At the International Supercomputing Conference, held this year in Frankfurt, we have the opportunity to meet HP’s high-performance computing and large data newly established general manager Bill Mannel, the department attributed to under server business unit.

HP’s high-performance computing and large data contains the blade server hardware revenue with some of supercomputing equipment, the two categories, but HP’s concerns focus primarily on its Apollo HPC server line with the large body of data processing capabilities.

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In October last year, HP has released its Apollo 8000 and 6000 servers, which is a professional server after HP’s acquisition of the manufacturer Convex Computer in 1995 launched the first super computer products. And in May this year, Hewlett-Packard and persistent efforts to launch Apollo 4000 and 2000 product lines to seize the low-end market.

Bill Mannel is a once in a 25-year veteran of the effectiveness of SGI, he joined Hewlett-Packard in the 10 months before and Hewlett-Packard, Texas Houston, Apollo systems engineering team. The launch of the new design height for the so-called “efficient supercomputer,” he said, which is equipped with a cooling system can be further improved server density and reduce energy consumption.

We do not know that was established in March this year, the number of business units under the jurisdiction of employees, HP has not made this has been clearly stated. But from the point of view of revenue, Mannel responsible management is under the high performance computing department of the largest server hardware business, since September 2014 IBM x86 server business will be sold to Lenovo, the king of the throne of the supercomputer market is also thus attributed to HP all.

According to the latest market survey released by IDC, Hewlett-Packard Company in the first quarter of 2015 the global high-performance computing server hardware revenues accounted for 36% share in the field, while HP and Lenovo respectively 17% and 15% share, followed.

At the same time, IBM company in the field of high performance computing server sales in the first quarter was only 4.7 per cent ratio (the ratio of the current overall IBM / Lenovo parties market share of 20%), the figure of 30% compared with 2014 results Compared to a serious shrinkage.

In the major high-performance computing hardware vendor among HP has been trying to take advantage of IBM out of the market after the uncertainty caused to the customer sentiment further expand its market share. Mannel that HP is the most considerable scale manufacturers, and his staff are under the jurisdiction of the server market with the most favorable position to win. According to IDC’s forecast, this part of the profits of hardware products in 2014 increased by $ 10.2 billion in 2018 of $ 15 billion.

Traditional supercomputer users (including the research labs and high efficiency, etc.) still continue to buy these products, but business users is relatively faster growth rate, which is due to high-performance computing and big data analysis are combined to help them build a new products and services categories.

And corporate customers is the primary aim in mind, Hewlett-Packard, Mannel said HP is “one of the few have the technical expertise, one of the world’s financial strength and distribution capabilities, and vendors.”

“When you plan worth up to 300 million to 400 million US dollars of transactions, corporate customers need confidence in their suppliers,” he said, adding that HP’s financial services team can consider the contract when the customer to provide a great help.

But HP’s weaknesses still exist, for example, compared with rival Hewlett-Packard sold high-performance computing hardware in storage capacity is still relatively weak.

But this should be relatively easy to solve the problem: Hewlett-Packard company’s main technical team “to calculate the thrust”, Mannel pointed out, this way, we can ensure that HP has in actual sales were introduced more storage professionals.

The bigger challenge is how to enter the top supercomputing field, where an order can bring tens of millions or even billions of dollars in revenue.

Although Hewlett-Packard to 178 devices on the list of achievements in the latest list of the world’s five hundred supercomputing glory without the two, but it can burst into the top 100 seating only six sets of equipment, the top twenty is completely not seen trail.

Exchange their roadmap

To support the proposed Mannel “hundred concern” target, HP announced this week supercomputing technology alliance with Intel, in its establishment, the past few years, HP has been keeping a similar partnership with Craig.

First, HP has begun to high-performance computing Intel announced in April a scalable system to provide development assistance framework. According to the prevailing view, HP will most cutting-edge technology solutions from chip giant’s inclusion among Apollo’s own server, including the upcoming Xeon Phi processor, Omni-Path Interconnect network technology and Intel’s Lustre parallel file system, Enterprise Edition.

