September 12, 2016, Samsung Electronics in South Korea made a decision at a high-level meeting, will split the printing sector, and it will become a subsidiary of an independent, then its 100% stake in overseas assets to 1.05 billion US dollars Amount, and sold to the global printing equipment giant HP (HP). According to the resolution, Samsung officially announced on the 1st of the printing department into a subsidiary of “S-Printing Solution”, after the sale in preparation for the sale of the merger plan will be completed in the second half of 2017.

According to foreign reports, Samsung’s current head of print business and vice president Kim Ki-ho, the future will become the new company “S-Printing Solution” in charge. The Samsung split in the print sector, and sold to HP, the future will use its funds to focus on core business. However, although Samsung has decided to sell the business to HP. However, before the completion of the acquisition transaction, the printing business is still owned by Samsung. The merger, the Samsung market in Korea will still retain the brand. QCA150A60

It is understood that, in the “S-Printing Solution” after the establishment of the future will continue to South Korea and China in the production of products, and through the world with 50 sales outlets to sell products. Samsung’s revenue in the print sector is about 2 trillion won ($ 1.75 billion) in 2015. In the future independent of the “S-Printing Solution”, the company said, will continue to provide support for printing software.

However, after Samsung’s decision to sell the print business, employees in the division immediately set up an emergency planning committee and protested because employees were concerned that work could be hurt. After the staff and Samsung Electronics management reached an agreement, all of the 6,000 employees will remain in the Samsung Electronics continue to work. However, because all employees can not ensure the right to work. Therefore, Samsung Electronics agreed to pay 60 million won per employee (about 353,000 yuan) of subsidies. QM150DY-H

In mid-2016, Intel announced that it will work with BMW (Germany) and Israel Mobileye to jointly develop autopilot vehicles, and the product will be available in 2020. Missed the era of mobile Internet, Intel will be the field of Mo’s Law then into the era of autopilot? Although doubt, but also worth the wait, at least the influx of competitors, the industry’s future clearer.

Intel, which is believed to have missed out on the mobile Internet era, has recently turned its attention to the field of autopilot, but Intel does not seem to be too early in this year’s hot autopilot. Fairchild Semiconductor

It is reported that semiconductor giant Intel (Intel) ready to invest heavily in the field of autopilot cars, the development of autopilot dedicated car processor.

Moreover, the current Intel has been set up within the automotive solutions division, began to carry out related research and development plans.

The report notes that in the past, the development of personal computers, Intel has almost become a personal computer processor, the word.

However, with the gradual decline of the personal computer industry, Intel also had to transition to other areas of development. In the upcoming era of autopilot, Intel also hope to copy the success of personal computer processor experience.

In fact, the autopilot is actually a computer-controlled car. Therefore, the autopilot vehicle’s processor chip must be able to handle a large amount of information coming from the sensors, cameras, and so forth of the self-drive vehicle to analyze and deal with the current traffic, surrounding environment, and road anomalies. Steering wheel, brake, fuel and other systems to implement the appropriate control. skyworks

Intel’s Automotive Solutions Group, Elliot Garbus, general manager of a recent interview, said the self-driving on the intensive data processing business, its strength is similar to the current high-performance servers used in the processor.

So, in essence, an autopilot is a data center that travels on wheels with wheels on land.

Elliot Garbus also stressed that the future of autopilot dedicated car processor in addition to strong processing performance, Intel is also prepared to allow the processor with diversity and adaptability.

A few days ago, Intel’s global vice president and president of China, Yang Xu in Beijing, said that by 2020, with the needs of all things network amplification, sensors and hardware equipment to increase, only a car will produce the data will reach 4000GB / day , Coupled with other areas more large, based on this, we are bound to usher in the data outbreak era.

As in the past, personal computers, automotive processors can also be applied to a wide range of vehicles. In this regard to observe, in the eyes of Intel, auto-driven car has become a personal computer, smart phone, the other a large number of processor chip applications.

Therefore, Intel hopes to accelerate development, to seize market share.

Over the past period, Intel has been completely in the smart phone processor market fall, the market hand over to the American Qualcomm (Qualcomm) and Taiwan MediaTek.

Today, in the autopilot segment, it is clear that Intel has lagged behind Google, Uber, Tesla, and many of the traditional large-scale depots in terms of car-driving systems.

