BMZ provides manufacturers not only probably the largest selection of advanced battery-frame integration solutions in the market, but also scores with improved battery cells.

One of the major trends in e-bikes is the visually and functionally successful integration of the battery pack. BMZ provides manufacturers of probably the largest selection of sophisticated frame integration solutions in the market.

One of the highlights of BMZ are the new Gigazellen that achieve significantly better performance than the cell types previously available.

The Gigazellen of BMZ will be available from the 2017th With these cells completely new designs and application scenarios can be realized. Because the cells have 60% of the cell count of around 120% of capacity compared to current cell technology. ms27110

BMZ is the first vendor to introduce this type of cell for the 2018 season. Fast charging technology for highest practical benefits BMZ also shows the latest charging technology are among the highlights at the Euro Bike.

With the new technology batteries can be fully charged within an hour in the future. The long load times during longer trips, the past will soon be a thing. BMZ is the first vendor to introduce this type of cell for the 2018 season.

Functional installation combination UR-V7

Modern electric bikes see themselves as autonomous vehicle category and are far more than a bicycle with an attached e-bike functionality. These BMZ has created about the UR-V7 is a rack-mountable combination of load-bearing tube and the supple integrated battery pack.

This elegant integration its debut on the Euro Bike 2016 and addressed the Model 2017, is therefore approximately April 2016 to customers are available.

The solution addresses those customers who can not fully develop due to new requirements of local markets or want. The standard solutions of BMZ here offer the opportunity to customize the rest of the vehicle, while taking advantage of the built development degree in larger series battery packs. 20t201da2

Available them then left the downtube battery V7 with 36 Volt nominal voltage. Depending on the model, the battery provides 9 to 14 Ah and 310-630 Wh energy content available. With 40 Li-ion cells, the battery pack weighs in 2.9 kg.

According to the latest “2016 ~ 2021LED industry demand and supply database” shows that since the Apple iPhone 7/7 Plus Four mounted LED flash, will have the opportunity to lead other smart phone brands follow this specification.

The LED flash is doubling the number of new iPhone, will add new LED market growth momentum. LED flash estimated market value in 2016 will reach 744 million US dollars (about 4.954 billion yuan), the annual growth of 9% in 2017 flash LED market value will rise to $ 811 million (about 5.4 billion yuan).

Since Apple introduced into color temperature LED flash in 2013, high-end mobile phones equipped with two different color temperature of the LED has become the market consensus. Apple’s iPhone 7 series, re-launched equipped with four LED flash module makes use of Flash LED number doubled again. fp50r12ks4c

Since Four LED flash to provide fill light to a higher brightness, color plus staged upgrade, so low light shooting even better. It is expected to be driven by other smart phone brand manufacturers follow. But because LED flash market entry threshold is not low. Especially in the optical design requirements center illumination intensity, light shape four sides uniform, high color rendering. In addition, the thickness of the smartphone requires more light, LED under limited volume, to achieve a sufficiently strong light illumination is a major threshold.

At present, it is possible to enter the LED flash LED manufacturers supply chain is relatively limited. Especially apples conventional LED flash suppliers in the past are in Lumileds based, next-generation iPhone response to the new specification, but also to import Japanese LED manufacturers among its supply chain. mg300j2ys50

As for the other LED manufacturers in Asia, including China Taiwan’s Everlight, Lite, and Jinko, poly fly photoelectric, South Korea’s Samsung LED mainland China also has a place in the market among the LED flash. The future need to look at other smartphone brands import plan. Once the other mobile phone brand manufacturers follow out Four LED flash, LED flash demand will drive the market, as well as LED module price increase.

Dell announced the completion of 60 billion US dollars acquisition of EMC merger agreement, the largest merger in the history of the birth of the scientific community.

The new company will be named as science and technology, Dell (Dell Technologies), aims to be a one-stop shop of IT business, will be based in the seat of EMC – Hopkinton, Massachusetts. The new company’s business focus will shift to cloud services, and to advance the field of server and storage consolidation. On the other hand, the global leader VMware EMC’s desktop to the data center virtualization solutions will continue to be an independent listed company.

Hopkinton, Mass.-based EMC is a company with a 36 year history of commercial data storage products company a market capitalization of about $ 50 billion. And is headquartered in Round Rock, Texas, Dell in the 1990s with cheap, customizable laptop fame, Dell in 2013 to $ 24.4 billion price is privatized. erj3ekf2743v

Dell and EMC consolidation is made in response to their respective core businesses are for the overall market decline. Computing market focus has shifted to mobile devices, servers and cloud computing.