In addition, the two sides will carry out more cooperation in the background, including weekly dialogue and exchanges of Engineers show Hewlett-Packard and Intel.

The two companies will jointly calculate Grenoble within HP Performance Center of Excellence cooperation and establish a new computing center in Houston, to help customers more smoothly planning a high-performance computing solutions, when rewriting the code Getting help and independent software developers have more options. We hope that through the cooperation, we can usher in a more industry-specific practical workload customized software solutions.

Leading foundry TSMC yesterday (10) announced revenues of 59.95 billion yuan in June, month by 14.5%, for the 15 months to the lowest monthly, annual reduction of 0.6 percent, but for more than three years from April 2012 See the first big surprise of the market.

TSMC’s second-quarter revenue outlook, although in line with the target, but even two months of decline, next Thursday (the 16th) will be the debut of the law say will be more important, will be about the next wave of semiconductor ethnic and TAIEX performance. TSMC is the second quarter cumulative consolidated revenues 2,054.4 billion yuan, quarter by 7.4 percent, reaching 2,040 million median earnings forecast to $ 20.7 billion.

Legal analysis, net revenue in February month by more than 28 percent of the Lunar Spring Festival, June revenue decrease month TSMC the largest since January 2013.

TSMC since June 29 dividend 4.5 yuan since continued at discount status, coupled with the stock market crash through the week, on the 9th and then fell to close at 1.5 yuan to 136.5 yuan, compared with 141.5 yuan reference price ex-dividend trading, fill rest of the road is more distant. In addition, three major corporate continued this week sold 45,100, including foreign selling in excess of 40,000.

Legal view, the operating pressure of the semiconductor industry this year, many manufacturers have begun to revenue decline year over year, especially from May to June, the recession at home was significantly increased, TSMC’s revenue in June also appears rare “recession” for the semiconductor and electronics industry passes him warning.

So far, semiconductor manufacturers, only the ASE, King Yuan electricity and a few packaging and testing plant in June to maintain positive growth in revenue, the upstream IC design industry MediaTek, Novatek Realtek so into recession crisis, SPIL, Qi State force into no exception.

TSMC will be announced next week, France said second-quarter profit, and release the third quarter operating outlook, as representatives of the entire semiconductor TSMC, especially the most upstream of the kinetic energy of the electronics industry, IC design stake upstream and downstream packaging and testing, distributors season performance, seen as an important semiconductor boom fortunes trial balloon.

Lu shares plus the debt crisis turmoil, the second half cast variables, including pen TV plant Asus has downgraded estimates annual notebook shipments, legal view, PC market conditions in the third quarter should not be too optimistic.

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GlobalFoundries has local time on July 1 announced it had completed the acquisition of IBM’s Microelectronics Division. The deal announced late last year, IBM will make its located East Fishkill, New York, Essex Junction, Vermont foundry and transferred to GlobalFoundries. At the same time, GlobalFoundries will be the full measure of its staff, over 16,000 patents, paid $ 1.5 billion in cash, and get to the IBM chip ten-year exclusive supply agreement.

For GlobalFoundries, the value of IBM researchers and engineers is self-evident. The company believes that human capital will become the key steering and 7nm 10nm process node.

GlobalFoundries will also be given priority to taste IBM 30 billion dollars to get the results of research and development expenditures Opportunity (currently working with the New York State University Institute of Nanoscale Science and Engineering School of cooperation).

GlobalFoundries for application specific integrated circuit (ASIC) business also maintained the optimism, its plans to expand from the cable network storage and printing markets.

Finally, the transaction also allows GlobalFoundries can gain access to IBM’s RFSOI and SiGe semiconductor technology, which the company’s existing products, with a “highly complementary.”

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The overall semiconductor industry is trying to find a way, you do not need to convert from the silicon substrate and the use of indium gallium arsenide (InGaAs) higher electron mobility, including Intel (Intel) and Samsung (Samsung); and IBM have demonstrated how to use standard CMOS process technology to achieve these objectives.

Last month, IBM demonstrated a will of III-V (III-V) InGaAs compound onto the insulating coating of silicon (SOI) wafer technology, and now the company has another research team is claimed to have found a more good way to bulk silicon wafer using standard and produce indium gallium arsenide on silicon confirmed its feasibility.