Therefore, Intel in this area, began to focus on the direction of transfer, the past is good at the processor development.

In mid-2016, Intel announced that it will work with BMW (Germany) and Israel Mobileye to jointly develop autopilot vehicles, and the product will be available in 2020.

In this partnership agreement, Intel plans to focus on the development of good processor chip, and Israel Mobileye company in computer image recognition, machine learning, and data analysis and other fields.

In addition, in May 2016, Intel also acquired a computer vision recognition company Itseez, was considered to be for the field of self-driving technology.

Of course, in the field of auto-drive car chip, Intel will also face a large number of strong competitors challenge.

This includes Nvidia, Qualcomm, and Renesas. In fact, in the face of the global PC market decline, Intel has been looking for its own position. Before, Intel has been in the Internet of things chip, UAV chip market and other extensive investment.

However, the size of these markets is still very limited, can not make up for the computer processor chip market decline. Today, Intel hopes to be able to drive a car in the wave of auto-sharing a market to recover the future development trend.

In the Chinese market, yesterday Intel and Red Flag, Neusoft tripartite cooperation announced the development of “smart cockpit”, Intel on October 25 the latest release of Intel Atom car processor (codenamed: Apollo Lake), this car processor to support virtual And seamless support for automotive infotainment systems, digital instrumentation and car navigation systems and other high-definition screen use and interaction.

Of course, Intel also has its unique advantages, in its business focus will be transferred to the data center chip and Internet access device chip in the process, in the data center processor market, Intel has more than 99% market share. At present, only Intel can provide all the components, including hardware, software, storage, network and security technologies to limit the efficiency and reduce costs.

Intel, through its acquisition, has already begun building its automotive portfolio with Wind River to partner with automakers and suppliers, as well as software companies such as Green Hills, QNX and other key partners to deliver software-oriented Define unmanned solutions.

Missed the era of mobile Internet, Intel will be the field of Mo’s Law then into the era of auto-driven auto it?

Although doubt, but also worth the wait. At least the more influx of competitors, the future of this industry more clearly.

Researchers at the University of Illinois have developed a new thermal control method for gallium nitride (GaN).

GaN transistors have higher power densities than conventional silicon transistors and can operate at higher temperatures (below 500 ° C), but GaN transistors, like all semiconductors, also generate excessive heat, which limits their performance.

Cooling methods based on heat sinks and fans add cost and volume. Now, a team of researchers at the University of Illinois’ micro-nanotechnology labs has created a new approach that claims to be simple and low-cost. smbd-101

Using computer-aided design, Kan Bailam’s team has demonstrated that the thickness of the GaN layer plays a large role in overheating, affecting the thermal expectations and final performance of the device.

“Thinner and colder,” says Byram, “traditional GaN transistors are deposited on thick substrates (such as silicon, silicon carbide), but this is not an ideal thermal conductor.” The challenge, he says, Epitaxial mismatches on the substrate, which results in devices that are tens of microns thick, and in many cases hundreds of microns.

“This has a very poor effect on heat dissipation, taking into account the heat source as the gate narrows at the submicron level,” Beylam said. The use of novel semiconductor release methods, such as smart cutting and peeling, a GaN transistor that can be released from the remaining epitaxial and thicker substrates, can benefit from improved thermal control. mt47h64m16hr

“By refining the device layer, you can reduce the high-power GaN transistor 50 degrees Celsius hot spot temperature.” Byram said.

The research leader Kehun Parker believes there is a limit to device thickness. “If you reduce too much, you get the opposite effect, actually increasing the temperature inside the device,” Parker said. For a typical device, the optimum thickness is about one micron.

The work, they say, is important because it provides thermal-design guidelines for GaN-based transistors. The optimal layer size is closely related to the device interface thermal resistance (TBR), which is a condition for the existence of GaN epitaxial layers and other interfaces.

“We determined the optimal thickness of the GaN transistor’s hot-spot temperature, depending on the value of the TBR, and the size of the layer depends on how the device will be used.” If it is for higher power applications, then ideally you need more Thin, sub-micron thick layer. ”

The next step for the Illinois team is to study the electrical properties of GaN layers, such as engineering diamonds and epitaxial graphene, before actually fabricating GaN transistors on substrates.

