Semiconductor industry chain shortage of goods continued to spread.

Universal crystal yesterday held a temporary shareholders, for the recent semiconductor silicon wafer prices, chairman Xu Xiulan expected this year, supply and demand gap of about 3-5% next year to further expand to 7-8%, the next two years is still in short supply, can be expected This year the annual price trend of product prices will be quite healthy, 12-inch wafer or 8-inch larger than the second quarter, part of the silicon wafer rose more than 2-digit range.

She said last year, the average price of semiconductor silicon wafer per inch is 0.67 US dollars, the lowest in the past 11 years, the last quarter is lower than 0.67 US dollars, but this situation has improved significantly in January. lm317dcyr

Xu Xiulan said that the first quarter of semiconductor silicon wafer supply tight, because many customers are beginning to talk about the price of the end of the year, so the fastest price began to reflect the second quarter is expected in the second quarter silicon wafer gains will be quite obvious, some silicon wafer gains have the opportunity Up to 2 digits, 8-inch silicon wafer is also estimated that there are single-digit gains.

Xu Xiulan stressed that the overall market supply remains unchanged, semiconductor silicon fabs do not intend to expand production capacity, only to the bottleneck of the process, and demand in the fab capacity continued out, advanced process demand for rapid growth, pushing up the overall silicon Wafer demand rose, this year the overall supply side is still tight, demand continues to grow.

She expected, driven by psychological factors, the next two years is still expected to maintain the demand for silicon wafer is greater than the supply situation, supply and demand gap this year, about 3-5% next year, estimated at 7-8%.

Xu Xiulan pointed out that some of the silicon wafer demand this year, the price is expected to go up quarter by quarter, and some will be slightly revised and then continue to rise, the overall trend of silicon wafer prices is expected throughout the year will be quite healthy. qpi-5lz

In the production capacity, Xu Xiulan expected to last year’s average annual average price of 0.67 US dollars per inch wafer is expected to be more than 0.9 US dollars, including the world’s crystal and other silicon wafer manufacturers will consider expansion.

In addition, the cost of construction is now quite high, the construction of a monthly production capacity of 100,000 12-inch semiconductor silicon fab, at least 300 million US dollars, coupled with environmental standards through the relevant process and advanced process testing equipment, the overall construction Plant costs will look at 400 million US dollars, the manufacturers, the average unit price of silicon wafers is still low, coupled with the scale of revenue is not enough to make up for the depreciation of the stall, it is expected that all manufacturers will not actively expand production, Will choose to go to the bottleneck of the priority.

TDK fade out, MLCC also joined formation

In addition to silicon, the recent multi-layer ceramic capacitor (MLCC) supply chain also broke the supply of a serious shortage of prospects in the first quarter of 2017, the season may be caught in the supply of scarce situation, the legal circle rumors, the current MLCC supply gap is basically Came to 5%.

According to JAPAN ECONOMIC CENTER, a 2017 multi-layer ceramic capacitor (MLCC) outlook report, general AV devices such as mobile phones, smartphones, tablets, personal computers, etc., use a large global multi-layer ceramic capacitor , In 2017 will rise to 552.1 billion, compared with 2016, 2017 MLCC demand forecast will increase again 10.6 billion.

Traditionally, passive components MLCC is the Japanese manufacturers such as Murata (Murata), TDK, the sun induced the world, but in recent years, South Korea’s electronics factory, such as Samsung Motor (SEMCO) actively rush, MLCC market price competition has long been commonplace, But recently because MLCC profits have been very low to kill, the market demand began to return to temperature, so the MLCC bargain seems to have begun to bottom out.

The MLCC market profit margins in the past few years quickly narrowed, but also makes the Japanese manufacturers TDK came in mid-last year will fade out of the general MLCC market, TDK MLCC market is currently the fifth largest supplier, and TDK fade out , Which may make the MLCC supply side of a serious scarcity.

According to the legal community forecast, from the global multi-layer ceramic capacitor capacity is limited, if the Apple iPhone 8 in the second quarter ahead of the stock tide, coupled with the automotive electronics MLCC market demand, estimated MLCC supply and demand situation Will be more tight.

