Association of Semiconductor Equipment and Materials International (SEMI) released in July North American semiconductor equipment book to bill ratio (Book-to-Bill Ratio, B / B value) rose from June 1 to 1.05 and keep steady for eight months in a row 1 above.
SEMI pointed out that North American semiconductor equipment manufacturers three months July average order amount of $ 1.79 billion, compared with $ 1.71 billion in June increased by 4.7%, compared with $ 1.59 billion the same period last year, an increase of 13.1%.
Shipping parts, three average monthly amount of shipments in July was $ 1.71 billion, compared with $ 1.72 billion in June, a slight decrease of 0.6%, compared with $ 1.56 billion the same period last year increased by 9.6%.
Overall, the book to bill ratio is still greater than 1, the symbol of the semiconductor boom expansion, reflecting the global wafer foundry and memory speed up plant equipment investment.
SEMI also noted that the semiconductor equipment factory orders per month for three consecutive months the amount of over 1.7 billion US dollars, China and 3D NAND memory maker robust procurement, expected short-term momentum is expected to continue.
TSMC capital expenditure point of view ten billion US dollars this year, a new high, a semiconductor maker Intel, Samsung second half also accelerate the development of advanced process, expected the second half of the overall semiconductor capital spending is higher than the first half.
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