The Illinois study was funded by the Air Force Academy of Science (AFOSR) Youth Research Project Grant No. FA9550-16-1-0224; the results were published in the October 10, 2016 Applied Physics Letters B1 page.

Global semiconductor capital spending is expected to fall 0.3 percent to $ 64.6 billion in 2016, slightly higher than the 0.7 percent decline forecast for the previous year, according to Gartner.

Gartner said the market is expected to grow by 7.4% in 2017.

“We see a return to growth in the semiconductor industry in the last quarter of 2016,” said David Christensen, senior research analyst at Gartner Inc. “In 2017, wafer manufacturers will focus on introducing high-capacity 10-nanometer products, with memory makers focusing on 3D NAND flash. ”

A few years ago, smart phones, mobile devices, solid state drives and things will continue to lead the semiconductor market development, especially foundries, for these devices to produce most of the wafer chip. hmt41gv7bmr4a-h9

Although the smart phone shipments slowed, but 4G LTE in the field of high-end smart phones led to the rapid development of advanced chip technology needs, and China’s smart phones using fingerprint sensors, touch-screen drive and AMOLEDs full use of 200mm wafer generation Factory 0.18 micron wafer technology.

From the device point of view, the 2016 first half of the DRAM situation is even worse, mid-market bottom. Now supply and increased demand led to the second half of the market supply shortage. Early 2017, weak demand environment will result in over-technology, but then 2017 and 2018, the industry will be in short supply of the phenomenon. QCA150A60

After nearly three years of oversupply, the third quarter of 2016 NAND shortage of obvious, 3D NAND production challenges remain. 2017 is expected to see the balance between supply and demand. The second half of this year, a large number of new capacity and 3D NAND technology matures, will promote the balance between supply and demand.

In 2016, wafer manufacturer’s 10nm product and memory manufacturer’s 3D NAND to promote wafer-level manufacturing equipment spending growth of 6.4%.

“The global semiconductor industry is maturing, with annual growth dropping from more than 10 percent a year to the current 4 to 5 percent per year, driving the industry to maintain a positive M & A trend.” NXP Semiconductors President and Chief Executive Officer Richard De Kelaiming recently in an exclusive interview.

In 2015, the global semiconductor industry mergers and acquisitions more than 120 billion US dollars. Into 2016, and have burst the news of the semiconductor giant mergers and acquisitions, including generous, including Japan’s Softbank spend about 32 billion US dollars acquisition of British semiconductor and software design firm ARM, the United States to 3.56 billion US dollars of micro-technology cash and stock acquisition competition Rival Atmel, Japan’s Renesas to 3.229 billion US dollars acquisition of the United States and Intel. erj3ekf2743v

In the division of thunder, the global semiconductor industry into maturity, the increasingly fierce market competition, the industry will seek to further enhance the integration of mergers and acquisitions, the future there will be an amazing amount of the transaction M & A offer. According to his judgment, the global semiconductor industry will become increasingly centralized trend, the development trajectory may follow the Western military industry, from the initial hundreds of thousands, through constant survival of the fittest, mergers and acquisitions, eventually evolved into a specific area only Supported by several giants.

“In this trend, NXP can not stay out,” Kelaiming said, NXP hopes through mergers and acquisitions, will be more advantages of combining technology to provide customers with comprehensive solutions. For example, NXP completed the end of the acquisition of Freescale, to bring more market opportunities. Data show that the acquisition of Freescale’s new NXP market valuation of more than 40 billion US dollars, annual revenues of more than 10 billion US dollars, became the world’s largest supplier of automotive electronic components. 422lp9r

Transnational semiconductor giants in the active participation in mergers and acquisitions market at the same time, with particular emphasis on deep plowing prospects are generally optimistic about the Chinese market. According to professional research institutions statistics, in 2015 the size of the Chinese market reached 1102.4 billion yuan, becoming the world’s largest consumer of semiconductor products.