Apple’s main MLCC supplier for the Murata, the sun induced, Samsung MLCC high-end manufacturing plant, and Taiwan plant MLCC supply chain giant, Huaxin Branch, the side, Wo stretch hall is the main low-order main.

Huaxin Branch, for example, 2016 Huaxin Branch owned by the parent company net profit, up to NT $ 2,152 million, the annual growth rate jumped 78.5%, legal person said, Huaxin Branch 2016 MLCC shipments, chips Resistance and other shipments are quite robust, so driven by substantial growth last year.

While another passive component of the country giant, last year’s revenue is also a record high record, to 29.617 billion yuan, annual growth rate of 7.65%.

Recently, the latest development of 3D NAND memory R & D projects jointly undertaken by the National Storage Base, the Yangtze River Storage Technology Co., Ltd. (hereinafter referred to as the “Yangtze River Storage”) and the Institute of Microelectronics, Chinese Academy of Sciences.

According to the CEO of the Yangtze River Storage CEO Yang Shining in the IC coffee first international wisdom technology industry summit (ICTech Summit 2017) introduced, 32-layer 3D NAND chip successfully passed the electrical characteristics of the indicators test, to achieve the desired requirements.

The memory chip developed by the Yangtze River Storage and Microelectronics three-dimensional memory R & D center, in the microelectronics three-dimensional memory R & D center director, the Yangtze River storage NAND technology research and development project senior technical director Huo Zongliang under the leadership of the successful realization of the process devices and circuits Design of the entire set of technical verification, to the industrialization of the road has taken a symbolic significance of the key step.

Driven by large data needs, the memory chip is the field of electronic information to occupy the largest market share of integrated circuit products. China’s long-term in the field of memory chips facing the market demand and independent intellectual property rights and the lack of key technology difficulties, to carry out large-capacity storage technology research and related product development is imminent. Traditional flat NAND memory reduces bottlenecks while reducing cost and increasing bit-to-bit crosstalk between devices. Seeking storage technology step by step breakthrough and innovation, is the development of the next generation of memory mainstream ideas. mqpi-18lp

3D NAND is an innovative semiconductor storage technology that increases the storage density by increasing the storage stack rather than reducing the two-dimensional size of the device, thereby broadening the storage space for storage technology, but the high complexity of its structure brings new challenge. Through the unremitting efforts, the technical team to overcome the high aspect ratio etching, high selection than etching, laminated film deposition, storage layer formation, metal gate formation and double exposure of metal lines and other key technical difficulties, to achieve multi-layer stack structure of 3D NAND array lay a solid foundation.

The reliability of the memory is an important part of the impact of product quality, the main assessment features include durability, data retention characteristics, coupling and disturbance, the international field of 3D NAND public research results are very limited. The device team through a large number of experiments and data analysis, to find a variety of factors affecting the reliability of various factors, and work closely with the technical team to complete the optimization of the reliability of the device indicators, the final success of the realization of all the reliability parameters.

At the circuit design level, the integrated R & D of stacked three-dimensional arrays faces more complex technical problems than planar NAND, and needs to be analyzed and optimized in combination with three-dimensional devices and array structure. The design team modeled the three-dimensional storage structure, using the programming based on the number of layers to read, read the voltage configuration, compensate for the device characteristics with the array of physical structure of the distribution differences, reducing the impact of unit crosstalk. And, the application of a number of innovative advanced design technology to ensure that the chip to achieve product-level features and performance indicators. lm3s2412-iqc25-a2

3D NAND memory chip research and development work has been the National Integrated Circuit Industry Fund, Violet Holdings, Hubei Province, China Core Investment, Hubei Province, the strong support of the vote.

German lighting manufacturers OSRAM (OSRAM) lighting business subsidiary “LEDVANCE” sale case, recently by the German government authorities review and release, and now again by the US Overseas Investment Committee (CFIUS) approved the consent of the next to the Chinese regulatory authorities Nodded, Mu Linsen and other Chinese capital is expected to complete the transaction as scheduled this year.