According to IDC statistics and projections, PC shipments fell 10.4% in 2015, fell a further 7.3% in 2016. On the other hand, server, storage and network hardware market since 2014, has been in decline over the next four years is expected to decline by 1.4 percent per year.

Dell and EMC merger will achieve two complementary advantages. As the world’s third largest PC vendor Dell product very attractive for SMEs, while EMC’s storage products are obtained large enterprises pro-Lai. Analysts believe that, after the merger, Dell will be able to sell more products EMC customers.

Michael Dell said that with the enterprise computing market to new technologies and cloud services, traditional server and storage hardware market will restructure. “We know how to win in the restructuring,” he said. “We have proven in the past, we will once again prove that.” 7201k2zge

This originally October 12, 2015 announcement of the transaction took almost 11 months to complete. Dell and Silver Lake Partners (Silver Lake) Investment Group received more than 40 billion US dollars of financing through the issuance of bonds. In addition, Dell also through the sale of its IT services and software sector raised $ 5 billion.

This year the global economy is expected to slightly better than last year, semiconductor, TSMC, UMC, ASE, SPIL and other indicators of Chinese semiconductor companies in Taiwan this year, revenue and earnings will be better than last year and the industry pay the average level of success, said the global semiconductor Taiwan art manufacturing and packaging and testing remain the leading position.

Taiwan IC design industry in the second quarter and the first half although the value is beyond the continent, but the semiconductor industry, said Taiwan’s IC manufacturing and IC packaging and testing industry posterior segment remained the leading edge, leading the trend can still be maintained for some time.

The world’s leading foundry TSMC of Taiwan’s semiconductor industry growth pushing up more credit. TSMC R & D investment of nearly four years and ranks first in the Taiwan factory, in recent years, annual investment of several hundred billion Taiwan dollars, is Taiwan’s semiconductor industry leader.

Earlier this year, TSMC revised semiconductor industry growth rate to 1%, but remains confident TSMC chairman Morris Chang revenue this year, earnings annual growth rate can be up to 5-10%, continued to rewrite the record. Analysis of the industry, TSMC operations continued success this year, mainly due to monopolize A10 processor Apple OEM orders, plus 28-nanometer manufacturing process maturity to maintain 90% of global market share, 7 nm production in the future will also be a global leader.

TSMC optimistic about the next few years to maintain stable growth in revenue and profitability, mainly due to the smart car, augmented reality (AR) ╱ Virtual Reality (VR), artificial intelligence (AI), intelligent worn, combined with the large data and high data transport, and other four development not only change the future of human life, it also pushes up the next wave of innovative applications of semiconductor growth.

ASE and SPIL will benefit from smart phones and high-end graphics chip packaging and testing needs to increase revenue and profit performance this year will be better than last year.

The world’s leading semiconductor test equipment Chairman and Managing Director Advantest Taiwan Wuqing Huan said that the second half of the semiconductor boom is good, despite the recent visibility is not good in the first half, but the second half should be flat, especially the packaging and testing industry, the economy is pretty good year. Wuqing Huan noted that while global smartphone demand growth slowed, but is still pushing up the main semiconductor growth momentum, coupled Things drive smart car, smart home and intelligent urban development, these networking needs are subject to short, light chips, in both the chip miniaturization and low power consumption, high-end packaging and testing will push up growth.

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Global Artificial Intelligence (AI) boom rise, face the huge potential application chip business, the chip maker has already gearing up to get into, driven by increasing competition, means that NVIDIA had, by its GP-GPU computing initiative in the data center market has made great progress is currently using GPU chip processing depth learning (DL) neural network applications has become a mainstream kind of AI,

According to Venture Beat reported that the site, which Intel (Intel) Data Center Jason Waxman, general manager-cum-vice president of corporate team issued a counter-attack, saying Xeon chip is the absolute leading products worldwide AI server market.

Waxman noted, Xeon server chip in the global AI market dominant position and share of the global chip market to support AI application server more than 97 percent market share, but only less than 3% of the AI ​​server device is the use of GPU, even if there has been a lot of outside We are talking about GPU machine learning (ML) values. NVIDIA is equal to the argument to make a comeback.

Waxman said the industry needs to break open and scalable computing power, in order to promote broad developer community innovation. Intel Developer Forum (IDF), the program also shows how the introduction of AI industry leading platform.