Klein once said that NXP in the Chinese market has been the implementation of sound expansion policy, and Datang, millet, the United States and many other Chinese enterprises around the unmanned, mobile payment, intelligent life and other content cooperation. Not long ago, NXP also Changan Automobile, Neusoft Group set up “China Automotive Information Security common interest group” to jointly promote the hardware-based automotive safety industry standard set up and application. This is the NXP in the global market, the first joint local automotive industry, software companies launched automotive safety organizations. Section Lei Ming told reporters that the establishment of this car information security team is critical to NXP. “In the field of unmanned vehicles, the opportunities in the Chinese market are much greater than in other regions, so we have to find the right partner in China to complete the business.” Klein said NXP will provide the Chinese market with Unmanned solution with core technology.

According to reports, NXP is headquartered in Eindhoven, the Netherlands, Philips in 2006 stripped of its own chip and semiconductor business was founded. As the world’s leading semiconductor manufacturer, NXP provides solutions for interconnected automotive, network security, portable and wearable devices and the Internet of Things. With more than 60 years of expertise and experience, NXP has operations in more than 35 countries, with annual revenues of $ 6.1 billion in 2015.

According to foreign media reports, Samsung announced a wearable device for the chip Exynos7 Dual 7270 – the first use of 14-nanometer wearable device application processor.

Samsung in 2015 began production of 14-nanometer smart phone chip. Applied in the international version of Samsung GalaxyS6, S6 edge and Galaxy Note5 Exynos 7420, Samsung is the first 14-nanometer chip, Samsung will now use advanced 14-nanometer process to produce wearable device chips.

The Exynos 7270 integrates two ARM CortexA53 cores – striking a balance between efficiency and performance. Samsung said the Exynos 7270 consumes about 20 percent less energy than its 28-nanometer equivalent chip due to its 14-nm process. hd74ls00p

Interestingly, the Exynos 7270 is also integrated with an LTE Cat.4 modem, meaning that the wearable device configured with the chip transmits data directly from the mobile carrier’s network without the need for a mobile phone. In addition, it also supports WiFi, Bluetooth and FM technology.

Exynos 7270 Another selling point is that it integrates CPU, wireless module, DRAM memory and NAND memory. Samsung said the solution could reduce chip thickness by about 30 percent, which would allow wearable equipment manufacturers to design thinner wearable devices without sacrificing performance or performance.

Samsung did not disclose the first time that the wearable device with Exynos7270 was available for sale, but vendors interested in it already had access to reference platforms – including Exynos 7270 chips, NFC chips and a variety of sensors – to start product design ahead of schedule. lm2594

Although Samsung did not mention, but the industry speculation, Exynos7270 will be the core of Samsung GearS3 smart watches. GearS3 is expected to be released as early as this month.

NXP Semiconductors in China officially released i.MX 6ULL ​​application processor, its energy efficiency than similar products to enhance the market up to 30%. I.MX 6ULL ​​is designed for value-oriented engineers and developers to help them develop cost-effective solutions for the growing consumer and industrial markets of the Internet of Things. The processor has a secure encryption function, in an advanced way to achieve single-core ARM? Cortex? -A7, provides a variety of memory interfaces and integrated power management module, greatly reducing the complexity of the use.

“Cost efficiency, ease of use and low power consumption are important factors in the success of innovative applications of the Internet of Things,” said Geoff Lees, NXP senior vice president and general manager of the microcontroller business. I.MX 6ULL “At higher performance and at competitive prices, our customers are able to provide a better user experience for their users.” xcr3128xl-10vqg100c

I.MX 6ULL ​​function

As the newest member of the i.MX 6 family, i.MX 6ULL ​​introduces a single-core Cortex-A7 processor with up to 528 Mhz operating frequency, 128 KB L2 cache, and 16-bit DDR3 / LPDDR2 support. This product is perfectly integrated power management, security unit and a wide range of connectivity interfaces, providing a secure Internet of things application performance scalability and low power consumption. The i.MX 6ULL ​​processor has a compatible and expandable packaging option, where 14 x 14mm is the ideal choice for simple and low cost PCB designs, and 9 x 9mm for space-constrained applications. lm8801tmx-2.9 nopb

“As a more energy-efficient Cortex-A-level core, this product is a natural upgrade to previous ARM7 and ARM9 architecture products, and the feature set, price and energy efficiency of i.MX 6ULL ​​can help us to make China a better place for China,” said Zhou Ligong, Market development of the next generation of smart grid monitoring system.