OSRAM announced in July 2016, its independent subsidiary LEDVANCE will be sold to the joint bidding team, including China LED packaging manufacturers Wood Linsen, China Strategic Investment Corporation IDG Capital, and Yiwu City, the capital of the capital operation center tripod, the amount of transactions Up to 400 million euros. After the German government took into account the transaction caused by the outflow of technology, endangering national security, and thus to block and restart the review process. bsm25gd120d2

After more than three months of review, because the process did not find any evidence that the national security and public order will pose a threat, the German authorities will issue a “no proof of harm” release, only in the United States CFIUS and the Chinese authorities approved Before the case there are still uncertain factors exist. However, according to “Reuters” (Reuters) quoted the OSRAM spokesman said that the case has recently been approved by CFIUS, is now approved by the Chinese regulatory authorities can be formally adopted.

The deal was originally expected to complete the transaction in 2017 fiscal year, once approved by the Chinese regulatory approval, it is expected to be completed as scheduled transactions, when OSRAM will officially out of its revenue 2 billion euros lighting business, the future will focus on development Car lighting, intelligent lighting, special lighting and other high-margin and high-tech threshold market.

After the acquisition to change the LED pattern?

OSRAM lighting of the acquisition finally dust ended. Led by IDG Capital, China’s LED manufacturers Mu Lin Sen and Yiwu state-owned capital operations center and other Chinese consortium, the cost of 400 million euros to buy the OSRAM lighting business LEDVANCE. TrendForce LED technology industry brand LEDinside (China LED Online) Research Association reported that Ouyang said that the acquisition of OSRAM lighting highlights the international manufacturers have to look from the prospects for poor prospects for the development of LED lighting, the Chinese mainland LED lighting Manufacturers are through cost advantages and government support, LED lighting market in the future continue to sit big. udz8812

According to LEDinside statistics, in 2015 the world’s general lighting output value reached 82 billion US dollars (excluding cars and other special lighting), including LED lighting output value of about 25.6 billion US dollars, the overall LED penetration has reached 31%. But also because of the LED lighting penetration continues to rise, coupled with intense LED lighting industry, leading to the international manufacturers have abandoned the original has been operating a hundred years of lighting business.

According to public information, as one of the world’s three major lighting companies OSRAM, business consists of five major components: CLB (traditional lighting and ballasts), LLS (LED lights and systems), L & S (lamps and solutions) (OSRAM) and Sylvania (Ximiannian), and covers about 150 countries of the huge Sales channels.

In Europe, for example, 2015 revenue of up to 6.1 billion US dollars, if deducted OSRAM Opto Semiconductors, and automotive and other special lighting applications, lighting and lighting systems business revenue reached 3.2 billion US dollars. Compared to the general lighting market size, OSRAM’s market share of about 3.8%, the world’s second place. However, the future Osram light source business LEDVANCE spin-off after the future OSRAM brand in the general lighting market share will be a significant decline. The overall company’s operating objectives will also be transformed to higher gross margin LED components, automotive and special lighting. You can see the lighting manufacturers have been abandoned in the past to grab the market share, into the high value-added areas of development strategy.

With the transaction, OSRAM and MURINSON also reached a strategic supply agreement, to be OSRAM’s LED chip plant in Malaysia began operation, MORINSON will be the annual order of OSRAM to buy a large number of LED chips. For OSRAM, the sale of light source business to the wood forest to ensure that the future of their own LED chip outlet. For the wood Linsen, the new LEDVANCE will use OSRAM’s patented chip, coupled with the cost of the advantages of LED packaging, and then Osram and Sylvania brand in the lighting market siege, will accelerate the development of Chinese manufacturers in the field of lighting Market share, resulting in a win-win synergies.

China’s foreign investment is facing the challenges of foreign investment With the country’s strong economic development, Chinese companies in foreign mergers and acquisitions are increasingly active in response to their growth and development needs. Due to the global financial crisis and the degree of economic development and other factors, the United States has always been the focus of these foreign investment activities in the market. However, some Chinese companies involved in aviation, defense, Internet technology and telecommunications are facing challenges in approving the approval of the US Foreign Investment Committee (CFIUS) when they plan to invest or acquire US companies.

Before the purple group of Western Digital investment, because the United States CFIUS obstruction ended.

As an inter-agency committee of the US government, CIUS is composed of representatives from nine federal agencies, including the Ministry of Defense, the State Department, the Department of Homeland Security, and is personally supported by the Minister of Finance. If a foreigner’s “acquisition and acquisition” makes the US company or its assets controlled by foreign countries, the President of the United States has the right to investigate the impact of these mergers on national security.

