CEVA to develop ultra-low-power Always-On vision sensors for IoT

CEVA, the world’s leading signal-processing IP-focused company specializing in smart interconnects, and Himax Imaging, Inc. and Himax Imaging, Inc., and emza Visual Sense, Inc., have announced the development of the industry’s first dedicated signal processing power and cost- Always-On IoT Smart Sensor. This WiseEye IoT sensor will be on display at the 2017 Consumer Electronics Show (CES) in Las Vegas, USA, January 5 to 20, 2017.

The WiseEyeIoT sensor solution is a specific solution developed with the goal of Always-On and low-power vision detection. By integrating Himax’s unique low-power CMOS imaging sensor, CEVA’s low-power vision processor and emza’s unique machine vision algorithms, the powerful, low-power detection and tracking environment that can be detected in just a few milliwatts solution. This subversive sensor enables low-cost IoT systems to achieve advanced Always-On intelligence for the detection, tracking and identification of objects, humans and animals. This intelligence is used in front-end equipment, only the relevant information is transmitted to the network, which is to reduce the transmission bandwidth and visual inspection network deployment costs are necessary. Target applications include virtual assistants, wearable devices, connected home sensors, residential security, geriatric protection, automotive, intelligent building systems and smart urban infrastructures. 88e1011sa5-rcj-c000

“Our image sensors have been the most advanced in power consumption for a long time,” said Amit Mittra, Chief Technology Officer of Himax Imaging. “We have developed an ultra low power sensor specifically developed for IoT using leading expertise. “Working closely with emza, we combine our sensors with the industry ‘s best processor and machine vision algorithms to deliver a truly unique Always – On context – aware sensor solution that can handle virtually any application.

“Machine vision-based sensors enhance the intelligence and functionality of any device, and our WiseEyeIoT solution is designed to bring these capabilities to the vast, potentially IoT space,” said Yoram Zylberberg, chief executive officer of emza Visual Sense. “Himax and CEVA, two leading experts in sensor and vision processing, are the ideal partners to achieve the industry ‘s first Always – On intelligent vision sensor. bcm6818kfsb

“Low-power intelligent vision processing is a key part of CEVA’s strategy to achieve smarter connectivity, and we are pleased to partner with emza and Himax for the introduction of Always-On intelligent vision detection,” said Ilan Yona, vice president and general manager of CEVA’s Visual Business Unit. (WiseEyeIoT) delivers outstanding performance and battery life, and can support a large number of deployments in price, helping to realize the true potential of machine vision in IoT.

Intel develops quantum computers with silicon: Better reliability than superconducting materials

December 22 morning news, Intel is planning to use existing hardware materials to develop quantum computers. Through the quantum mechanism, quantum computing can bring more powerful computing performance.

Competitors IBM, Microsoft and Google are all developing quantum computers, but these quantum computers are very different from today’s computers. Intel plans to use the current silicon transistor material to achieve the quantum computer.

A team of Quantum Hardware Engineers located in Portland, Oregon, is working with researchers at the QuTech Institute of Quantum Research at the Delft University of Technology in the Netherlands. Last year, the two sides jointly set up a scale of 50 million US dollars of the project. Earlier this month, Intel reported that an ultra-clean silicon film could be grown on top of standard silicon wafers used in chip factories for quantum computing. frb-wt145

The basic unit of a quantum computer is a qubit. Other companies use superconducting circuits to implement qubits, but the number of qubits is limited. Intel’s new technology in this regard is further.

A quantum computer requires thousands, or even millions, of bits to perform useful functions. Jim Clarke, director of the hardware project at Intel, said silicon-based qubits are more likely to do so (Intel is also looking at qubits based on superconducting materials). “One big advantage of silicon is that the industry has built up a lot of expertise in this area, and there are ready-to-use devices that can help the quantum bit grow faster,” he said. xc6slx75-3fgg484c

Another reason for developing qubits with silicon transistors is that the reliability of the silicon qubits is better relative to the superconducting materials.

TSMC denies that the 10nm process yield is not as good as expected

TSMC first came to the exclusive 10nm production for the new iPad’s A10X processor, there is the latest news that 10nm yield problem, fear of Apple’s original schedule in March next year, published a new iPad was forced to postpone the schedule.