Intel had previously disclosed that its code-named “Knights Mill” next-generation Xeon Phi processors will be published in 2017, and locked in the AI ​​field. Intel Xeon Phi processor pointed computing power will be superior to the current GPU chip on the market, called Xeon Phi training faster than 2.3 times faster GPU, which NVIDIA has written rebuttal Intel, both sides of Taking exchange of fire intensified.

Prior to Intel to more than $ 350 million acquisition of Nervana Systems, thereby strengthening its own AI technology. With the visible chip market increasingly competitive industry are ways to strengthen its own technology is also increasing.

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Association of Semiconductor Equipment and Materials International (SEMI) released in July North American semiconductor equipment book to bill ratio (Book-to-Bill Ratio, B / B value) rose from June 1 to 1.05 and keep steady for eight months in a row 1 above.

SEMI pointed out that North American semiconductor equipment manufacturers three months July average order amount of $ 1.79 billion, compared with $ 1.71 billion in June increased by 4.7%, compared with $ 1.59 billion the same period last year, an increase of 13.1%.

Shipping parts, three average monthly amount of shipments in July was $ 1.71 billion, compared with $ 1.72 billion in June, a slight decrease of 0.6%, compared with $ 1.56 billion the same period last year increased by 9.6%.

Overall, the book to bill ratio is still greater than 1, the symbol of the semiconductor boom expansion, reflecting the global wafer foundry and memory speed up plant equipment investment.

SEMI also noted that the semiconductor equipment factory orders per month for three consecutive months the amount of over 1.7 billion US dollars, China and 3D NAND memory maker robust procurement, expected short-term momentum is expected to continue.

TSMC capital expenditure point of view ten billion US dollars this year, a new high, a semiconductor maker Intel, Samsung second half also accelerate the development of advanced process, expected the second half of the overall semiconductor capital spending is higher than the first half.

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According to the Nihon Keizai Shimbun (Nikkei) reported that Japan’s Renesas Electronics semiconductor plant (Renesas Electronics) is working with the U.S. analog power management IC industry Intersil (Intersil) final acquisition agreement.

It is reported that Renesas acquisition amounting to about 3,000 billion yen (about 30 billion US dollars), with the latest on the 19th NASDAQ stock show, Intersil worth over $ 2.1 billion calculation, the extra premium of 38% of the acquisition will be acquired, fastest It is expected to reach an agreement before the end of August.

Renesas merger Intersil menace

Nikkei pointed out that the annual market size of over 30 trillion yen in the global semiconductor market, because the smart phone demand slowdown, the relevant industry to seek a breakthrough, the research focus shifted to autopilot about 3 trillion yen per year scale, electronic engines and other automotive semiconductors market.

Renesas semiconductor technology itself can have a province in the field of automotive, automotive microcontrollers market share is highest in the world. But with electric vehicles, automatic drive research and development trend is a growing trend, with a car equipped with a gradual decline in demand for microcontrollers, coupled autopilot proud art sensors are not required for communication Renesas, so from a year ago from Renesas that is looking to acquire overseas companies and strengthen the relevant art production line.

Therefore, Renesas merger Intersil’s purposes, that is for automotive semiconductor market. Intersil power management semiconductor industry not only has a high market share, operating profit margin of about 20 to 29%, and Intersil in the automotive and industrial machinery, smart phones and other communications also hold the key semiconductor technology, ensure that the electronic circuit is maintained at a certain voltage, low power consumption and support functions.

Another advantage is that Intersil, whether small smart phone, large voltage industrial infrastructure industrial control requirements, Intersil Jieyou corresponding product. The future will be expanded to electric vehicles, fuel cell vehicles with power semiconductors.

In addition, Intersil customers throughout the United States, Europe, Asia and emerging markets, Renesas is expected amplified by the acquisition vehicle by the semiconductor production line as well as overseas markets.

Renesas depending acquisition Intersil as a new growth engine

Currently in the car with the semiconductor industry, with revenue calculations, the world’s largest 2015 acquisition of Freescale (Freescale) Dutch automotive chip maker NXP (NXP), followed by the British-2014 acquisition of International Rectifier Ling (Infineon), Renesas have in recent years due to the abolition of the cause of loss, turnover decreased by 40% in five years, which ranks third down. However, Renesas is expected after the completion of the acquisition sum, beyond Infineon consolidated revenue, ranking second in the world.