All along, CFIUS has been authorized to review and investigate these transactions. Intra-investment or acquisition transactions subject to CFIUS review include US company assets, products, services or technology transactions that are considered to cause national security concerns or involve US key infrastructure.

In general, any investment that exceeds 10% of a US company’s equity, voting control or voting rights may trigger CFIUS’s review, and what is a critical infrastructure definition for national security concerns Extensive, need to be determined as a case.

For the urgent need for the development of China’s semiconductor, CFIUS is the biggest obstacle to China’s capital overseas mergers and acquisitions

Taiwanese smartphone chip maker MediaTek, in its high-performance, low-power application processor expertise will help car manufacturers and first-line industry to develop advanced digital cockpit system faith convincing, is a drill Into the growing automotive electronics market.

MediaTek and Qualcomm have the same smart phone application processor technology advantage, so that the background of the two companies to actively arm the military electronics market. Qualcomm, through the acquisition of NXP Semiconductors to expose its plans for the market to throw a shock bomb. The MediaTek is to choose a more organic approach, but also is facing a tough battle. MediaTek’s ambition to enter the automotive market is easy to understand, but the car with the market’s success will still need to wait and see. mg300j2ys50

At this year’s International Consumer Electronics Show (CES), JC Hsu, General Manager of MediaTek’s new business development division, introduced the company’s layout in the automotive electronics industry. Xu Jingquan stressed in the interview that the strength of MediaTek is not only telematics and multimedia technology, the secret weapon of winning other 77-79GH millimeter wave (mmW) radar, advanced driving support system (ADAS) camera and ultra-low power Of the visual SoC technology.

Of course, Qualcomm later in the year to complete NXP’s acquisition plan, is expected to be a sharp lead in the automotive electronics, MediaTek will also face a severe test. The face of the upcoming challenges, Xu Jingquan all do not worry. “Our customers in every field are industry leaders, including radar, video cameras and visual SoCs,” he stressed.

MediaTek intends to take advantage of the processor, high integration SoC, modems and RF and multimedia technology advantages into the automotive electronics market

CMOS radar single chip

According to market research agency IHS Markit Automotive research report, radar technology is to enhance the performance of ADAS system, the most commonly used sensor technology, is expected in 2021 radar sensor market will grow to more than 50 million sets Of the scale. fp50r12ks4c

“The experience of MediaTek in 802.11ad technology, which operates in the 60GHz band of unlicensed, multi-gigabit wireless transmission technology, and the associated IP developed with IBM, will come in handy when developing radar chips,” he said. . ”

The disadvantage of using the 60-GHz band is that the signal can not penetrate the solid material and can therefore only be restricted to a separate room. Thus, IBM and MediaTek will use the military phase array radar technology microfilm into a single chip, so that 60GHz transmitter can bypass the obstacle to send signals to the indoor receiver, improve the signal can not penetrate the solid transmission problem. Xu Jingquan explained: “Today, we use a similar technology IP R & D vehicle radar chip.”

As the cost is too high, MediaTek’s radar chip will not use silicon germanium (SiGe), but the introduction of CMOS single-chip SoC, is expected to be the first half of this year can be kind. The benefits of single-chip integration can be reduced BOM cost and radar power consumption.

Xu Jingquan said that its short-range single-chip SoC power consumption will be less than 2W, while supporting medium-distance transmission (about 80 meters) of single-chip, power consumption is only 2-3W. “Therefore, we are currently working closely with a first-tier manufacturers.”

Radar Technology Controversy

Of course, MediaTek in radar technology there are many places to work hard, especially in the face of Infineon Technologies (Infineon Technologies) and NXP, the two industry leaders.

Infineon has pointed out that the company just in 2016 had already sold 10 million radar chips, in addition, accumulated in 2015 before the chip sales reached 10 million, the data can clearly see the radar technology In the past year’s car market is how red.

Infineon’s current radar chip uses silicon germanium (SiGe), while the use of CMOS technology version is currently being developed. NXP launched at the beginning of this year’s CES known as “the world’s smallest, with ultra-high resolution 77GHz radar transceiver single-chip (7.5×7.5mm)”.

