processed, then control instructions issued to the intelligent fixtures.

In addition to remote control, cloud server may also keep records of the working status of lamps, including switch lights, the use of long, brightness and color information, and even the use of large data ideology, to achieve self-learning function, to better serve users.

The Broadwell successor Skylake could be Intel’s main processor update the last decade. The three have previously used only internally Intel films suspect that were leaked FanlessTech. Accordingly, the also produced in 14 nanometer semiconductor bring more performance, particularly up to 41 percent increase in graphics tasks, but also longer battery life.

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According to one of the films of the Intel runtime average laptops increases by up to 1.4 hours if they are equipped with a chip Skylake the U- or Y-series. Y stands for mainstream notebooks, U for ultraportables. Intel also promises a performance increase by 17 or 10 percent.

The third BGA variant, the H-series is intended for high-end notebooks. You should bring 11 percent performance increase. The desktop chips from the S series, however, come as a LGA package, a new socket called LGA 1151st They should (namely 65 watts instead of 84 watts) also provide 11 percent increase in performance and 22 percent less TDP.

The biggest jumps makes Intel’s processor development but in the graphics area, if the films correspond to the facts. The integrated HD graphics is in the Y-series up to 41 percent faster, at the U-chips up to 34 percent, with the H-chips up to 16 percent and the S-series up to 28 percent faster.

The films contain no evidence of a K-series, which is also expected by some observers. In her the overclocking multiplier should be unlocked.

Broadwell chips had initially manufactured in 22 nanometer Intel. The conversion to 14 nanometer will have then prepares unexpected problems, which is why Intel has reportedly shifted also Skylake on August 2015.