According to media reports, Nagano Prefecture, Japan Karuizawa-cho held in the Group of Seven (G7) Ministerial Conference on Transport adopted a joint declaration on the 24th, the main content for the realization of automotive autopilot technology as soon as possible commercial, will develop international safety standards cooperation. In addition, in order to speed up the research and development of advanced technologies such as artificial intelligence (AI), the G7 countries “will cooperate and play a leading role in the future”, and will set up working groups to solve the problems besides guiding manufacturers.

“The regulatory framework for regional disagreement tends to be understood in the same direction,” said Ishii Keiichi, chairman of Japan’s Land and Infrastructure Administration. “If international standards are to be made, car dealers can sell in countries around the world The same car, is expected to cut costs by virtue of production. pcm-5820-g0b2

The declaration points out that automatic driving into commercial use will lead to the prevention of traffic accidents, achieve efficient logistics and reduce the burden on the driver effect. It is also emphasized that mobility is also expected to improve for the elderly and the sparsely populated areas.

In order to help businesspeople to realize business as soon as possible, the Declaration will strive to develop internationally harmonized safety standards and avoid over-regulation that hinders technological innovation.

The new working group will study the human and AI exchange of information for the manual drive conversion when the system is abnormal during autopilot. The Declaration also affirms that, to avoid the risk of AI being attacked by a cyberattack as a result of a car being out of control, it will provide guidance to assist in refining the United Nations agencies’ ongoing research. xc3s200-4tqg144c

Brokerage research report that the intelligent network of cars will be the most development potential of the future industry. Intelligent network of vehicles will be initially commercialized by 2020, the industry will usher in the next 5 to 10 years of investment opportunities. From the major car companies and Internet giants announced plans to see 2020 will become the first year of unmanned vehicle commercialization, and from this into the explosive growth of car networking and auxiliary driving systems and other related industries is expected to take the lead in the benefit.

2016 PT exhibition gradually coming to an end, at the First 5G Innovation Development Forum, Chinese IMT-2020 (5G) to promote the group announced the end of the first pilot phase 5G.

Communication Development Division, Ministry of Information Industry and Information Wen Ku, said at the meeting, 5G standardization work has already kicked off, R & D and experimental work has also entered into a crucial stage.

It is understood that the main phase of the completion of the performance and functional testing 5G wireless network and key technologies, including: large-scale antenna, the new multi-site, multi-carrier new, high-frequency wireless communication, seven key technologies, and network chips, mobile 4 network edge computing key technologies.

The specific role that the phase of the trial fully proves the key technologies in support Gbps rate user experience, end-millisecond delay, the technical feasibility of one million connections per square kilometer, and other diverse 5G scene needs to further enhance the industry 5G promote innovation. uln2308

IMT-2020 (5G) to promote the group in February 2013 by the Ministry of Industry, Development and Reform Commission and the Ministry of Science jointly promote the establishment, there are at least 56 members of the unit.

China 5G technology research and development trials started in January 2016, it is divided into key technology validation, verification and technical solutions system solutions promote the implementation of the three stages of verification. bul6802

We have completed the first phase of the trial, participating companies Huawei, ZTE, Datang Telecom, Ericsson, Nokia Shanghai Bell, Intel, Samsung and abroad a total of seven companies.

It is reported that the second phase of the trial will focus on for the mobile Internet, high reliability and low latency and low power consumption connection three typical scenarios 5G wireless air interface and network technology development and test program, and plans to complete before the end of 2017.

Flash market is continuing to subvert the enterprise storage market. In fact, statistics show that business accounted for half the flash (EMEA) of total sales in Europe, Middle East and Africa region. Flash memory systems to achieve double-digit growth, especially in the whole flash memory array (All-Flash Arrays), user value grew by 113%. Why is changing the flash memory market? And what new technologies might subvert the market in the near future?

Only the beginning of the particular application

When the first new enterprise flash device, originally in order to expand the existing hard disk storage, will flash as the storage layer or cache. The goal of this approach is to enhance performance, while preserving the most commonly used data sets (Data Sets), so that the expensive flash memory capacity is reduced to a minimum as a whole. trg30r120

However, this configuration relies on complex procedures to ensure that appropriate information is located in the cache or storage layer, so that users are looking for smarter and more cost-effective way to combine flash memory devices.