IBM Research for Advanced Materials Department Manager, CMOS expert Jean Fompeyrine said: “We have massive SOI silicon wafers instead of the start, first put the oxide layer, and then make a trench below the silicon wafer; then its a grow roots of InGaAs ── this is a very high manufacturing procedures. ”

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Swiss researchers from CSEM (Swiss Center for Electronics and Microtechnology) in Neuchâtel developed the smallest ever complete camera system on a microchip with vision-in-Package (VIP). All elements of a camera system are united in less than one cubic centimeter of space.

The camera system with an optical component, a processor and a wireless transmitter is summarized in a single, easy to integrate component combination and is suitable for a wide range of applications. These include brand recognition, robot-assisted surgery, automatic driving assistance systems and even home security systems.

The concept and the complete package solution, which will be presented on 19 May at the Sensor + Test trade fair in Nuremberg for the first time, includes a camera, which is three times less than the current developments in the field of optical sensors and eight times smaller than what is currently installed in motor vehicles as driver assistance systems. The entire system is smaller than one cubic centimeter and about as small as a 10-euro cent coin.

To reduce the overall size of the system dramatically, the application research on techniques that have been developed for solar energy oriented. Based on the operating principle of a solar concentrator that concentrates sunlight and forwards, presented the application research of this principle of non-imaging optics upside down and developed a technique that reads interpreted under extremely cramped environments and even in direct contact with the object and correct images.

By the optical component is a Cortex-M4F microcontroller which is equipped with a Bluetooth transceiver, coupled, the entire low-energy system is autonomous and versatile. With dimensions of only 16.5 x 16.5 mm and a height of just 3 millimeters, the stand-alone system communicate via different ports with other elements and can be easily integrated into existing platforms, thanks to a software development.

The ease of integration and miniaturization of the VIP system will make it possible in the future application scenarios for optical technologies in the domestic sector, in the industry and to design smaller, more efficient and virtually invisible in medical technology.

Due to the fact that the automated optical monitoring become more and more place in everyday processes, the future potential applications for this miniature camera are extremely versatile: robot control, self-propelled applications, smart home applications, personal health monitoring, automation of agricultural production processes and product verification are just a few a few possible examples. The launch of the micro camera should take place before the end.

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A global leader in flash memory storage solutions provider SanDisk Corporation (NASDAQ: SNDK) today announced full support for VMware Virtual SAN ™ 6 flash architecture for business-critical applications and databases. The new entry-level server design uses four-node cluster deployed and expanded to 64 nodes, providing more than two million times the exchange capacity (TPM per minute for database exchange process and virtual desktop infrastructure (VDI) and other critical business applications such as ). The new Virtual SAN 6 architecture uses a SanDisk second generation Lightning® 12Gb / s Serial Attached SCSI (SAS) SSD and CloudSpeed ​​SATA SSD, highly reliable enterprise-class application performance provides caching and persistent storage layer.

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John Scaramuzzo, senior vice president and general manager of SanDisk Enterprise Storage Solutions, said: “SanDisk is always the VMware Virtual SAN strong partner, because we clearly see the ultra-converged storage solutions significantly reduce IT infrastructure complexity and degree potential associated storage costs. We have been trying to deepen partnership with VMware, and continue to introduce new solutions that enable our enterprise customers can maximize the use of resources of the data center. to participate for IO filtering VMware vSphere® the development of the API, a partner of VMware, is a great honor to do. ”

All Flash VMware Virtual SAN 6 infrastructure by helping IT to enhance service delivery speed, thus further enhancing the operational flexibility and productivity, improve customer satisfaction and business-critical applications, disaster recovery service levels. In addition, no purchase additional storage resources to accommodate peak load, but also effective in helping customers reduce capital expenditures. Combined with VMware solutions and SanDisk flash memory technology can also simplify data center storage infrastructure, reduce points of failure in order to achieve the simplified system management tasks, while reducing operating costs.