Hella, a first-tier automotive radar company with more than 15 years of experience in automotive radar, showed at NXP’s booth that the company will launch Compact Radar in 2018 with NXP’s RF CMOS technology.

Compact Radar will be used for short-range and medium-distance transmission applications, Hella original equipment, global marketing manager Kristian Doescher said: “We have completed the field test, preliminary results Hao show great prospects.RF CMOS technology allows us to Product size reduction. ”

Visual SoC: HOG and CNN

In the field of visual SoCs, Israel’s Mobileye has a leading position in the automotive vision chip market. The EyeQ chip developed by the company is also the gold standard for other companies to design, and it is not easy for the latecomers to contend with it. .

However, Xu Jingquan see this in the MediaTek opportunities. More and more automotive OEMs are now looking for a more resilient architecture when developing visual SoCs. “Some OEMs need more sophisticated image sensor related technologies to implement their sensor fusion in order to add their own algorithms.”

“Our chips will support two image processing technologies – one that focuses on traditional computer vision algorithms, such as the” Directional Gradient Histogram “(HOG), and the other on the visual SoC, which is currently being developed by MediaTek. One is focused on deep learning based on convolutional neural network (CNN) technology, and MediaTek also plans to add special local memory to the SoC to support neural networks. The visual SoC will sample in early 2018.

But why add the same computer vision and depth-of-learning technology to the same chip at the same time? “Deep learning technology can not solve every problem, and we are currently working with first-line customers to develop two technologies to meet their deeper system design needs,” said Xu.

Android system into the car system

Xu Jingquan pointed out that more and more emerging market, car manufacturers began to support the Android car infotainment system (IVI) interested in “they want to make good use of smart phones and tablet computers have been established for the existing ecosystem.

However, when asked about the Android application fragmented differences for the automotive electronics industry may bring adverse effects, Xu Jingquan confessed that there will be some worry.

MediaTek from 2014 to develop automotive electronics market-related technologies. “We currently have more than 100 employees in the automotive electronics sector – most of them engineers and some business people,” says Xu.

Research agency DIGITIMESResearch estimated 2017 annual global high-brightness LED output value of the annual growth rate of 2.8%, reaching 13.18 billion US dollars. LED industry growth momentum in 2014 reached its peak, the next few years into a gradual slowdown. To use the number of stars, 2017 will reach 3,037.5 billion, the annual growth rate of 23.9%, of which the highest annual growth rate will remain for lighting applications, up to 39.2%.

LED proportion of the proportion of use, 2017 lighting applications will account for 66%, Mobile device (mainly for mobile phones) with LED light source and large size LED backlight with a total of 20.8%, the display board and car With LED were 5.6%, 4.7%. proximity sensor

LED to use the number of annual growth rate of view, in 2017 were positive growth in order from high to low lighting, automotive, display billboards, TV backlight, Mobile device applications; the relative negative growth include Tablet, NB, Monitor, the annual reduction rate of between 5.2 to 11.9%. icm-20689

Among them, the growth rate of 2017 double-digit growth will be the application of lighting and automotive, of which the annual growth rate of lighting will reach 39.2%, estimated 2017 global LED lighting market will reach 40.42 billion US dollars, the penetration rate will be 36.7 / RTI & gt; Automotive applications, the main reason for the use of LED lights outside the light source increased the proportion of the application rate is expected to reach 15.3%.

Semiconductors are seen as one of the key puzzles in China’s industry, and the government received a huge subsidy of $ 150 billion. China’s annual imports of more than the amount of semiconductor oil, the scale of subsidies, reflecting China’s semi-conductor controlled by people extremely anxious. erj3ekf2743v

According to consulting firm Bain & Co, China’s annual consumption of more than 100 billion US dollars of the semiconductor, of which only 6-7% is made in China, the other thanks to imports. China’s goal is to reach 70% of the 2025 self-control rate.

But China is too eager to develop the semiconductor, has made the United States to be vigilant, worried that the market was distorted, fear of endangering the US semiconductor industry. The Financial Times reported that the Obama Science and Technology Commission earlier this month warned that China’s semiconductor policy has posed a threat to US technological innovation and national security, showing that the United States has increased its wary of China. obsolete electronic parts

Trout, the quasi-president of the economy, has threatened to impose a tariff of 45 percent on Chinese products, but if so, there are factories in China, Qualcomm, Intel, fear of retaliation incurred in China the same.