There are more and more companies want to transfer the full data set to the flash memory device, to achieve excellent and consistent application performance. This is also one of the main trends pushing SSD market growth, thereby promoting lower prices, improve product appeal and expand the scope of deployment. Past we hope to achieve high-performance business, you may need to purchase a number of SSD, causing prices to exceed your budget. Today, at a lower purchase price, also have the same performance.

Despite falling prices, but the SSD prices are still relatively expensive. Such solutions are still only using a small number of affordable company, and only used for a specific category of app. However, consider using SSD businesses, although capital spending is still the most important issue, but in lower operating expenses SSD performance is indeed remarkable. adsp-21mod870-000

SSD are coming out of its own way

Initially, it was in accordance with the HDD look and feel to the design and development SSD. SSD uses SAS and SATA interfaces, since the effectiveness of the two interfaces used in HDD well, providing ample bandwidth, the same interface on an existing PC architecture more convenient to use. However, the advantages of SSD technology far beyond that, so the SSD with SAS and SATA, its effectiveness is also limited play.

Recently, we found that a flash solution, as more and more SSD adopts PCIe interface, which is due to the direct connection can bring more excellent than the server type SATA and SAS performance and shorter delay time. SSD are coming out of its own way, using the new interface for higher performance, and give full play to the characteristics of small volume.

Now the most common enterprise software, such as the latest version of Windows and Linux, have been upgraded to support the use of NVMe standard interface PCIe SSD. For the implementation of Windows and Linux server operating system, companies do not have to buy the exclusive driver can directly communicate directly with flash architecture.

Users can now easily import flash memory devices store environment, do not have the same problems as in the past to manual control, Windows system can recognize native storage device is directly operational, providing more powerful Plug converter .

The third platform drive SSD adoption

Center for flash memory devices have been developed for a long time. Statistics show that the whole array of flash memory market continues to lead the expansion of the flash, the value of the user at an annual growth rate of 113 percent to lead the expansion of the flash memory market, and to provide excellent product portfolio. These products are simple, flexible, scalable scale of services and provide consistent high performance, do not cache and stratification, the most important is to have a lower overall total cost of ownership (TCO). As we have seen, they are moving towards reducing the number of components of the overall data center trend.

More specifically, the SSD drive growth in part because by the “third platform” transfer drive; the “third platform” is used to explain a number of trends in the deployment of data center structures. This refers to the use of more standardized commercial blocks, build flexible and scalable infrastructure, more efficient and more cost-effective way of operating data centers.

Kind of like the Facebook platform, the first to use the third large scale company, from the beginning to use SSD as the construction of the block (Building Block). Although HDD technology research institutions that are not designed for use with the case, but the SSD is the “key technology push hands, change the overall storage situation, and to achieve a third platform,” as the third platform concept is widely accepted, but also to the needs of the SSD on the rise.

Looking to the future

Looking to the future, fiber NVMe or “flash on line” (Flash on the wire) will become more common. Such external PCIe fiber-optic network, the Internet could become a full array of flash memory in the future. Flash fiber users do not have to flash memory device into the old server, and flash technology can be integrated into the direct connection of the environment, reduce network latency. NVMe standard also helps device management, so that multiple vendors can operate in the same manner under the centralized command and control.

In addition, the next generation of non-volatile flash memory can also come to the fore. In PCM-based flash fiber optic solutions with forward-looking, and represents the next generation of new memory occurs, performance guarantee beyond previous flash device, and close to the speed DRAM. Expected in the coming years, these devices will work with the new SSD integration, provide better functionality, and implement more sophisticated new analysis in the future.

Flash memory devices are growing at an alarming rate, mainly due to the flash market matured significantly over the past years and find their footing: SSD and HDD has been out of the tangled past, use its speed potential and form factor advantages, to achieve a more easily accessible and more convenient target.

At the same time, the development of infrastructure also represents the flash device is more popular in the workplace is no longer a complex issue plagued IT departments, flash solution can begin functioning immediately installed today. Finally, the trend is to make all kinds of core data center platform toward the third direction, SSD drive further growth in demand. Flash trend will not disappear, and a new wave of flash technology have emerged.