Renesas to complete the acquisition sum, shareholders will acquire all shares. The acquisition of funds for the existing Renesas 400 billion yen in cash, and the other to consider a bank loan. Renesas sum acquisitions is pushing for several years in layoffs, and after the entire utilities and other structural reforms, and it will be regarded as the cause of open by the merger will strengthen the existing areas of strength, an important engine for the development of the new page.

In particular, since the field of semiconductors for automotive technical standards and safety requirements are very strict, is not conducive to the development of the new Societe Generale, Renesas that the current in automotive semiconductor market still retain a high degree of competitive advantage.

Founded in 2010, Renesas, since 2011, the Great East Japan Earthquake find themselves in crisis, told Japanese officials and the public fund industry innovation institutions and Toyota Motor (Toyota Motors) and other funding until the 2014 fiscal year (2013/4 ~ 2014/4 ) is still the main structural reforms, finally waxing.

Since June the new president took office this time around Wu Jing in an interview with Japanese media said the response to the autopilot, electric cars have become popular in the field, Renesas Electronics will run in turn defense into offense, particularly as automotive semiconductors cutting-edge areas like research and development requires huge expenses, no longer to hold down operating costs for the center of gravity.

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As optimistic about MediaTek’s first 10 nanometer advanced process production X30 high-end mobile phone chips are expected to be next year in the first quarter production, the challenges of high-pass high-end mobile phone chip dominance, the recent foreign corporation secretly layout MediaTek shares, nearly a month cumulative buy 22000 stake jumped from 56-58%. Legal persons that third quarter revenue continued to record high in the fourth quarter off-season, next year with the launch of the new chip is expected to rebound in gross margin.

MediaTek as widely expected quarter operating revenues with innovative high in July consolidated revenues of 24.819 billion yuan to maintain a high standard of performance, a record second highest on record, the three products are seeing seasonal demand, in addition to high-end smart phone series helio sustained heavy volume emerging market demand rose, the third quarter of the previous quarter continued tight capacity is still not fully meet the market demand, expected third-quarter revenue showed double-digit growth in the second half than the first half, raising the annual growth rate of annual revenue to 25%.

Recent continue to buy foreign corporate MediaTek in addition to steady operation this season, mainly optimistic about the first quarter of next year to announce the latest Helio X30 processors, advanced mining TSMC 10 nm process, according to analysis of foreign websites, the ten core chip architecture, with two sets of the latest 2.8 GHz ARM Cortex A73 core, added four 2.2GHz Cortex A53 and four 2.0GHz Cortex A53, comprising 10 core division, three carrier aggregation technology to support LTE Cat.10 Cat.12, excellent overall performance, performance will surpass Apple A11 even beyond the Qualcomm S830.

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According to domestic sources, said Samsung is testing its next-generation mobile processor Exynos8995, 10-nanometer FinFET process, the maximum speed can reach 4GHz, Xiaolong 830 the same power consumption and rumors among the high-pass, allegedly Qualcomm Xiaolong 830 Processing maximum operating frequency is only 3.6GHz. In other words, the next Samsung Exynos chip or to provide a great power efficiency.

Samsung is expected next year GalaxyS8 smart phone may be the first use Exynos8995 processors. However, for now, the move to 10nm manufacturing process, is still very difficult. Intel originally planned to make the switch this year, but the plan has been delayed, and launched a stopgap product, show 10nm process is more difficult than expected. The same thing may occur in the mobile chip industry. So 10nm processor is absolutely impossible to become next year’s flagship product.

Second, the industry has just shipped and use of 14nm chips, Qualcomm Snapdragon 820 and 821 processors are the first products of this process, in theory, there is room for improvement, it is unlikely that the rapid introduction of next-generation manufacturing process The product.

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US Bureau of Labor Statistics released August 5, July 2016 cum semiconductor electronic components manufacturing employment month by 2,800 to 35.92 million, the lowest on record since statistics began in 1985.

Statistical data well-known human resources agency Challenger, Gray & Christmas, Inc August 4 released in 2016 from January to July the US computer company declared layoffs Heda 49,464 people, 94 per cent increase compared with the same period in 2015, including 7 month 9,875 people.

US June retail sales of electronics and home appliances reduced by 4.7%, the biggest drop since December 2015, the ninth consecutive month below the level a year earlier, the highest since August 2008 to February 2010 the longest downturn level .

Global hard drive maker Seagate (Seagate Technology plc) July 11 announced organizational restructuring plan announced June 29 (note: it was announced the layoff of 1,600 people) after, before the end of the fiscal year 2017 the world will lay off about 6,500 people, equivalent to 14% of the total number of employees.

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