Unnamed sources said TSMC originally scheduled to begin production in the first quarter of next year, ten nanometer chips, but the nano-process yield “lower than expected” may affect the shipment progress. If the chip supply is low, Apple would have to stretch the time to prepare for inventory. Taiwan Semiconductor Manufacturing Company spokesman Sun Youwen Yan Zheng refuted, this is false rumors, please outsiders do not listen to rumors, and the company will not respond to false rumors.

Earlier market adoption iPad will use the most advanced 10-nanometer process A10X chip, not only lower power consumption, function and thermal efficiency is also better, so save more space, function beyond the iPhone 7 currently used in the A10 chip. A10 chip is currently used in 16-nanometer process. frb-wt145

However, AppleInsider pointed out that Apple has not specifically for the “X” chip using more advanced process, such as the Apple A9 and A9X mainly used is 16 nm, only part of the A9 with 14 nm.

Rumors of the market Apple will launch the first quarter of next year, three iPad: 12.9-inch iPad Pro 2, respectively, there are low-cost version of the 9.7-inch iPad, plus the new size of 10.5 inches iPad Pro. Earlier came the 12.9-inch iPad Pro 2 and 10.5-inch iPad Pro, will be equipped with TSMC ten nanometer chip.

The same 10-nanometer process will also be used to produce A11 chip, as the iPhone 8 processor, but is expected to be in the second quarter of next year will begin production of A11 chip. xc6slx75-3fgg484c

Legal persons believe that even if the market rumors are true, the new process in the early yield is not high is normal, because every process has been learning curve, but the current high level of TSMC technical capacity, will be able to ship before a large number of good The rate of a substantial increase in order to meet customer demand for production capacity, estimated that the impact is not significant.

Intel uses silicon transistor materials to develop quantum computers

According to the news, Intel is planning to use existing hardware materials to develop quantum computers. Through the quantum mechanism, quantum computing can bring more powerful computing performance.

Competitors IBM, Microsoft and Google are all developing quantum computers, but these quantum computers are very different from today’s computers. Intel plans to use the current silicon transistor material to achieve the quantum computer.

A team of Quantum Hardware Engineers located in Portland, Oregon, is working with researchers at the QuTech Institute of Quantum Research at the Delft University of Technology in the Netherlands. Last year, the two sides jointly set up a scale of 50 million US dollars of the project. Earlier this month, Intel reported that it is now possible to grow an ultrapure silicon film on top of standard silicon wafers for use in chip factories for quantum computing. lm2936mp-5.0

The basic unit of a quantum computer is a qubit. Other companies use superconducting circuits to implement qubits, but the number of qubits is limited. Intel’s new technology in this regard is further.

A quantum computer requires thousands, or even millions, of bits to perform useful functions. According to Jim Clarke, director of the hardware project at Intel, the silicon-based qubit is more likely to do so (Intel is also looking at qubits based on superconducting materials). “One big advantage of silicon is that the industry has built up a lot of expertise in this area, and there are ready-made devices available that will help the quantum bit grow faster,” he said. uevm4460g-02-01-00

Another reason for developing qubits with silicon transistors is that the reliability of the silicon qubits is better relative to the superconducting materials.

Samsung Electronics may purchase cell phone batteries from LG Chemicals

According to “Chosun Ilbo” reported that Samsung Electronics is working with LG Chemical negotiations, intends to be classified as smart phone battery supplier.

Samsung Electronics is the world’s largest smartphone maker, the company’s Galaxy Note7 phone before the encounter “fried machine door”, while the battery is mainly from Samsung SDI and China Amperex Technology procurement. lm317dcyr

“Chosun Ilbo,” quoted industry executives as saying that Samsung Electronics and LG Chem reached 90% of the probability of transactions, the two sides are expected to begin trading from the second half of next year.

Samsung Electronics spokesman has not yet comment, LG Chemical spokesman declined to comment.

Samsung announced in early September this year, recalled 2.5 million Note7 mobile phones, and that the reasons for failure from the Samsung SDI battery. But in the use of Amperex Technology Battery Note7 also occurred after the explosion, the company made this phone to stop production, the decision to stop selling. qpi-5lz

Analysts said LG Chem currently supplies cell phone batteries for LG Electronics and Apple.