The “Dalian Light Source”, developed by the Chinese Academy of Sciences, has issued the world’s most extreme ultra-violet free electron laser pulse. A single picosecond laser pulse generates 140 trillion photons, making it the world’s brightest fully tunable EUV free Electronic laser light source.

In this kind of extreme ultraviolet light irradiation, the region almost all atoms and molecules are “nowhere to hide.” Therefore, the “Dalian light source” can be used to observe the physical and chemical processes associated with combustion, the atmosphere and clean energy. sn74lvcu04a

Wang Enge, vice president of the Chinese Academy of Sciences, said that this is the Chinese Academy of Sciences and China has a very high display of the major scientific and technological achievements, 90% of the equipment by the Chinese independent research and development, marking China occupies the world leader in this field Status, will greatly promote China in the energy, optics, physics, biology, materials, atmospheric haze, lithography and other important areas of research to enhance the level.

Free electron laser is a new generation of advanced light source, is also the world’s advanced countries competing development important direction in the scientific research, advanced technology, national defense science and technology development has important application prospects.

“Dalian Light Source” is China’s first large-scale free electron laser scientific research user device, is the world’s only operating in the extreme ultraviolet band of free electron laser device, is the world’s brightest extreme ultraviolet light source.

The laser can work in femtosecond or picosecond pulse mode, you can use SASE (self-amplifying spontaneous emission) or HGHG (self-amplified radiation), which can be used in the ultra-violet region is completely continuous adjustable, with complete coherence; High gain harmonic amplification) mode operation. xc4020xl-3pq160c

“Dalian light source” project by the National Natural Science Foundation of the major national instrument special funding, by the Chinese Academy of Sciences Dalian Institute of Chemical Physics and Shanghai Institute of Applied Physics jointly developed. Project in October 2014 officially started construction in Dalian Changxing Island, the end of September 2016 to complete the installation of light for the first time, creating a similar large-scale scientific device construction in China’s new record.

Intel, NVIDIA, Qualcomm chip vendors and HTC, Oculus, SONY, Samsung, Huawei equipment manufacturers are released to see a great look at the global CES2017 VR industry does not diminish, the global hardware, platform and content manufacturers flocked to Point of the new technology and flagship models. Rockchip Rockchip this showcase VR equipment program cluster, the program expanded from the broadcast terminal to the video field, a new look into the VR.

1,360 degrees VR panoramic camera equipped with RV1108 core

The product is based on Rockchip RV1108 intelligent visual image processing chip, with three major advantages to solve the industry pain points: 1, three-dimensional 360-degree panoramic shooting 2, the machine that is shot without the client second stitching 3, high-performance graphics chip ” Wide dynamic “picture quality.

RV1108 chip is Rockchip layout for IoT Internet of Things killer products, the chip embedded CEVA XM4 visual processor DSP, with intelligent image processing and other key technologies, up to 600MHz. Relying on the advantages of professional image processing unit technology, VR panoramic camera in wide dynamic, sensitivity, clarity, backlight, night vision imaging advantages.

The RV1108-based VR panoramic camera integrates high-performance encoders and enables local real-time encoding and conversion to standard VR format video, instant imaging without any postprocessing, and output video for direct viewing on any VR device.

2,3D-VR camera equipped with RK3399 core

Rockchip released 3D VR camera solution, using the flagship chip RK3399 + dual-camera input + dual ISP real-time processing, RK3399 dual Cortex-A72 core + four Cortex-A53 small core, big.LITTLE size nuclear architecture. GPU using Mali-T860 image processor. CPU aspects of integer, floating point, a huge memory optimization, with high performance, low power consumption of the product features. adum1200

The 3D VR camera solution supports a variety of algorithms that enable VR 3D video to achieve better image detail, picture quality and professional-grade 3D effects with higher-performance CPUs and image processors and software algorithms for cinema-quality and Depth of immersion.
CES2017 Rockchip 3D-VR recording solution exposure lead VR + layout

3, can support the VR-one voice recognition machine, split machine

As China’s first VR solution layout, CES2017 Rockchip showcased a mature and productive VR terminal, including a VR machine and a VR splitter that can support voice recognition, and can support VR card SD card Direct playback.