Charles Fan, senior vice president of storage and availability of VMware and general manager, said: “The new SanDisk flash full VMware Virtual SAN design for our mutual customers with a higher virtual machine (VM) performance density levels, greatly enhancing the scalability make SSD cost has been further improved .VMware designed to meet the requirements of the world’s mobile office and data center architecture for software-defined been specially optimized. By partnering with SanDisk Corporation, our VMware vSphere® and VMware Virtual SAN environment provides certification of Flash memory solutions, thereby helping customers improve efficiency, flexibility and IT resource utilization, thereby enhancing the competitiveness of enterprises. “

Diodes Incorporated (Diodes Incorporated) introduced a linear constant current LED driver AL5809, products using a robust double-joint PowerDI-123 package, providing more accurate affordable linear constant current LED driver solutions. AL5809 having up to 1.2W of power, 20ppm / ° C excellent temperature stability and high power supply rejection ratio, providing ± 5% tolerance over a wide temperature range, effective greatly simplify for LED light board, LED lights program strings and low current replaceable lamps and other products.

AL5809 temperature range of -40 ° C to + 125 ° C, the operating voltage range from 2.5V between the two joints to 60V, and offers a variety of fixed output current options, eliminating the external current set resistor. Fixed output current options PowerDI-123 package includes 15mA, 20mA, 30mA, 40mA, 50mA, 60mA, 90mA, 120mA and 150mA; another SOD-123 package, the current output options there 15mA, 20mA, 30mA, 40mA and 50mA .

AL5809 addition to being able to meet the circuit design requirements for streamlined linear regulator (such as eliminating the inductor or an external resistor), it also provides other functions as well as drive the low and high side of the LED light strings ability overtemperature protection. Compared to similar products on the market and discrete circuit design, this simple operation, material costs affordable compact LED driver can provide more accurate and more comprehensive performance.

Diodes Incorporated linear constant current LED driver AL5809 to ten thousand for bulk shipments, providing SOD-123, PowerDI-123 and high current 60-150mA PowerDI-123 variety of package options.

Samsung Electronics and the world’s top memory chip maker SK Hynix plans to invest 19 trillion won in 2015 for the development of the chip, the investment plan is higher than last year’s 17.7 trillion won investment funds chips. According to the US official said one hedge fund, Samsung Electronics and SK Hynix hope that through this 19 trillion won investment, improving product mix to adapt to market conditions, adjusting the supply and demand balance of the market.

It is reported that some hedge funds and investment institutions are optimistic about the future development of Samsung Electronics and SK Hynix. According to the investment plan, Samsung Electronics plans to invest 3.5 trillion won, SK Hynix plans to invest 5.5 trillion won. Samsung, an official said Samsung’s sales growth in 2015 will be reduced to a minimum. Samsung does not want to have an impact on its chip spending their overall spending levels. The official said that Samsung plans to flash-memory and processor chips restructuring, adjust product line is flexible.

Samsung’s chip in 2013 to R & D investment of 12.6 trillion won, has invested 1.385 billion won in 2012, 2011 has invested 1.303 billion won. SK Hynix is currently no plan to increase investment in the first half of 2015. For SK Hynix, the supply and demand is positive, the traditional enterprise server and PC demand remains strong.

According to a person familiar with SK Hynix officials said, SK Hynix plans to invest 300 billion won in research and development M14, the new plant will be equipped with new technology and thinner.

SK Hynix investment funds last year, about 4.7 trillion, which SK Hynix CEO, said the company this year will give priority to further strengthen the competitiveness of memory chips to improve the stability and quality of the product.

According to reports, SK Hynix 76% of global annual sales of DRAM chips, 21% NAD chip, 3% non-memory chip. According to the research firm’s data show, Samsung Electronics, SK Hynix, Micron Technology US market accounted for 93% of global chip.

Across multiple electronic applications, the world’s leading supplier of semiconductors, 32-bit microcontroller supplier STMicroelectronics (STMicroelectronics, referred to as ST) announced the STM32 Things Design Competition (STM32 Internet-of-Things Design Challenge) Europe, Middle East winners and Africa (EMEA) Division. The competition is designed to encourage things related inventions, sponsored by STMicroelectronics and its partners ARM, Farnell Element14, Würth Elektronik and Rubik’s Futuro Cube companies.