Micron second-generation 3D NAND at the end of mass production

This year’s DRAM memory, NAND flash memory prices to save the company Micron, they formally acquired the company on Monday, China Branch, the memory business even more powerful, and flash memory, Micron has also announced two good news – the company’s 3D NAND flash memory capacity Has more than 2D NAND flash memory, the cost of the first generation of 3D NAND flash memory in line with expectations, the stack layer to 64 layers of second-generation 3D NAND flash memory is on the road, the end of this year will mass production.

For 3D NAND flash, we are no strangers, and now the market is turning to a lot of SSD 3D NAND flash memory, whether performance or capacity or write life, 3D NAND flash memory than traditional 2D NAND flash memory is much better, manufacturers will Thereby reducing costs and increasing production. To Micron, for example, their 2D NAND flash memory is the main 16nm process, MLC / TLC flash memory core capacity, but 128Gb, ​​while the 3D NAND technology MLC flash core capacity has 256Gb, TLC is to 384Gb, much higher than the 2D NAND Flash memory. ms3348-8-10

In turn, 3D NAND, the strongest Samsung runs fastest, Toshiba / flash Di, SK Hynix followed, Intel and Micron is relatively slow, but once the 3D NAND flash memory production, due to capacity congenital Advantage, more than 2D NAND flash memory capacity is a matter of time. Micron CFO Ernie Maddock at the Barclays Bank Global Technology, Media and Communications Conference to confirm that the company’s 3D NAND flash memory capacity and 2D NAND flash memory has come to the inflection point, that is 3D flash memory capacity (in bit capacity) More than 2D NAND flash.

Ernie Maddock also mentioned that their first generation of 3D NAND flash memory has achieved the desired goal of reducing costs, after Micron pointed out in the first half of this year’s road map 3D NAND flash than 2D NAND at least 20% lower cost, has now achieved 20 -25% of the cost reduction. ms-470n

For Micron, the good thing is more than this one, their second-generation 3D NAND flash memory to mass production, earlier Micron announced that the second generation of 3D NAND this summer in Singapore Fab 10X factory production, compared to The current 32-layer stack, the second generation of 3D NAND flash stack layer to 64 layers, capacity to further improve the cost will be further reduced by 30%.

China third-generation semiconductor SiC power module R & D and industrialization projects started

In the future, the electric car running on the road, there will be “Chinese core” and “Xiamen core”, and rechargeable battery life will be greatly extended. Recently, the core technology of Xiamen Co., Ltd. Third – generation semiconductor power module industrialization project started the ceremony.

“Previously, the new energy vehicles related devices rely on imports to solve our project put into operation, they will be fitted with ‘Xiamen core’.” Xiamen core light moisturizing Technology Co., Ltd. executive vice president Xu Xiaohui said that the new energy vehicles charge a power Can run a longer mileage, will be a silicon carbide power module packaging plant project one of the highlights. udz8812

Core light moisturizing planning a total investment of 2 billion yuan, mainly for the third generation of semiconductor silicon carbide power module design, development and manufacturing. Semiconductor silicon carbide power devices have also been hailed as the industry power converter device “CPU”, the green economy “core.” Silicon carbide (SiC) power module project advantages embodied in: new energy vehicles increase endurance, air conditioning thinning, ultra-high voltage transmission convenience. 135d117x0075k2

Microsoft and Intel announced the Project EVO program will create a new PC

In the October Microsoft conference, the scene has demonstrated a cooperation with the PC business VR head, with HoloLens has the same Inside-out tracking technology. At the recent WinHEC2016 conference in Shenzhen, Microsoft announced a long-term partnership with Intel to work together to make the PC more secure, with artificial intelligence properties, and to increase the reality of mixed and gaming features.

The cooperation plan between the two sides is called Project Evo.

“Intel is a stunning partner,” Microsoft executive vice president Terry arrived in China this week, after a foreign media said. “In the past we have worked together to do a lot of innovation.Now we will continue to use a new way to promote PC development, to provide consumers with a new experience.

“Through the Project EVO project, we will integrate our innovations to show PC’s unique possibilities and future direction,” said Navin Shenoy, Intel’s senior vice president at WinHE. “We believe that computers will be More incredible video, including smarter voice interaction, virtual reality and mixed display experiences, support for more powerful games, enhanced privacy and identity protection, are all closely tied to computers. ” sbl2040ct

It is understood that the two companies will be released in 2017 a series of new PC, but want to start the user, there are some threshold. These PCs will have the following innovative features from Microsoft and Intel:

Far-field communication and voice activation. This feature allows the user’s voice through the room, wake up Cortana (Microsoft Hina, personal intelligence assistant). The technology requires software and a new microphone.