It is worth emphasizing that, for the VR split machine market demand, Rockchip supports the world’s longest Type-C extension cable. Based on Rockchip CPU and GPU powerful performance, can ensure that the image effect under the premise of ultra-long distance data transmission, can be the perfect support for operators, platform business data conversion. This is relative to the current other similar solutions, has great technical superiority. w25q80bvssig

CES2017 Rockchip 3D-VR recording solution exposure lead VR + layout

Support VR three major industry standards: 20ms millisecond delay, 75Hz refresh rate above the screen and 1K above the gyroscope refresh rate. Support 4K 360 panoramic video decoding capabilities, support 2K / dual FHD high-resolution screen, support for optical software anti-distortion, anti-dispersion, IPD adjustment algorithm and support software and hardware two sub-screen mode, and so technical characteristics.

Based on the advantages of Rockchip micro-audio and video technology for many years, this open VR split machine and voice recognition one machine is quite innovative to meet the multi-application scenarios under the market demand, product experience more advantages.

summary:

VR domain involves many levels, from the hardware to the content, from the background technology to the front display, for such a long industry chain, the ecosystem construction is essential. CES2017 Rockchip show not only a variety of forms of VR solutions, more importantly, its product line has been extended to cover the contents of the two major areas of software and hardware recording, will be beneficial to partners in the VR product line terminal manufacturers to build Highly Competitive Product Matrix.

Qualcomm Incorporated today announced that Qualcomm Technologies, International, Ltd., a subsidiary of Qualcomm Technologies, has introduced active noise reduction (ANC) technology on its CSR8675 product platform, making it the world’s first Bluetooth audio system-level chip incorporating this advanced audio solution SoC). The new feature eliminates the need for a separate ANC chip, reducing the complexity and cost of active noise reduction technology in headphones, enabling manufacturers to quickly achieve the ultimate audio experience in a compact form factor.

By integrating ANC technology into the CSR8675 for ultra-small form-factor designs, Qualcomm will bring a small form factor to its all-new design and deliver a higher-quality listening experience for consumers who prefer to use earbuds. The CSR8675 is a fully integrated Flash platform with an embedded 120Mhz 24-bit DSP. It also supports Qualcomm aptX and Qualcomm aptX HD audio technology for consistently high-quality audio over Bluetooth. 7101j52zqe22

“The demand for wireless stereo in-ear headphones and headphones is growing fast,” said Anthony Murray, senior vice president and general manager of the Internet of Things at Qualcomm Technologies International, Inc. “Users want a great audio experience in any environment, Eliminating the need to listen to music, watching video and playing games at the expense of audio quality.As the first launch of integrated active noise reduction technology, Bluetooth audio system-on-chip companies, and now we can work with manufacturers in their integration of various products Active noise reduction technology at the same time, more and more high – end headphones have experienced the noise reduction technology consumers also hope that this feature can appear in the lighter, cheaper audio headphones. erj3ekf2743v

“We have integrated the ANC CSR8675 into our active noise reduction Bluetooth headsets to provide a high-quality audio experience,” said Tom Li, executive vice president of business development for Fujikon Industrial Co., Ltd. “Since the CSR8675 incorporates ANC Technology, we can create real value for our customers in terms of both cost and performance for the end user.The playback time of the headset can be extended to around 12 hours, while the noise reduction performance can be as high as -23dB.

TSMC has been in Taiwan since 1987, 30 years of history.

It is the world’s largest foundry business, market share in 2015 up to 54%, as of December 30, 2016 its stock market value of about 145 billion US dollars. TSMC expects 2016 annual sales of up to 29.3 billion US dollars, its 28 nm monthly production capacity of 15.5 million 12-inch wafer, the market share of 80%.

The process takes a stable route from 28 nanometers to 20 nanometers to the mature process of Q2 2015 (capable of mass production and stable in terms of both efficiency and yield) of 16 nanometers. The latest 10-nanometer is expected in the first quarter of 2017 production.

In addition, TSMC is disclosed at the end of September last year, in addition to actively developing 5-nanometer process, the more advanced 3-nanometer manufacturing process has also been organized 300 to 400 people in the research and development team. xc6slx75-3fgg484c

However, the success of TSMC is not achieved overnight, and other successful companies, has its internal and external factors together.