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Based STM32 family of microcontrollers energy efficiency, performance, large developer ecosystem and products worth about 100 contestants submitted things related applications. The design competition contestants inspired creativity, design and STMicroelectronics STM32 contain other components of Things products. STMicroelectronics products include: MEMS motion sensor, acoustic (acoustic) and environmental sensors; NFC Dynamic label (NFC dynamic tags); image processors and sensors; low power Bluetooth; low power RF transceiver (RF transceivers); broadband PLC chip (broadband power-line communication). Award-winning products to design innovative semiconductor products and the number of law intended for the score.

Two winning projects:

“Maja” Poland Krakow KNE AGH University of Science (KNE AGH University of Science and Technology) developed a wireless monitoring system hive (wireless hive-monitoring system). Automatic monitoring system based STM32 Nucleo development board, with motion sensors, acoustic sensors, temperature / humidity sensor and a weight sensor (weight sensor), through the GSM / GPRS modem to connect online database, you can create a local sensor networks.

“Blinker 2.0″ is the Creative Kids & Mentors teams from Kiev, Ukraine (Kiev) developed by the refrigerator food cold time monitoring system. The design is a subject called cold indicator (Cooler Blinker) small circuit board, the circuit board equipment STM32 microcontrollers, Bluetooth low energy (BLE, low-energy Bluetooth) module, a buzzer (buzzer), battery and green, yellow and red LED lights. Cooler Blinker is posted on the food’s smart tag, once activated, the shelf life of foods can be measured by different colors of light flashing prompt product safety. Blinker 2.0 is a complete ecosystem with a Cooler Blinkers, cloud database and remote monitoring of the state of mobile applications in food Cooler 1 2 3.

STMicroelectronics, Europe, Jacky Perdrigeat vice president of the Middle East and Africa, said: “Promoting the use of the entire region STMicroelectronics components to stimulate creativity, to meet the challenges brought about by the Internet of Things, is bound to achieve extraordinary STMicroelectronics R & D results. extensive product portfolio includes industry-leading semiconductor STM32 microcontrollers, sensors and communication technologies, as well as a rich ecosystem of partners, and development tools, and is ideal for networking applications. Competition appraisal results show that the import of other products STMicroelectronics STM32 ecosystem is important to include a new generation of creators that participate in the new industrial revolution, the youngest of developers, including technical communities provide a flexible, simple design development solutions. However, this is only just beginning, the recently released the world’s first ARM Cortex-M7 microcontroller STM32 F7 series further strengthens our leadership position, STMicroelectronics will continue to play a creative, continuous innovation enables developers to obtain better results. “

According to the latest market research firm Forrester Research report released by the wearable device market will usher in a breakthrough in 2015, users will achieve double the growth, while Apple Apple Watch will be leading this trend, the market for wearable brought new opportunities new challenges.

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Reports, Apple Watch next year will attract 10 million users. And compared to European consumers, the US consumers are more willing to use the wearable device, the ratio between the two was 32% and 45%.

For ordinary consumers, wearable device that is worn on the wrist watches and intelligent tracking health products, then clip on clothing accessories, wearing the device next to the ear, as well as so-called smart glasses. However, consumers are also different in different regions, in different parts of the US respondents talked about a variety of wearable computing devices, including smart jewelry, smart contact lenses, as well as intelligent tattoos.

While consumers are very interested in wearable devices, but its greater demand still comes from businesses. Analysts pointed out that with brands, retailers, sports stadiums, medical device companies, and other companies to develop new business models, and the use of related functions, wearable device market will usher in a new opportunity.

Survey shows that 68% of business decision-makers plan to give priority to develop a wearable device deployment strategy. For example, companies can use the secure site wearable device monitoring workers through smart watches with positioning capabilities to help managers real-time command out of employees, as well as through devices with video and camera technology to help inspectors work more easily.

Morgan Stanley is expected, in the most optimistic scenario, wearable device sales in 2020 will reach 1 billion, while the growth rate faster than the smartphone and tablet market broke out.