New security features. Two years ago, Microsoft worked with Intel to implement Windows Hello (biometric authorization) face recognition on Intel’s RealSense camera. The next year, we will see the results of this feature, and also see the new security features for Win10, such as the built-in Microsoft Intel ligent Security Graph, and Intel-supported security intelligence and analysis. nup2105l

Mixed reality. Microsoft open Windows Holographic to the PC business and the first significant business, while compatible with the Window10 system. In 2017, Microsoft is determined to make hybrid reality mainstream.

New game features support. Some new gaming features such as support for 4K resolution, High Dynamic (HDR) Wide Color gamut (WCG), stereo surround sound (first implemented on Holoolens), and the Xbox handle will convert Windows 10′s role in the game via Bluetooth.

IBM Watson unifies Pfizer to use machine learning for cancer drug discovery

IBM Watson and Pfizer reached a new agreement, the former will be the supercomputing capacity for cancer drug development.

Pfizer will use Watson for Drug Discovery’s machine learning, natural language processing and other cognitive reasoning capabilities for new drug identification, combination therapy and patient selection strategies in immuno-oncology.

Watson for Drug Discovery is a new cloud platform designed to help life sciences discover new drug targets and indications for alternative drugs. Watson’s main attraction is its ability to handle massive amounts of information, which can help researchers view different datasets, discover new associations through dynamic visualization, and suggest hidden patterns. nud4700snt1g

Researchers read 200-300 papers a year on average, while Watson has read 25 million abstracts on Medline, more than 1 million full-text medical articles, and 4 million patent documents, all of which are regularly updated. According to Pfizer, many researchers believe that the future of immuno-oncology is a combination of unique tumor characteristics that will change the paradigm of cancer treatment, so that more cancer patients get treatment. The use of Watson’s cognitive ability in drug development may lead to a new, potentially new, immunotherapy of cancer in patients. tps54620rgyt

Immuno-oncology is a cancer treatment that uses the body’s immune system to help combat cancer. Pfizer will use Watson to analyze a large number of heterogeneous data, including authorized and public data, as well as Pfizer private data to analyze and test theoretical assumptions, gain new insights.

Waterproof Powerful Touch Peripheral Controller New components make Microchip MCU even more powerful

Microchip Technology Inc., a leading provider of integrated microprocessors, mixed-signal, analog components and flash memory intellectual-property solutions, today announced the addition of its new ATtiny817 / 816/814 microcontroller family of microcontrollers A new enhanced touch peripheral controller (Peripheral touch controller, PTC). The new PTC element is a compact, cost-effective, high-performance core independent peripheral (CIP) that enables high-performance capacitive touch functionality on standard microcontrollers. The PTC has excellent water resistance, the user can easily through the START programmer configuration settings.

CIP is a component that is designed to be self-sustaining without requiring code or CPU supervision. As a CIP component, the Touch Peripheral Controller simplifies touch sensing and provides the designer with the flexibility to focus on other aspects of the application. proximity sensor

Touch solutions that use PTC components combine advanced noise handling, water-resistant touch functionality and low-power touch-trigger operation. IEC 61000-4-6 has a conduction immunity of 15Vrms, which allows customers to easily pass the most stringent EMC standards, especially in the home appliance and automotive markets. Powerful water-resistant touch allows the product to be used outdoors, greatly enhancing the user experience. In addition, it enables advanced sleep and wake-up capabilities at lower power consumption and is ideal for wearable and other battery-powered applications.

The ease of use is further enhanced by the software support provided by Microchip’s ecosystem. The ATtiny817 is the first line in the product line to obtain web-based tool chain START program configurator and QTouch? Code compact modular firmware library support products. As a web-based tool, START allows users to always benefit from the latest and most advanced touch library. wire strippers

“Microchip will continue to be a leader in touch technology,” said Fanie Duvenhage, vice president of Microchip’s Touch Sensing Division. “As we build this new touch-controlled peripheral, we continue to provide designers with easy-to-use applications But also in the waterproof performance and anti-noise performance to break through the limit.This effort is in exchange for a performance class CIP components, it ATtiny817 / 816/814 series, and in the future for most MCU can be described as Is an icing on the cake of the components.

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