External factors are driven by Moore’s Law, IC research and development costs remain high, and plant investment costs, so after the process into the 28 nm (around 2010), many IDM factory fabless strategy ( Fab-lite), began to embrace OEM.

On the other hand, it is the support of the industrial environment in Taiwan, in particular, can provide a full range of foundry services and gathering talent, which is why the foundry industry in Taiwan alone can be a dominant one of the main reasons.

At the helm of TSMC, TSMC has become the internal factor in TSMC’s success. TSMC has chosen the right direction for TSMC at a crucial point in time. TSMC’s sales also increased from US $ 2.3 billion in 2000 to US $ 8.98 billion in 2009 and 2016 Year of 29.3 billion US dollars, 16 years of time turned nearly 13 times. frb-wt145

Summed up the key points of TSMC may have the following three aspects:

1, at the end of the century IBM 0.13 micron, copper process and Low-k technology transfer, and self-developed

As the process progresses to the 0.25-micron stage, the resistance and capacitance increase in the wiring system due to the sharp increase in the number of metal wires and the decrease in the metal wire width, resulting in a time delay (RC Time Delay) Seriously affecting the overall circuit operating speed.

To solve this problem there are two ways, first, the use of copper wire when the lower resistivity material; to replace the aluminum before, because copper resistivity than aluminum is also three times lower. The second is the use of Low-K Dielectric (low dielectric insulation) as the dielectric layer material.

At that time, IBM first released copper process and Low-K materials 0.13 micron new technology, and to find TSMC and UMC to sell. TSMC after consideration, decided to reject IBM and its own R & D copper process technology; and UMC chose to IBM to buy technology, and to develop.

However, due to IBM’s technology is limited to the laboratory, the manufacturing yield is too low, not up to volume production. By 2003, TSMC’s 0.13-micron process technology stunning debut, customer orders turnover of nearly 5.5 billion Taiwan dollars, UMC is about 1.5 billion Taiwan dollars.

Nvidia CEO and President Jen-Hsun Huang said: “0.13 micron TSMC transformation.”

2, 2009, the second comeback Zhang Zhongmou

In the financial crisis, TSMC made a major decision, so when the CEO of Cai Li line class and the second comeback of Chang. And Chang’s return again, it seems that TSMC long wings, let its followers catch up, consolidate the status of the world’s leading foundry.

According to statistics in the 2010-2016 period, TSMC’s annual investment accumulated up to $ 58.5 billion. In the market economy can have the courage to invest heavily to show its strength.

3, adhere to the foundry model does not waver

Global foundry from the beginning is not optimistic about the industry, especially the United States and Japan market is not recognized OEM prospects, so the global foundry has been Taiwan stand out.

Analysis of the two main reasons, first of all, then the foundry process technology behind the mainstream IDM plant at least 1-2 generations, so OEM can only be used as the second source of IDM capacity; the other is in that Period that the design of the OEM orders for processing to have the technical leakage of doubt.

Today, including Samsung, Intel, etc., they are seen as IDM foundry, that is both for their own products, but also to help others foundry, so Apple has been to “Samsung” ideas, worried about their own Technology leaks. TSMC always adhere to the foundry model, never compete with customers for orders, so there is no leakage of customer technology problems.

TSMC’s contribution to the global semiconductor industry

Under normal circumstances, IC products, sales of foundry sales of 2.5 times, which can be calculated in 2016 TSMC IC products driven sales of 73.25 billion US dollars (29.3 billion x2.5).

If the global IC sales in 2016 according to 275 billion dollars (excluding discrete and optoelectronic devices, etc.), the TSMC’s contribution to the global IC reached 26.6%, indicating that more than 25% of global shipments of integrated circuits is TSMC’s foundry processing.

According to June 6, 2016, Zhang Zhongmou shareholders at the shareholders meeting, “pointed out that the TSMC has reached four major milestones in 2015, including the 12-inch wafer shipments of 8.763 million, an annual increase of 6.1% ; 28-nanometer advanced process revenue accounted for 48%, better than the previous year’s 42%; TSMC can provide 228 kinds of process technology, 470 customers for the production of 8941 different products; for six consecutive years in the wafer industry market share Rise, reaching more than 50%.